Studies on the AFM analysis of Cu CMP processes for pattern pitch size and density after global planarization (패턴 피치크기 및 밀도에 따른 Cu CMP 공정의 AFM 분석에 관한 연구)
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- Journal of the Korean Institute of Telematics and Electronics D
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- v.35D no.9
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- pp.20-25
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- 1998