• Journal of the Korean Vacuum Society
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• v.7 no.1
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• pp.17-23
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• 1998

$Pb(Fe_{0.5}Nb_{0.5}O_3(PFN)$ thin films were prepared by rf magnetron co-sputtering method on $SiO_2/Si$, ITO/glass, and $Pt/Ti/SiO_2/Si$ substrates and post-annealed at the $N_2$ atmosphere by RTA(rapid thermal annerling). The degree of crystallinity of PFN films was identified on various substrates. Electrical properties of PFN films was characterized for $Pt/PFN/Pt/Ti/SiO_2/Si$ structure. The composition of PFN films was estimated by EPMA (electron probe micro analysis). PFN films would be crystallized better to perovskite phase on ITO/glass substrate than $SiO_2/Si$ substrate. This may be induced by the deformation of Pb deficient pyrochlore phase due to Pb diffusion into $SiO_2/Si$ substrate. PFN films on $Pt/Ti/SiO_2/Si$ substrate. PFN films with 5-10% Pb excess were crystallized to perovskite phase from $500^{\circ}C$ temperature. In summary, we show that Pb composition and annealing temperature were critically influenced on crystallinity to perovskite phase. When PFN film with 17% Pb excess was annealed at $600^{\circ}C$ at the $N_2$ atmosphere for 300kV/cm and 88. Its remnant polarization coercive field $2.0 MC/cm^2$ and 144kV/cm, respectively.

• Journal of Sensor Science and Technology
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• v.9 no.3
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• pp.177-181
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• 2000

The tunneling current is exponentially dependent on the separation gap between a pair of conductors. The detection of displacement can be, therefore, carried out by measurment of a variation in the tunneling current. In this experiment, we fabricated pyramid-type silicon tunneling devices in which a tunneling current flow between a micro-tip and $Si_3N_4$ thin film membrane. A MEMS process was used for the fabrication of the tunneling devices. The micro-tips were formed on Si wafers by undercutting a differently oriented square of $SiO_2$ with KOH. The stiffness of the $Si_3N_4$ films were observed and the model for the stiffness calculation, which is useful in predicting the stiffness even when the stiffness ranges beyond the scope of the normal experimental condition, was suggested.

• Journal of Electrical Engineering and information Science
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• v.3 no.2
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• pp.239-244
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• 1998

Piezoelectric pressure sensors and pyroelectric infrared detectors based on ZnO thin film have been integrated with GaAs metal-semiconductor field effect transistor (MESFET) amplifiers. Surface micromachining techniques have been applied in a GaAs MESFET process to form both microsensors and electronic circuits. The on-chip integration of microsensors such as pressure sensors and infrared detectors with GaAs integrated circuits is attractive because of the higher operating temperature up to 200 oC for GaAs devices compared to 125 oC for silicon devices and radiation hardness for infrared imaging applications. The microsensors incorporate a 1${\mu}$m-thick sputtered ZnO capacitor supported by a 2${\mu}$m-thick aluminum membrane formed on a semi-insulating GaAs substrate. The piezoelectric pressure sensor of an area 80${\times}$80 ${\mu}$m2 designed for use as a miniature microphone exhibits 2.99${\mu}$V/${\mu}$ bar sensitivity at 400Hz. The voltage responsivity and the detectivity of a single infrared detector of an area 80${\times}$80 $\mu\textrm{m}$2 is 700 V/W and 6${\times}$108cm$.$ Hz/W at 10Hz respectively, and the time constant of the sensor with the amplifying circuit is 53 ms. Circuits using 4${\mu}$m-gate GaAs MESFETs are fabricated in planar, direct ion-implanted process. The measured transconductance of a 4${\mu}$m-gate GaAs MESFET is 25.6 mS/mm and 12.4 mS/mm at 27 oC and 200oC, respectively. A differential amplifier whose voltage gain in 33.7 dB using 4${\mu}$m gate GaAs MESFETs is fabricated for high selectivity to the physical variable being sensed.

