• Journal of the Korean Ceramic Society
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• v.27 no.3
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• pp.423-429
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• 1990

YBa2Cu3Ox ceramics superconductors fabricated using solid state reaction usually contain second phases, such as BaCuO2 and CuO. These second phases are located long the grain boundaries and enhance the abnormal growth of YBa2Cu3Ox grains and, consequently, generate the microcracks. These second phaases were reduced by adding Y2BaCuO5 into solid state reacted YBa2Cu3Ox ceramics. Y2BaCuO5 reacts with grain boundary second phases and reduces the grian size of the ceramics. It was observed the critical current density was improved by adding Y2BaCuO5 into solid state reacted YBa2Cu3Ox ceramic superconductor.

• Journal of Powder Materials
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• v.20 no.2
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• pp.114-119
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• 2013

In the DBC (direct bonding of copper) process the oxygen partial pressure surrounding the AlN/Cu bonding pairs has been controlled by Ar gas mixed with oxygen. However, the direct bonding of Cu with sound interface and good adhesion strength is complicated process due to the difficulty in the exact control of oxygen partial pressure by using Ar gas. In this study, we have utilized the in-situ equilibrium established during the reaction of $2CuO{\rightarrow}Cu_2O$ + 1/2 $O_2$ by placing powder bed of CuO or $Cu_2O$ around the Cu/AlN bonding pair at $1065{\sim}1085^{\circ}C$. The adhesion strength was relatively better in case of using CuO powder than when $Cu_2O$ powder was used. Microstructural analysis by optical microscopy and XRD revealed that the interface of bonding pair was composed of $Cu_2O$, Cu and small amount of CuO phase. Thus, it is explained that the good adhesion between Cu and AlN is attributed to the wetting of eutectic liquid formed by reaction of Cu and $Cu_2O$.

• Journal of the Korean Magnetics Society
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• v.5 no.3
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• pp.191-196
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• 1995

NiCuZn ferrites were prepared by a solid-state reaction and sintered at $900^{\circ}C$ for 5 hours. Its properties were investigated by controlling the ferrite composition and processing. NiCuZn ferrite with a composition of ${(Ni_{0.2}Cu_{0.2}Zn_{0.6}O)}_{1.02}{(Fe_{2}O_{3})}_{0.98}$ was found to have the maximum initial permeability as a result of the variation of Cu content and the (Ni+Cu)/Zn ratio. Curie temperature($T_{c}$) of NiCuZn ferrite was decreased with the larger Cu content and increased with the larger Ni content. NiCuZn ferrites of ${(Ni_{0.2}Cu_{0.2}Zn_{0.6}O)}_{1-w}{(Fe_{2}O_{3})}_{1+w}$ composition milled for 20~80 hours had the maximum initial permeability at w=-0.015 and Curie temperature ($T_{c}$) was decreased with the increasing of $Fe_{2}O_{3}$ deficiency(w).

• Korean Journal of Materials Research
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• v.14 no.4
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• pp.246-250
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• 2004

We have investigated the effects of boron added to Cu film on the Cu-Ti reaction and microstructural evolution of Cu(B) alloy film during annealing of Cu(B)/Ti/$SiO_2$/Si structure. The result were compared with those of Cu(B)/$SiO_2$ structure to identify the effects of Ti glue layers on the Boron behavior and the result grain growth of Cu(B) alloy. The vacuum annealing of Cu(B)/Ti/$SiO_2$ multilayer structure allowed the diffusion of B to the Ti surface and forming $TiB_2$ compounds at the interface. The formed $TiB_2$ can act as a excellent diffusion barrier against Cu-Ti interdiffusion up to $800^{\circ}C$. Also, the resistivity was decreased to $2.3\mu$$\Omega$-cm after annealing at $800^{\circ}C$. In addition, the presence of Ti underlayer promoted the growth Cu(l11)-oriented grains and allowed for normal growth of Cu(B) film. This is in contrast with abnormal growth of randomly oriented Cu grains occurring in Cu(B)/$SiO_2$ upon annealing. The Cu(B)/Ti/$SiO_2$ structure can be implemented as an advanced metallization because it exhibits the low resistivity, high thermal stability and excellent diffusion barrier property.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1998.06a
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• pp.351-354
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• 1998

