• Electronics and Telecommunications Trends
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• v.3 no.2
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• pp.116-133
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• 1988

ASIC (Application Specific Integrated Circuit)은 직역하면 응용특정 IC, 혹은 특정용도 IC로서 LSI시장의 조사회사인 Dataquest사가 '84년경부터 사용하기 시작한 말이다. ASIC이 최근 크게 주목을 끌고있는 것은, 반도체 사용자가 자신의 제품에 개성을 불어넣기 위해서는 범용IC를 사용해온 것으로는 기술적 우위성이 확보되지 않는다고 판단했기 때문에 주문형 LSI를 강하게 추진해 왔다는 것과 반도체 메이커도 메모리IC를 중심으로 한 범용IC시장의 부진, 더우기 날로 더해가는 반도체 시장의 시장쟁탈 및 무역마찰로 인해 ASIC 시장에로의 참여가 강화되어 왔다는 점 등을 들수있다. 집적화 기술은 매년 진보하여 지금은 100만개 이상의 트랜지스터를 집적할 수 있게 되었다. 따라서 지금까지 SSI/MSI를 사용해서 회로설계한 기능단위의 칩을 프린터 기판위에 조합시켜 시스팀을 구축해 왔으나, 앞으로는 하나의 칩위에 시스팀을 구성하는 시대로 변하고 있다. ASIC은 그 요청에 따라서 one-chip화의 개념에 따라서 만들어진 것으로서, 시장환경에 대단히 유익한 디바이스로 생각할 수 있다. 시스팀의 one-chip화의 실현결과 압도적으로 소형화, 경량화, 성자원화가 달성됨과 동시에 신뢰성 및 동작성능도 우수하게 되었다. ASIC기술은 현재 주류로 되어있는 게이트 어레이를 볼때, 개발비용은 크게 감소하여 개발기간도 논리회로가 완성된다면 3~4주 정도로 단축시킬수 있다. ASIC 설계에는 각 공정에 있어서 고도의 컴퓨터 지원설계가 채용되고 제조공정에서는 첨단의 프로세서 기술 등이 이용되므로 ASIC기술은 종합적인 첨단기술의 집약이라고 불러도 좋을것이다. 이러한 기술추세에 맞추어 전자통신 동향분석지 제3권 제1호(1988.3.)에 발표된 최신 ASIC기술동향의 후속편으로 ASIC에 관련된 중요용어 50개를 선정, 알파벳 순으로 나열하여 설명하였다.

• Korean Journal of Food Science and Technology
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• v.46 no.6
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• pp.665-670
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• 2014

We isolated twelve lignans and three terpenoids were isolated from the n-hexane fraction of Schisandra chinensis extract. Using spectroscopic data and comparison with available literature, the following compounds were identified: (1) wuweizisu C, (2) gomisin N, (3) deoxyschisandrin, (4) gomisin A, (5) schisandrin, (6) chamigrenal, (7) schisanlactone D, (8) methylgomisin O, (9) angeloylgomisin O, (10) (-)-gomisin $L_2$, (11) schisandronic acid, (12) (-)-gomisin $L_1$, (13) (+)-gomisin $K_3$, (14) gomisin J, and (15) tigloylgomisin H. Notably, this was the first finding that compound (8) was isolated from this plant. Each compound was evaluated for its in vitro cytotoxic activities toward HL-60 (human leukemia), HeLa (human cervical carcinoma), and MCF-7 (breast cancer) cell lines. Compounds (7), (8), and (9) exhibited strong cytotoxic effects on HL-60 ($IC_{50}$ 7.37, 6.60, and $8.00{\mu}M$, respectively), whereas compound (6) exhibited weak cytotoxicity towards MCF-7 ($IC_{50}$ $30.50{\mu}M$). In addition, compound (8) showed the strongest activity towards HeLa cells ($IC_{50}$ $1.46{\mu}M$).

• Journal of the Korean Institute of Telematics and Electronics
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• v.17 no.6
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• pp.24-27
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• 1980

본 논문에서는 J.Klapper와 E.J. Kratt[1]III에 의하여 제안된 저지연 FM검파기의 일반적인 왜곡해석을 Taylor[2] 반수전개법에 의하여 또한 상기의 저지연 FM검파기에서 사용한 RLC Notch 필터를 동 FM 검파기의 IC화를 고려하여 Twin-Tee RC 능동필터로 대치하고 예상되는 검파신호의 지연시간을 검토하였다.