• Journal of the Microelectronics and Packaging Society
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• v.24 no.3
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• pp.7-11
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• 2017

In this paper, we have studied the characteristics of NAND Flash memory in SONOS Poly-Si Thin Film Transistor (Poly-Si TFT) device. Source/drain junctions(S/D) of cells were not implanted and selective transistors were located in the end of cells. We found the optimum conditions of process by means of the estimation for the doping concentration of channel and source/drain of selective transistor. As the doping concentration was increased, the channel current was increased and the characteristic of erase was improved. It was believed that the improvement of erase characteristic was probably due to the higher channel potential induced by GIDL current at the abrupt junction. In the condition of process optimum, program windows of threshold voltages were about 2.5V after writing and erasing. In addition, it was obtained that the swing value of poly Si TFT and the reliability by bake were enhanced by increasing process temperature of tunnel oxide.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1999.11a
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• pp.343-346
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• 1999

We have investigated the dielectric and electrical characteristics of palrnitic acid(PA), stearic acid(SA) and arachidic acid(AA) Langmuir-Blodgett(LB) films because these fatty acid systems have a same hydrophilic group and a different hydrophobic one(alky1 chain lqngth). The dielectric characteristics such as the capacitance-frequency(C-F) characteristics and the dielectric dispersion and absorption characteristics of PA, SA and AA through-plane were measured. In the result, the relative dielectric constants of PA, SA and AA LB films were about 3.0-4.6, 2.7-4.1 and 2.4-3.8, respectively. The relative dielectric constants were decreased in proportion to the chain length of alkyl group. Also, the dielectric dispersion and absorption of each fatty acid LB films have arisen from the dipole polarization in the range of $10^4~10^5[Hz]. And, the conductivity of PA, SA and AA LB films obtained from I-V characteristics were about $9{\times}10^{-14}, 3{\times}10^{-l4} and 5{\times}10^{-15}[S/cm], respectively. These results have shown the insulating materials and could control the conductivity by changing the length of alkyl group. Also, we have confirmed that the barrier height of fatty acid systems were about 1.32-1.40[eV] and the dielectric constant were about 3.0-4.2. These values were almost the same ones obtained from dielectric characteristics.

• Journal of the Korean Applied Science and Technology
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• v.8 no.2
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• pp.105-114
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• 1991

In relation to the preparation of Langmuir-Blodgett thin film, four kinds of N-alkylpyridiniurn bromide were synthesized. The values of surface tensions of these materials, measured with a Traube stalagmometer, gave the relationship between the critical micells hydrophobic radical and between CMC and temperature. Values of thermodynamic properties(${\Delta}H^0_m,\;{\Delta}S^0_m,\;{\Delta}G^0_m,$) for the formatoin of micelle were also obtained. Experiments gave the following results; at the temperature range between 40 and 60$^{\circ}C, CMC of Hexadecyl-, Octadecyl-, Eicosyl-, and Docosyl-Pyridinium Bromide were $7.64{\times}10^{-4}{\sim}9.13{\times}10^{-4},\;3.85{\times}10^{-4}{\sim}4.60{\times}10^{-4},\;2.00{\times}10^{-4}{\sim}2.39{\times}10^{-4},\;and\;1.07{\times}10^{-4}{\sim}1.28{\times}10^{-4}$ mol/l, respectively. Surface tension, ${\Gamma}_{CMC}$, of those were 33.49${\sim}$36.00, 34.78${\sim}$37.61, 35.49${\sim}$37.61 and 38.76${\sim}$55.80 dyne/cm, respectively, The relationship between CMC and the mumber of carbon atoms in the hydrophobic radical, N was expressed as follows : Log(CMC)=A-BN where A and B are constants. At the temperature range between 40 and 60$^{\circ}C$, the change of Gibbs evergy (${\Delta}G_m$) for one methylene group ($-CH_2-$) were -0.65RT, respectively, The minus values of enthalpy change (${\Delta}H_m$) suggest that the formation of micelle is exothermic. Additionally, the overall increase in the entropy change (${\Delta}S_m$) with respect to the temperature increase suggests that the formation of micelle is attained by a exothermic enthalpy directed process.

