• Journal of Welding and Joining
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• v.20 no.1
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• pp.97-102
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• 2002

The growth kinetics of intermetallic compound layers formed between the eutectic Sn-3.5Ag solder and the Cu and Ni/Cu pad by solid stateisothermal aging were examined. The interfacial reaction between the eutectic Sn-3.5Ag solder and the Cu and Ni/Cu pad was investigated at 70, 120, 150, $170^{\circ}C$ for various times. The intermetallic compound layer was composed of two phase: $Cu_6Sn_5$(${\varepsilon}-phase$) adjacent to the solder and $Cu_6Sn_5$(${\varepsilon}-phase$) adjacent to the copper and on solder/Ni pad the intermetallic compound layer was $Ni_3Sn_4$. Because the values of time exponent(n) have approximately 0.5, the layer growth of the intermetallic compound was mainly controlled by volume diffusion over the temperature range studied. The apparent activation energy for layer growth of total Cu-Sn($Cu_6Sn_5 + Cu_6Sn$), $Cu_6Sn_5$, $Cu_3Sn$ and $Ni_3Sn_4$ intermetallic compound were 64.82kJ/mol, 48.53kJ/mol, 89.06kJ/mol and 71.08kJ/mol, respectively.

• Journal of the Korean Society for Heat Treatment
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• v.4 no.2
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• pp.9-18
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• 1991

Among the many maunfactured processes of producing multi filamentary composites, in situ process is widely used owing tv its simplicity and easyness of mass production. In this study, the mechanical and electromagnetic properties of Cu-Fe composite materials was investigated. The tensile strength of the Cu-Fe wires increased as the Fe content and reduction ratio were increased. The Cu-30 wt%Fe composites had the best properties in terms of figure merits compared to the other Cu-Fe composites made in this study or the commercially manufactured 6/1 ACSR cables of Cu cable. The coercivity was decreased by increasing Fe content, but the squareness was increased greatly. As increasing reduction ratio, the coercivity and squareness increased up to the maximum points, and then decreased. For example, the maximum values were obtained at $0.09mm{\phi}$ for Cu-30 wt%Fe composites and at $0.066mm{\phi}$ for Cu-45 wt%Fe composites. The magnetic property of Cu-Fe wires produced by precipitation treatment was higher than that of Cu-Fe wires produced by thermomechanical treatment. By annealing Cu-Fe wires after drawing process, the coercivity, remanence and squareness were improved.

• Journal of the Korean institute of surface engineering
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• v.49 no.4
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• pp.368-375
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• 2016

MoN-Cu thin films were prepared to achieve appropriate properties of high hardness and low friction coefficient, which could be applied to automobile engine parts for reducing energy consumption as well as solving wear problems. Composite thin films of MoN-Cu have been deposited by various processes using multiple targets such as Mo and Cu. However, those deposition with multiple targets revealed demerits such as difficulties in exact control of composition and homogeneous deposition. This study is aiming for suggesting an appropriate process to solve those problems. A single alloying target of Mo-Cu (10 at%) was prepared by powder metallurgy methods of mechanical alloying (MA) and spar plasma sintering (SPS). Thin film of MoN-Cu was then deposited by magnetron sputtering using the single alloying target of Mo-Cu (10 at%). Properties of the resulting MoN-Cu thin film were examined and compared to those of MoN-Cu thin films prepared with double targets of Mo and Cu.

• Journal of Electrochemical Science and Technology
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• v.10 no.3
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• pp.329-334
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• 2019

Sn-Cu alloy powders were prepared via a simple chemical reduction method for the negative electrode materials in lithiumion batteries. The addition of Cu can suppress the growth of Sn particles during synthetic process. Furthermore, the Cu also acts as a matrix phase against the volume change during cycling. With increasing amount of the Cu, a stable $Cu_6Sn_5$ phase formed in the Sn-Cu alloy and its cycle performance greatly enhanced depending on the Cu content. To promote the generation of the $Cu_6Sn_5$ phase, the synthesis temperature is raised to $60-100^{\circ}C$ from the ambient temperature. The Sn-Cu alloy powders prepared at elevated temperatures showed remarkable cycle performances. The Sn-Cu alloy powder obtained at $60^{\circ}C$ exhibited a significantly high volumetric capacity of over 2,000 mAh/cc at the 50th cycle.

• Journal of the Korean Physical Society
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• v.73 no.11
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• pp.1794-1798
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• 2018

We have grown famatinite $Cu_3SbS_4$ films by using sulfurization of Cu/Sb stack film. Sulfurization at $500^{\circ}C$ produced famatinite $Cu_3SbS_4$ phase, while $400^{\circ}C$ and $450^{\circ}C$ sulfurization exhibited unreacted and mixed phases. The fabricated $Cu_3SbS_4$ film showed S-deficiency, and secondary phase of $Cu_{12}Sb_4S_{13}$. The secondary phase was confirmed by X-ray diffraction, Raman spectroscopy, photoluminescence and external quantum efficiency measurements. We have also fabricated solar cell in substrate type structure, ITO/ZnO/(Zn,Sn)O/$Cu_3SbS_4$/Mo/glass, where $Cu_3SbS_4$ was used as a absorber layer and (Zn,Sn)O was employed as a Cd-free buffer. Our best cell showed power conversion efficiency of 0.198%. Characterization results of $Cu_3SbS_4$ absorber indicates deep defect (due to S-deficiency) and low shunt resistance (due to $Cu_{12}Sb_4S_{13}$ phase). Thus in order to improve the cell efficiency, it is required to grow high quality $Cu_3SbS_4$ film with no S-deficiency and no secondary phase.