• 한국초전도학회:학술대회논문집
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• v.11
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• pp.54-54
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• 2001

• Journal of the Korean Society of Fisheries and Ocean Technology
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• v.24 no.2
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• pp.83-93
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• 1988

Recent Experimental results show that the J integral can be effectively used to obtain a valid parameter for predicting plane strain and plane stress fracture. However, only a few research results have been reported for the effect of thickness where the plane strain state can not be assumed. A purpose of this study is to find the behavior of fracture touhness and tearing modulus varing the specimen thickness. The type of specimen in the present study is compact tension (CT). The thicknesses of the low carbon steel specimens that are used in the experiments are 5, 10, 15, 20 and 25mm. The measurement of crack length is taken by optical measurements method. From the study, the followings are found; 1) The fracture toughness and the tearing modulus which are obtained by using Yoon's and Simpson's formula show more conservative than that by using Rice's and Merkel's. 2) The fracture toughness is increase in specimen thickness which is reached 15mm. Beyond this thickness the fracture toughness is decreased in specimen thickness. 3) In the case of CT specimen with the thickness ranging from 5 to 25mm, the tearing modulus which is applied the same J integral equation is almost constant. 4) By using Yoon's formula, the correlation of the plane slress fracture toughness J sub(C) with specimen thickness B is expressed as the following formula. J sub(C)/J sub(IC)=1.7-15.1(B/W)+112.9(B/W) super(2) -301.3(B/W) super(3) +260.6(B/W) super(4)

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.11a
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• pp.241-241
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• 2007

We fabricated SmBCO coated conductors(CCs) on IBAD-MgO templates using co-evaporation method. IBAD-MgO templates consist of PLD-LMO/epi-MgO/IBAD-MgO/Ni-alloy and showed good in-plane texture of below FWHM 7 degree. Evaporation rates of Sm, Ba, and Cu were precisely controlled to get the optimum composition ratio after deposition process. To optimize the oxygen partial pressure of reaction region, wide range of the partial pressure was investigated from 1 mTorr to 15 mTorr. By reducing the oxygen partial pressure to 5mTorr, (103)grains in SmBCO layer have been increased. On the other hand, there were only (001)grains in SmBCO layer deposited at 15 mTorr $O_2$. Deposition temperature was also investigated from $600^{\circ}C\;to\;800^{\circ}C$ to make high Ic SmBCO CCs. SmBCO on IBAD MgO template showed that the Ic increased gradually at higher growth temperature to $800^{\circ}C$, which the highest Jc and Ic is $2.6\;MA/cm^2$ and 500 A/cm-w., respectively.

• Journal of Power System Engineering
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• v.11 no.1
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• pp.127-133
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• 2007

SG-365 steel is an important material and used for manufacturing a pressure vessel which the gas piping. In this investigation, the elastic plastic fracture toughness of this material is evaluated by the unloading compliance method according to the ASTM E813-97 and E1152-97 method on the smooth and side groove 1CT specimens. The effect of smooth and side groove is studied on the elastic plastic fracture toughness. The side grooved specimen is very useful in estimation of the $J_{IC}$. It is much easier than the smooth specimen to the onset of the ductile tearing by the R curve method. Besides, it improves the accuracy of toughness values, decreases a phenomenon of the tunneling and shear lip by the side groove.

• Electronics and Telecommunications Trends
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• v.3 no.3
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• pp.64-75
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• 1988

본 고에서는 점차 고기능화 고속화되고 있는 모뎀의 기술동향을 분석하고 고속모뎀에 필요한 여러가지 복잡한 기능들이 하나의 칩으로 구현되고 있는 모뎀용 IC의 기술개발동향을 파악하고자 하였다.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2012.10a
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• pp.361-362
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• 2012

• Nuclear Engineering and Technology
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• v.54 no.7
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• pp.2586-2591
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• 2022

In the present work, we have irradiated the DI-BSCCO superconducting tapes with the 100 keV deuterium ions to investigate the effect of ion irradiation on their critical current (Ic). The damage simulations are carried out using the binary collision approximation method to get the spatial distribution and depth profile of the damage events in the high temperature superconducting (HTS) tape. The point defects are formed near the surface of the HTS tape. These point defects change the vortex profile in the superconducting tape. Due to the long-range interaction of vortices with each other, the Ic of the tape degrades at the 77 K and self magnetic field. The radiation dose of 2.90 MGy degrades the 44% critical current of the tape. The results of the displacement per atom (dpa) and dose deposited by the deuterium ions are used to fit an empirical relation for predicting the degradation of the Ic of the tape. We include the dpa, dose and columnar defect terms produced by the incident particles in the empirical relation. The fitted empirical relation predicts that light ion irradiation degrades the Ic in the DI-BSCCO tape at the self field. This empirical relation can also be used in neutron irradiation to predict the lifetime of the DI-BSCCO tape. The change in the Ic of the DI-BSCCO tape due to deuterium irradiation is compared with the other second-generation HTS tape irradiated with energetic radiation.