• Transactions of the Korean hydrogen and new energy society
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• v.3 no.2
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• pp.55-62
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• 1992

To improve the MCFC performance it is important to distingush between polarization losses occuring in the individual electrodes and other components. In this study a current interruption technique has been applied to a MCFC unit cell having a reference electrode to separately study the contributions of IR loss and other polarization losses. At a current density of $150mA/cm^2$ the IR-free polarization of a Ni anode was about 60mV while that of a NiO cathode was 130mV and the Ohmic loss of the cell was as large as 170mV suggesting that both the cathode and the cell structure need further improvement. The thin-film electrode model was used to simulate the performance of the electrodes. Both andoe data and cathode data were successfully fitted.

• 한국정보디스플레이학회:학술대회논문집
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• 2009.10a
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• pp.421-427
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• 2009

We successfully fabricated 4.7-inch organic thin film transistors array with $640{\times}480$ pixels on flexible substrate. All the processes were done by photolithography, spin coating and ink-jet printing. The OTFT-Electrophoretic (EP) pixel structure, based on a top gate OTFT, was fabricated. The mobility, ON/OFF ratio, subthreshold swing and threshold voltage of OTFT on flexible substrate are: 0.01 ^2/V-s, 1.3 V/dec, 10E5 and -3.5 V. After laminated the EP media on OTFT array, a panel of 4.7-inch $640{\times}480$ OTFT-EPD was fabricated. All of process temperature in OTFT-EPD is lower than $150^{\circ}C$. The pixel size in our panel is $150{\mu}m{\times}150{\mu}m$, and the aperture ratio is 50 %. The OTFT channel length and width is 20 um and 200um, respectively. We also used OTFT to drive EP media successfully. The operation voltages that are used on the gate bias are -30 V during the row data selection and the gate bias are 0 V during the row data hold time. The data voltages that are used on the source bias are -20 V, 0 V, and 20 V during display media operation.

• 한국정보디스플레이학회:학술대회논문집
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• 2009.10a
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• pp.998-1001
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• 2009

A new flexible TFT backplane structure with improved mechanical reliability is proposed. Amorphous indium-gallium-zinc-oxide (a-IGZO) thin film transistors based on this structure have been fabricated on a polyimide substrate, and the resultant mechanical durability has been evaluated in a cyclic bending test. The panel can withstand 10,000 bending cycles at a bending radius of 5 mm without any noticeable TFT degradation. After 10K bending cycles, the change of threshold voltage, mobility, sub-threshold slope, and gate leakage current were only -0.22V, -0.13$cm^2$/V-s, -0.05V/decade, and $-3.05{\times}10^{-13}A$, respectively.

• Korean Journal of Materials Research
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• v.3 no.2
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• pp.166-174
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• 1993

Abstract The crack resistance of PSG(Phosphosilicate Glass) and PE-SiN(Plasma Enhanced CVD S${i_2}{N_4}$)films deposited on aluminium thin films on Si substrate was analyzed in this study. PSG was deposited by AP-CVD and PE- SiN by PE-CVD. All the films underwent repeated heat cycles at 45$0^{\circ}C$for 30 min. Crack formation and development were examined between each heat cycle. The crack behavior was found to be closely related to the stresses in the films. The stress induced by the difference in thermal expansion behavior between the passivation layers and underlying aluminum film may cause the crack. Crack resistance decreases as the thickness of PSG films increases due to the high tensile stress of the films. Phosphorus in the PSG films releases tensile stress and consequently the stress of the films tends to show compressive stress. As a result, crack resistance increased as the concentratin of P in the PSG films increased. Crack resistance in the PE-SiN films also increased with compressive stress. An experimental model to predict crack generation in the PSG and PE-SiN films during heat cycle was suggested.