• Korean Journal of Metals and Materials
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• v.47 no.9
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• pp.597-603
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• 2009

The hydrogen reduction behavior of ultrasonic ball-milled $WO_3-CuO$ nanopowder, which is highly related with micro-pore structure, was investigated by thermogravimetry(TG) and hygrometry system. EDS and TEM results represented that the ultrasonic ball-milled $WO_3-CuO$ nanopowder consisted of the agglomerates which was confirmed as a homogeneous mixture of $WO_3$ and CuO particles. It was found that the reduction reaction of CuO was retarded by initial micro-pores which are smaller than 40 nm in the ultrasonic ball-milled $WO_3-CuO$ nanopowder. The earlier agglomeration of Cu particles at comparably low temperature decreased the volume of micro-pores in the $WO_3-CuO$ nanopowder which caused the retardation of $WO_3$ reduction reaction. These results clearly explain that the micro-pore structure significantly affected the reduction reaction of $WO_3$ and CuO in the $WO_3-CuO$ nanopowder.

• Journal of the Korean Society for Heat Treatment
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• v.35 no.1
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• pp.1-7
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• 2022

In this study, dissolution and melting phenomenon of the Al₂Cu was studied for the high-strength Al-Si-Cu aluminum alloy in automobile component. The Solution heat treatment was performed at 480℃ and 510℃ for 4hours. Microstructure analysis of the specimen was performed using the optical micrograph and scanning electron microscope for qualitative and quantitative analysis of various phases, the chemical composition of secondary phases was achieved by energy dispersive spectroscopy (EDS) and electron probe micro analysis (EPMA). As a result of the electron probe micro analysis, a plate like Al₂Cu phase was observed, and eutectic Si phase was observed of a coarsen plate shape. At a temperature of 510, necking phenomenon occurs in a specific part of plate like Al₂Cu, and it is segmented and dissolved in the Al matrix. When the temperature of the alloy exceeds the melting point of Al₂Cu, incipient melting occurs at the grain boundary of undissolved Cu particles

• Tribology and Lubricants
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• v.39 no.3
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• pp.111-117
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• 2023

This paper presents an experimental investigation of the tribological characteristics of PTFE composites filled with nano CuO particles under low sliding speed and load. All the specimens were prepared by sintering. Before sintering, the mixture of PTFE powder and CuO particles were mixed by a high-speed mixer using CuO volume fractions of 0.2 vol. % and 5 vol. %. Each mixture was sintered at 350 ℃ for 30 min on the steel disk. We conducted ball-on-disk sliding test an hour using a steel ball against PTFE composites, including pure PTFE. The load and sliding speed used was 2 N and 0.01 m/s, respectively. Adding nano CuO particles increases the friction coefficient because of the abrasiveness of hard nano CuO particles. The highest coefficient of frictions was obtained from 5 vol. % CuO. Conversely, the lowest wear of the composites was obtained from the 5 vol. % CuO nanocomposite. This study reveals that the addition of nano CuO particles can lower the wear of PTFE, despite an increase in the coefficient of friction. However, the coefficient friction is still moderate compared to other engineering polymers. In addition, the amount of CuO nano particles has to be optimized to reduce friction and wear at the same time.

• Bulletin of the Korean Chemical Society
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• v.30 no.6
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• pp.1410-1412
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• 2009

• Journal of the Korean Institute of Telematics and Electronics D
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• v.35D no.9
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• pp.20-25
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• 1998

Cu removal rates for various SiO$_2$ trench pitch sizes and densities and AFM images of surface profiles after global planarization using Cu CMP technology are investigated. In the experimental results, Cu removal rates are increasing as the pattern densities and pattern pitches are getting high and low, respectively, and then decreasing after local planarization. The rms roughness after global planarization are about 120$\AA$. AFM images with a 50% pattern density for 1${\mu}{\textrm}{m}$ and 2${\mu}{\textrm}{m}$ pitches show that thicknesses of 120~330$\AA$ Cu interconnects have been peeled off and oxide erosion of Cu/Sio$_2$ sidewall is observed. However, AFM images with a 50% pattern density for 10${\mu}{\textrm}{m}$ and 15${\mu}{\textrm}{m}$ pitches show that 260~340$\AA$ thick Cu interconnects have been trenched at the boundaries of Cu/Sio$_2$ sidewall.