• Journal of the Korean Institute of Telematics and Electronics A
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• v.28A no.12
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• pp.31-38
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• 1991

The current-voltage characteristics at annealed Be-Cu alloy(1.8-2 wt% Be, 0.2 wt% Co+Ni) interfaces have been studied by means of the cyclic voltammetric method. The specimens were annealed in nitrogen gas($N_{2}$) furnace at 36$0^{\circ}C$ for 1.5 hours. After annealing, the vickers hardness(HV) was increased from 210 to 385. The used solutions were distilled water(H$_{2}$O), 10$^{-3}M\;CsNO_{2},10^{-2}M\;KCl,10^{-2}M\;KOH,10^{-4}M\;H_{2}SO_{4}$ aqueous electrolytes, and ethylalcohol ($C_{2}H_{5}OH$), etc. The cyclic voltammograms showed significant current-voltage characteristics between the annealed and unannealed specimens at the same conditions. The age hardening and the related surface potential barrer and dissolution effects have been observed during the whole experimental process. The dissolution process of annealed Be-Cu alloys was effectively retarded by the age hardening phenomenon. The age hardening effect also raised the surface potential barrier of Be-Cu alloys. The interfacial phenomena of Be-Cu alloys seem to be one of good models for understanding the activation process.

• Journal of Conservation Science
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• v.30 no.4
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• pp.457-466
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• 2014

Rigorous analysis was performed to identify the structure and materials of the murals to study techniques used on mural tombs of ancient Daegaya era(6th century). The murals were painted by applying mortar on the walls and the ceiling after building a stone chamber and creating ground layers on mortar layers. Mud was applied on most of the mortar layers on four sides of the walls except the ceiling. Sand was not used in mortar but was made of materials with pure calcium substances. In addition, shells in irregular sizes with incomplete calcination were mixed; and the mortar's white powder was inferred as lime obtained by calcination of oyster shells. Kaolinite($Al_2Si_2O_5(OH)_4$) was used in the ground layer, Cinnabar(HgS) was used for red pigment, Malachite($Cu_2CO_3(OH)_2$) for green and Lead white($PbCO_3{\cdot}Pb(OH)_2$) for white. Mud plaster was applied on the mortar and was composed thinly and densely using clayey of particle size smaller than that of medium sand. It was assumed that the finishing was for repair after long time had passed since the mortar layer came off. Using lime made with oyster shells as mortar is unprecedented in ancient Korean mural tombs and its durability was very poor, suggesting that Gaya's mortar production technique was relatively behind compared to that of Koguryo's in the same era.

• Korean Journal of Materials Research
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• v.15 no.8
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• pp.503-507
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• 2005

Microstructure and wear behavior of A1203-based nanocomposites with Cu and Ni-Co dispersions were investigated. $Al_2O_3/Cu$ and $Al_2O_3/Ni-Co$ nanocomposites were fabricated by hydrogen reduction and sintering method using metal oxide and metal nitrates. The nanocomposites showed increased mechanical properties compared with monolithic $Al_2O_3$. In particular, high toughness and hardness were measured for the $Al_2O_3/Ni-Co$ nanocomposite consolidated by spark plasma sintering. A minimum value of wear coefficient comparable to the monolithic $Al_2O_3$ was obtained for $Al_2O_3/Ni-Co$ nanocomposite. Wear behavior is discussed in terms of microstructure and mechanical properties of nanocomposites

• Korean Chemical Engineering Research
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• v.49 no.5
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• pp.530-534
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• 2011

The synthesis of dimethyl carbonate by liquid phase oxidative carbonylation of methanol was studied under batch reaction system. Reaction factors such as effect on various metals, anion containing in copper catalyst, temperature, carbon monoxide and oxygen molar ratio and copper content were investigated. In particular $CuCl_2{\cdot}2H_2O$ showed the excellent of the methanol conversion 65.2%, DMC selectivity 96.6% reaction condition under 1.0 g, $150^{\circ}C$, MeOH/CO/$O_2$=0.2/0.215/0.05 (molar ratio). $CuCl_2$ led to corrosion of the reactor. Thus, a new catalyst system using supports was investigated to resolve these corrosion problem. Influence on various supports were examined and copper catalyst supported on zeolite Y showed the most excellent activity on the formation of dimethyl carbonate. The amount of Fe dissolved during the reaction using ICP-AES (Inductively Coupled Plasma-Atomic Emission Spectrometer) was compared with catalysts, calcined Cu/zeolite Y showed the lower value below 5% than $CuCl_2-2H_2O$.

• KSBB Journal
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• v.11 no.2
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• pp.173-180
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• 1996

The contamination of the environment by heavy metals results in a serious public health problem due to the toxicity of those pollutants even at low concentrations. Microorganisms may be used to remediate wastewaters contamlialtd with heavy metals. The waste S. cerevisiae is an inexpensive readily available source of biomass for bioremediation of wastewater. S. cerevisiae was investigated for their ability to absorb Pb. The crushed biomass of S. cerevisiae exhibited higher Pb uptake capacity than the living S. cerevisiae and the sterilized S. cerevisiae. At the same metal concentration, metal uptake per unit concentration or adsorbent decreased when the biomass concentration rises. The order of the biosorption capacity of the living S. cerevisiae was Pb>Cu>Cd=Co>Cr. When S. cerevisiae was pretreated with 0.1 M NaOH, Pb uptake was increased by 150 percent and 0.1 M HC1, 0.1 M $H_2S_O4$ solutions were efficient in the desorption of Pb. The sorption equilibrium of Pb ions can be described by the Freundlich and Langmuir models.

