• Journal of Welding and Joining
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• v.10 no.4
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• pp.213-221
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• 1992

Al$_{2}$O$_{3}$ ceramic coating layer by gas flame spraying was very porous, therefore it could not have wear and corrosion resistance at all. To get a dense and strong coating layer, a method to infiltrate an alloy into the pores of $Al_{2}$O$_{3}$ ceramic coating was investigated. Cu-Ti alloys, which had good wettability and reactivity with $Al_{2}$O$_{3}$ ceramic, were examined for infiltration. Infiltration of the alloys was performed in vacuum at 1100.deg.C. The melt of Cu-50 at % Ti alloy was well penetrated through the porous $Al_{2}$O$_{3}$ coating and tightly sealed the pores, unbounded area and microcracks in the coating. The alloy melt in the pores reacted with $Al_{2}$O$_{3}$ ceramic to produce a suboxide phase, Cu$_{2}$Ti$_{4}$O. This composite layer which was composed of $Al_{2}$O$_{3}$ and Cu$_{2}$Ti$_{4}$O phase had good microstructure and wear and corrosion resistance. Additionally, microstructures at interfaces between coating layers were greatly improved owing to the effect of vacuum heat treating.

• Transactions of Materials Processing
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• v.7 no.5
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• pp.465-473
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• 1998

The effect of alloying elements of Ag-Cu-Zr-X brazing alloy on the microstructure and the bond strength of $Al_2O_3/Ni-Cr$ brazed steel joint was investigated. The reaction layer, $ZrO_2$ (a=5.146 ${\AA}$ , b=5.213 ${\AA}$ , c=5.311 ${\AA}$ )was formed at the interface of $Al_2O_3/Ni-Cr$ steel joint by the redox reaction between alumina and Zr. The addition of An and Al to the Ag-Cu-Zr brazing alloy gave rise to changes in the thickness of the reaction product layer and the morphology of the brazement. Sn caused the segregation of Zr was decreased b Al the $ZrO_2$ layer formed at the Ag-Cu-Zr-Al alloy was thinner than that of $ZrO_2$ formed at the Ag-Cu-Zr-An alloy. The fracture shear strength was strongly dependent on the microstructure of the brazement. Brazing with Ag-Cu-Zr-Sn alloy resulted in a better bond strength than with Ag-Cu-Zr or Ag-Cu-Zr-Al alloy.

• Proceedings of the KWS Conference
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• 1994.10a
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• pp.169-172
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• 1994

• Journal of Korean Society of Environmental Engineers
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• v.22 no.4
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• pp.671-678
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• 2000

Reaction characteristics of simultaneous removal of SOx and NOx have been investigated in a thermogravimetric analyzer and tubular fixed bed reactor using the $CuO/{\gamma}-Al_2O_3$ sorbent/catalyst. Sulfur removal capacity of $CuO/{\gamma}-Al_2O_3$ sorbent/catalyst is largely enhanced above both the temperature of $450^{\circ}C$ and the loading of 6wt% due to the participation of alumina support in a sulfation reaction. The NO reduction efficiency of 8wt% $CuO/{\gamma}-Al_2O_3$ sorbent/catalyst shows the maximum value at $370^{\circ}C$ and then decreases with the increase of reaction temperature due to the oxidation of $NH_3$ gas. The presence of sulfate on the surface of sorbent/catalyst enhances the optimum reaction temperature showing the maximum deNOx efficiency. In the simultaneous removal of SOx and NOx at $250^{\circ}C$. deNOx activity of $CuO/{\gamma}-Al_2O_3$ sorbent/catalyst is rapidly decreased due to the formation of ammonium salts such as $NH_4HSO_4$. In the simultaneous removal reaction of SOx and NOx, the optimum temperature showing the maximum deNOx efficiency increases to $400^{\circ}C$ due to the presence of $SO_2$ gas.

• Journal of the Korean Society for Heat Treatment
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• v.22 no.3
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• pp.149-154
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• 2009

Dense $5Cu_{0.6}Fe_{0.4}-Al_2O_3$ composite was consolidated from mechanically synthesized powders by pulsed current activated sintering method within 1 min. $5Cu_{0.6}Fe_{0.4}-Al_2O_3$ powder was synthesized from 3CuO and 2FeAI using the high energy ball milling. Dense $5Cu_{0.6}Fe_{0.4}-Al_2O_3$ with relative density of up to 95% was produced under simultaneous application of a 80 MPa pressure and the pulsed current. Mechanical properties and grain size of the composite were investigated.

• Journal of Korea Foundry Society
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• v.17 no.5
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• pp.480-487
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• 1997

Particle reinforced metal matrix composites(MMCs) via a centrifugal spray-cast deposition(CSD) process were fabricated by injecting second phase particles($Al_2O_3$<40${\mu}m$, W<17.3${\mu}m$) into copper melt on the atomizing disc. Compositing modes were investigated by combining microstructures and mathematical modeling between Cu droplets and the reinforced particles injected. The $Cu/W_P$ powders were shown that the W particles penetrate and get embedded in the Cu droplets. It is considered that the W particles composite preferentially in Cu melt on the atomizing disc. On the other hand, the $Al_2O_3$, particles did not penetrate into the Cu droplets on the atomizing disc but get attached in surface of Cu droplets during the flight. It is considered that the compositing may be attained in the flight distance which the relative velocity between Cu droplet and $Al_2O_3$, particle is maximum. The microstructure of the $Cu/W_P$ and the $Cu/(Al_2O_3)_p$ composite preform was strongly influenced by compositing modes of droplets, and after subsequent deposition it was comprised as it is called the dispersed type and the cell type of microstructure, respectively.