The formation of the $YBa_2Cu_30_{7_\delta}$(Y123) thick films has been investigated by a surface diffusion Imcess between $3BaCu0_2$+2CuO composite coating powder and a $Y_2BaCuO_5$(Y211). This reaction has been studied in the temperature of $930^{\circ}C$ and $940^{\circ}C$ for 2h to 10h in an oxygen atmosphere. The Y211 substrates becomes covered by co-precipitation of Y123 grains and CuO inclusions. X-ray diflractotnctn. revealed that the lager consisted of an orthorhombic crystal structure. The maximum Jc of $400A/\textrm{cm}^2$ is abtained when the specimen was heat-treated at $930^{\circ}C$ for 6h on the Y211 substrate.

• Journal of the Korean Chemical Society
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• v.53 no.3
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• pp.257-265
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• 2009

The structures and metal affinities of the binding configurations of $Cu^{+}$ and $Cu^{2+}$ to proline have been investigated using the hybrid three-parameter Density Functional Theory(DFT/B3LYP). We found that the metal-proline bonding and the energy ordering of several conformers were very different in $Cu^{+}$-proline and $Cu^{2+}$-proline. For $Cu^{+}$-proline, the ground state structure was found to have a bidentated coordination in which $Cu^{+}$ was coordinated to the carbonyl oxygen and imino group nitrogen of neutral proline. On the contrary, the ground state structure of $Cu^{2+}$-proline involves chelation between the two oxygens of the carboxylate group in a zwitterionic proline. The metal ion affinity of proline of the most stable $Cu^{+}$-proline complex was calculated as 76.0 kcal/mol at 6-311++G(d,p) level, whereas the $Cu^{2+}$ ion affinity of proline was calculated as 258.5 kcal/mol.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.11a
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• pp.114-117
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• 2003

본 연구에서는 계산을 통해 나온 Sn-Ag-Cu 삼원계 공정점(Sn-3.7Ag-0.9Cu)을 바탕으로 그 근처의 응고경로가 다른 6가지 조성(Sn-4.6Ag-0.4Cu, Sn-4.9Ag-1.0Cu, Sn-3.9Ag-1.3Cu, Sn-2.2Ag-1.2Cu, Sn-2Ag-0.7Cu, Sn-2.7Ag-0.3Cu)에 대한 솔더합금의 미세조직을 관찰하였다. 응고경로는 $L\;\rightarrow\;L+Primary\;\rightarrow\;L+Primary+Secondary\;\rightarrow\;Ternary\;Eutectic+Primary+Secondary$로 되며 6가지 경우를 예상할 수 있다 솔더합금의 미세조직은 느린 냉각으로 인하여 빠른 냉각, 보통 냉각에 비해 상대적으로 커다란 $\beta-Sn$ dendrite를 보였고 $Ag_3Sn,\;Cu_6Sn_5$과는 다르게 $\beta-Sn$는 약 $30^{\circ}C$의 과냉(DSC분석)이 존재하게 되어 Sn-4.6Ag-0.4Cu의 경우에는 $Ag_3Sn$상이, Sn-2.2Ag-1.2Cu의 경우에는 $Cu_6Sn_5$가 과대성장을 하였다. 솔더의 기계적 특성을 살펴보고자 Cu 기판위에서 각 조성의 솔더볼을 솔더링한 후 다양한 냉각 속도를 적용하여 reflow 솔더링을 하고 솔더/기판 접합에 대한 전단 강도 시험을 실시했다. 냉각 속도가 빠를수록 $\beta-Sn$의 dendrite가 미세해져서 높은 전단 강도를 보였고 6가지 조성의 솔더볼중 공정조직 분율이 낮은 Sn-2Ag-0.7Cu 조성의 경우에서 낮은 전단 강도가 나타났다.