• Journal of the Korean Applied Science and Technology
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• v.32 no.1
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• pp.78-84
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• 2015

The purpose of this study is to evaluate the removal efficiency of phosphorus from synthetic waste water by reduction and oxidation reaction of Cu-Zn metal alloy. Cu-Zn metal alloy applied in this study is composed of 40% of Zn and 60% of Cu, which is so called Muntz metal. And the fibrous type of metal alloy has approximately $200{\mu}m$ of thickness. Metal is oxidized in an aqueous solution to generate electron and metal ion. The mechanism of phosphate treatment is co-precipitation of metal ion and phosphorous ion at various pH and temperature. The treatment efficiency showed the maximum at a one cycle treatment. This result means that the surface area of reaction material is sufficient enough to get reaction equilibrium. Experiment is conducted at various pH from 5 to 9, and showed the maximum efficiency at pH 8. Phosphorous is dominated as a type of $H_2PO_4{^-}$ and $HPO_4{^{2-}}$ at this pH condition. We could not consider the temperature effect independently, because phosphorous removal efficiency showed such a complex mechanism. We could get high efficiency at lower temperature in this research.

• Korean Journal of Materials Research
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• v.23 no.11
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• pp.661-665
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• 2013

We investigated the characteristics of electroless plated Cu films on screen printed Ag/Anodized Al substrate. Cu plating was attempted using neutral electroless plating processes to minimize damage of the anodized Al substrate; this method used sodium hypophosphite instead of formaldehyde as a reducing agent. The basic electroless solution consisted of $CuSO_4{\cdot}5H_2O$ as the main metal source, $NaH_2PO_2{\cdot}H_2O$ as the reducing agent, $C_6H_5Na_3O_7{\cdot}2H_2O$ and $NH_4Cl$ as the complex agents, and $NiSO_4{\cdot}6H_2O$ as the catalyser for the oxidation of the reducing agent, dissolved in deionized water. The pH of the Cu plating solutions was adjusted using $NH_4OH$. According to the variation of pH in the range of 6.5~8, the electroless plated Cu films were coated on screen printed Ag pattern/anodized Al/Al at $70^{\circ}C$. We investigated the surface morphology change of the Cu films using FE-SEM (Field Emission Scanning Electron Microscopy). The chemical composition of the Cu film was determined using XPS (X-ray Photoelectron Spectroscopy). The crystal structures of the Cu films were investigated using XRD (X-ray Diffraction). Using electroless plating at pH 7, the structures of the plated Cu-rich films were typical fcc-Cu; however, a slight Ni component was co-deposited. Finally, we found that the formation of Cu film plated selectively on PCB without any lithography is possible using a neutral electroless plating process.

• Journal of the Korea Furniture Society
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• v.19 no.5
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• pp.358-364
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• 2008

Wood-inorganic material composite (WIC) was prepared by impregnating wood with copper sulfate ($CuSO_4\;5H_2O$) solution and by immersed wood in sodium carbonate($Na_2CO_3$) solution in order to introduce insoluble copper compounds {copper carbonate hydroxide, $CuCO_3\;Cu(OH)_2$} into the wood to give fungicidal effects in treated-wood. The weight percent gains (WPGs) of treated wood reached maximum value by impregnation of 20% copper sulfate solution and immersion in about 15% sodium carbonate solution for 24 hrs. Inorganic substances were present mainly in the lumina and cross-field pitting of tracheides. These substances were proved to be the insoluble copper carbonate hydroxide against water by the energy dispersive X-ray analyzer in conjunction with a scanning electron microscope (SEM-EDXA). The treated specimens showed high preservative effectiveness because the weight losses were hardly occurred by the fungi degradation test.

• Progress in Superconductivity
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• v.6 no.2
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• pp.129-132
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• 2005

The formation behavior of $YBa_2Cu_3O_{7-x}$(Y123) and CuO phases in the heat-treated Cu-sheathed YBCO thick films was studied. The thick films were prepared by screen-printing method using $BaCO_3$ and Y211 powders on Cu tapes. The screen-printed thick films were placed at the center of the tube furnace, heated to $930^{\circ}C$ in air atmosphere and then maintained at the temperature for 60 sec - 300 sec. The microstructure and phases formed in the thick films were investigated by using optical microscope, X-ray diffraction (XRD) and SEM image analysis. During the heat treatment, partial melting occurred rapidly in the printed layers by peritectic reaction between CuO and precursor powders, and then YBCO superconducting phases nucleated from the Cu tapes and grew in a form of thick films.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.3
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• pp.51-56
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• 2015

It has been used various pad finish materials to enhance the reliability of solder joint and recently Electroless Ni Electroless Pd Immersion Gold (the following : ENEPIG) pad has been used more than others. This study is about reliability according to being used in commercial Electrolytic Ni pad and ENEPIG pad, and was observed behavior of various Cu contents. After reflow, the inter-metallic compound (IMC) between solder and pad is composed of $Cu_6Sn_5$ (Ni substituted) by using EDS, and in case of ENEPIG, between IMC and Ni layer was observed the dark layer ($Ni_3P$ layer). Additional, it could be controlled the thickness of dark layer according to Cu contents. Investigated the different fracture mode between electrolytic Ni and ENEPIG pad after drop shock test, in case of soft Ni, accelerated stress propagated along the interface between $1^{st}$ IMC and $2^{nd}$ IMC, and in case of ENEPIG pad, accelerated stress propagated along the weaken surface such as dark layer. The unstable interface exists through IMC, pad material and solder bulk by the lattice mismatch, so that the thermal and physical stress due to the continuous exterior impact is transferred to the IMC interface. Therefore, it is strongly requested to control solder morphology, IMC shape and thickness to improve the solder reliability.