• Journal of Korea Foundry Society
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• v.5 no.3
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• pp.19-26
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• 1985

This study has been carried out to examine into wettability of Cu-5%Sn alloy in $Al_2O_3$, MgO, $SiO_2$ and graphite, respectively and investigated into the change in macrostructure of Cu-5%Sn alloy according to kind and mixing rate of mold-coating. The results obtained from the experiment are summerized as follows; 1. Cu Cu-5%Sn alloy, wettabilities of $Al_2O_3$ and MgO were good, on the other hand, wettabilities of $SiO_2$ and graphite were bad. 2. The fine equiaxed zone was created because of the role of $Al_2O_3$ and MgO as preferential nucleation sites. 3. Notwithstanding change of mixing rate of $SiO_2$ in mold coating the equixed zone was not created. 4. The area of equiaxed zone was varied according to mixing rate in the case of using $Al_2O_3$ and MgO in mold-coating.

• Korean Journal of Materials Research
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• v.23 no.1
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• pp.67-71
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• 2013

Porous $Al_2O_3$ dispersed with nano-sized Cu was fabricated by freeze-drying process and solution chemistry method using Cu-nitrate. To prepare porous $Al_2O_3$, camphene was used as the sublimable vehicle. Camphene slurries with $Al_2O_3$ content of 10 vol% were prepared by milling at $50^{\circ}C$ with a small amount of oligomeric polyester dispersant. Freezing of the slurry was done in a Teflon cylinder attached to a copper bottom plate cooled to $-25^{\circ}C$ while unidirectionally controlling the growth direction of the camphene. Pores were subsequently generated by sublimation of the camphene during drying in air for 48 h. The green body was sintered in a furnace at $1400^{\circ}C$ for 1 h. Cu particles were dispersed in porous $Al_2O_3$ by calcination and hydrogen reduction of Cu-nitrate. The sintered samples showed large pores with sizes of about $150{\mu}m$; these pores were aligned parallel to the camphene growth direction. Also, the internal walls of the large pores had relatively small pores due to the traces of camphene left between the concentrated $Al_2O_3$ particles on the internal wall. EDS analysis revealed that the Cu particles were mainly dispersed on the surfaces of the large pores. These results strongly suggest that porous $Al_2O_3$ with Cu dispersion can be successfully fabricated by freeze-drying and solution chemistry routes.

• Korean Chemical Engineering Research
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• v.55 no.2
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• pp.156-162
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• 2017

CuO(x)/0.3Al-0.7Ce catalysts with different CuO loadings (x = 2~20 wt%) were prepared by impregnation method and investigated the effects of CuO loadings on the low temperature CO oxidation. Of the used catalysts, the CuO(10)/0.3Al-0.7Ce catalyst showed the highest catalytic performance in the absence or presence of water vapor. In the presence of water vapor, the catalytic performance was drastically decreased, with a temperature of 50% CO conversion ($T_{50%}$) shifted to higher temperature by $50^{\circ}C$ compared to the those in dry conditions because of the competitive adsorption of water vapor on the active sites. The copper metal surface area calculated from $N_2O$-titration analysis and the oxygen capacity from CO-pulse experiments were increased with the CuO loadings and showed a maximum at 10 wt%CuO/0.3Al-0.7Ce catalyst. These trends are in good agreement with the tendency of $T_{50%}$ of the catalysts. From these characteristic aspects, it could be deduced that the catalytic performance was closely related to the oxygen capacity and the copper metallic surface area.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.02a
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• pp.118-118
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• 2011

The Nano-Floating Gate Memory(NFGM) devices with ZnO:Cu thin film embedded in Al2O3 and AlOx-SAOL were fabricated and the electrical characteristics were evaluated. To further improve the scaling and to increase the program/erase speed, the high-k dielectric with a large barrier height such as Al2O3 can also act alternatively as a blocking layer for high-speed flash memory device application. The Al2O3 layer and AlOx-SAOL were deposited by MLD system and ZnO:Cu films were deposited by ALD system. The tunneling layer which is consisted of AlOx-SAOL were sequentially deposited at $100^{\circ}C$. The floating gate is consisted of ZnO films, which are doped with copper. The floating gate of ZnO:Cu films was used for charge trap. The same as tunneling layer, floating gate were sequentially deposited at $100^{\circ}C$. By using ALD process, we could control the proportion of Cu doping in charge trap layer and observe the memory characteristic of Cu doping ratio. Also, we could control and observe the memory property which is followed by tunneling layer thickness. The thickness of ZnO:Cu films was measured by Transmission Electron Microscopy. XPS analysis was performed to determine the composition of the ZnO:Cu film deposited by ALD process. A significant threshold voltage shift of fabricated floating gate memory devices was obtained due to the charging effects of ZnO:Cu films and the memory windows was about 13V. The feasibility of ZnO:Cu films deposited between Al2O3 and AlOx-SAOL for NFGM device application was also showed. We applied our ZnO:Cu memory to thin film transistor and evaluate the electrical property. The structure of our memory thin film transistor is consisted of all organic-inorganic hybrid structure. Then, we expect that our film could be applied to high-performance flexible device.----못찾겠음......