• Journal of the Korean Chemical Society
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• v.18 no.3
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• pp.202-209
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• 1974

Polarographic behaviors of copper and cadmium complexes with 2,2'-bipyridine and ethylenediamine in acetonitrile have been investigated by the DC and AC polarography. The reduction processes are estimated as follows; $Cu(II)-bipy. \;complex\;{\longrightarrow^{e^-}_{E_{1/2}\risingdotseq+0.1V}}\;Cu(I)-bipy.\;complex\;{\longrightarrow^{e^-}_{E_{1/2}=-0.43V}}\;Cu(Hg)$$Cu(II)-en.\;complex\;{\longrightarrow^{e^-}}\;Cu(I)-en.\;complex\;{times}\;{\longrightarrow^{e^-}_{E_{1/2}=-0.56V}}\;Cu(Hg)$$Cu(II)-bipy. \;complex\;{\longrightarrow^{e^-}_{E_{1/2}=-0.57V}}\;Cu(I)-bipy.\;complex\;{\longrightarrow^{2e^-}_{E_{1/2}=-0.97V}}\;Cd(I)-bipy\;complex$$Cu(II)-en.\;complex\;{\longrightarrow^{e^-}_{E_{1/2}=+0.05V}\;Cu(I)-en.\;complex{\longrightarrow^{e^-}_{E_{1/2}=-0.92V}}\;Cu(Hg)$ The limiting currents of all steps are controlled by diffusion. The number of ligand and the dissociation constant for Cu(Ⅰ)-bipy. complex were found to be n = 2 and $K_d=(1.5{\pm}0.1){\times}10^{-7}$, respectively.

• Progress in Superconductivity
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• v.13 no.1
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• pp.12-17
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• 2011

We investigated the effects of Ba and Cu co-substitution on the structural and superconducting properties of ($Ru_{1-y}Cu_y$)($Sr_{1.67-x}Ba_xEu_{0.33}$)($Eu_{1.34}Ce_{0.66}$)$Cu_2O_z$ samples. X-ray diffraction(XRD) reveals that single-phase samples can be obtained in the range from x = 0.1 to 0.2 for ($Ru_{0.5}Cu_{0.5}$)($Sr_{1.67-x}Ba_xEu_{0.33}$)($Eu_{1.34}Ce_{0.66}$)$Cu_2O_z$ and from y = 0.25 to 0.5 for ($Ru_{1-y}Cu_y$)($Sr_{1.47}Ba_{0.2}Eu_{0.33}$)($Eu_{1.34}Ce_{0.66}$)$Cu_2O_z$, respectively. All samples with compositions of ($Ru_{0.5}Cu_{0.5}$)($Sr_{1.67-x}Ba_xEu_{0.33}$) ($Eu_{1.34}Ce_{0.66}$)$Cu_2O_z$ (x = 0 - 0.33) show superconducting transition behavior and the onset transition temperature decreases slightly with increasing x in consistent with the change of hole concentration estimated from room temperature thermoelectric power measurements. The XRD and resistivity measurements for the ($Ru_{1-y}Cu_y$)($Sr_{1.47}Ba_{0.2}Eu_{0.33}$)($Eu_{1.34}Ce_{0.66}$) $Cu_2O_z$ system indicate that the partial substitution of Cu for Ru is necessary to form phase pure samples, but result in a small change in transition temperature in the single-phase region from x = 0.25 to 0.5.

• Journal of the Korean Ceramic Society
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• v.35 no.8
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• pp.871-877
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• 1998

$CuInSe_2$ thin films have been formed by two-step method in which Cu-In alloy layer was first deposited and then it was selenized. Cu-In alloy layers were deposited by co-sputtering method at ambient tem-perature. XRD analysis showed that both of $Cu_{11}In_{9}$ and CuIn$_2$ phases were formed from these films. $Cu_{11}In_{9}$ peak intensity was increased increased with varying the composition from In-rich to Cu-rich. The metallic layers were selenized either in low pressure of 10 mTorr or in atmospheric pressure(AP) Less compounds of Cu-Se and In-Se were observed during the early stage of selenization and also $CuInSe_2$ thin films selenized in vacuum showed lower roughness larger grain size and better crystallinity than those in AP.