• 공업화학
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• 제9권7호
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• pp.998-1003
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• 1998

$85^{\circ}C$, 0.4 M $Ba(OH)_2$용액내에서 펄스전류파형을 이용하여 Ti전극위에 $BaTiO_3$박막을 전해 합성하였다. 환원전류 밀도 및 환원시간이 증가함에 따라 $BaTiO_3$의 결정성 및 페러데이 효율이 증가하였으며, 이는 표면 및 전기화학적특성 분석에 의하면 환원 전류 인가시에 $H_2O$의 환원에 의하여 전극표면의 pH가 증가함으로서 산화전류에 의하여 형성된 산화막의 구조변화가 빠르게 진행되기 때문으로 추측된다. 그리고 0.1M $H_2SO_4$용액하에서 산화막을 형성시킨 후 $BaTiO_3$형성에 미치는 영향을 분석한 결과, 산화막 두께가 증가함에 따라서 산화막을 통한 $Ti^{+4}$이온의 이동이 어려워지면서 $BaTiO_3$형성이 억제되며, 일정두께이상에서는 산화막 결함부위에서 결정이 형성됨을 알 수 있었다.

• 한국세라믹학회지
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• 제32권7호
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• pp.761-768
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• 1995

Double layered BaTiO3 thin films with high dielectric constant as well as good insulating property were prepared for the application to low voltage driving thin film electroluminescent (TFEL) device. BaTiO3 thin films were formed by rf-magnetron sputtering technique. Amorphous and polycrystalline BaTiO3 thin films were deposited at the substrate temperatures of room temperature and 55$0^{\circ}C$, respectively. Two kinds of films prepared under these conditions showed high resistivity and high dielectric constant. The figure of merit (=$\varepsilon$r$\times$Eb.d) of polycrystalline BaTiO3 thin film was very high (8.43$\mu$C/$\textrm{cm}^2$). The polycrystalline BaTiO3 showed a substantial amount of leakage current (I), under the high electric field above 0.5 MV/cm. The double layered BaTiO3 thin film, i.e., amorphous BaTiO3 layer coated polycrystalline BaTiO3 thin film, was prepared by the new stacking method and showed very good dielectric and insulating properties. It showed a high dielectric constant fo 95 and leakage current density of 25 nA/$\textrm{cm}^2$ (0.3MV/cm) with the figure of merit of 20$\mu$C/$\textrm{cm}^2$. The leakage current density in the double layered BaTiO3 was much smaller than that in polycrystalline BaTiO3 under the high electric field. The saturated brightness of the devices using double layered BaTiO3 was about 220cd/$m^2$. Threshold voltage of TFEL devices fabricated on double layered BaTiO3 decreased by 50V compared to the EL devices fabricated on amorphous BaTiO3.

• 한국재료학회지
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• 제17권10호
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• pp.548-554
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• 2007

[ $BaTiO_3$ ] thick film by an interfacial polymerization method was prepared at the liquid/liquid interface between benzyl alcohol saturated solution with the basic catalyst [diethyl amine ($NHEt_2$) or triethylamine ($NEt_3$)], and the water dissolved with $TiO_2$ and $Ba(CH_3COO)_2$. The film thickness increased gradually with an increase in diethyl amine($NHEt_2$) or triethylamine($NEt_3$) volume and the reaction time. The homogeneity of $BaTiO_3$ thick film after sintered at $600^{\circ}C$ was confirmed by EPMA analysis, which showed that both of Ba and Ti element were homogeneously distributed on the surface as well as in the perpendicular direction of the film. The thickness of $BaTiO_3$ film obtained by this process was $8.75\;{\mu}m$.

• 한국세라믹학회지
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• 제34권4호
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• pp.373-379
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• 1997

A study on the deposition and characterization of BaTiO3 thin films on MgO-buffered Si(100) substrates by sputtering was conducted. The MgO buffer layers were investigated as a function of deposition temperature. At lower substrate temperature, the MgO layers were not fully crystalline, but a crystallized MgO layer with (001) preferred orientation was obtained at the substrate temperature of $700^{\circ}C$. Partially (00ι) or (h00) textured BaTiO3 films were obtained on Si(100) with the MgO buffer layer grown at 700ι. While, randomly oriented BaTiO3 films with large-scale cracks on the surface were made without the MgO layer. The crystallographic orientation, morphology and electrical properties between the BaTiO3 films on Si with and without the MgO layer were compared using the BaTiO3 film on MgO(100) single crystal substrate as a reference system. Also the favorable role of the MgO layer as a buffer for growing of oriented BaTiO3 films on Si substrates was confirmed.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2005년도 추계학술대회 논문집 Vol.18
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• pp.68-69
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• 2005

BTO ($BaTiO_3$) thin film is one of the high dielectric materials for high-density dynamic random access memories (DRAMs) due to its relatively high dielectric constant. It is generally known that BTO film is difficult to be etched by plasma etching, but high etch rate with good selectivity to pattern mask was required. The problem of sidewall angle also still remained to be solved in plasma etching of BTO thin film. In this study, we first examined the patterning possibility of BTO film by chemical mechanical polishing (CMP) process instead of plasma etching. The sputtered BTO film on TEOS film as a stopper layer was polished by CMP process with the self-developed $BaTiO_3$- and $TiO_2$-mixed abrasives slurries (MAS), respectively. The removal rate of BTO thin film using the$ BaTiO_3$-mixed abrasive slurry ($BaTiO_3$-MAS) was higher than that using the $TiO_2$-mixed abrasive slurry ($TiO_2$-MAS) in the same concentrations. The maximum removal rate of BTO thin film was 848 nm/min with an addition of $BaTiO_3$ abrasive at the concentration of 3 wt%. The sufficient within-wafer non-uniformity (WIWNU%)below 5% was obtained in each abrasive at all concentrations. The surface morphology of polished BTO thin film was investigated by atomic force microscopy (AFM).

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2004년도 추계학술대회 논문집 Vol.17
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• pp.400-403
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• 2004

The dielectric properties of $BaTiO_3/SrTiO_3$ multilayered thick films with printing times were investigated. $BaTiO_3/SrTiO_3$ thick films were deposited by Screen-printing method on alumina substrates. The obtained films were sintered at $1400^{\circ}C$ with bottom electrode(Pt) for 2hours. The structural and the dielectric properties were investigated for various printing times. The BST phase appeared in all of the $BaTiO_3/SrTiO_3$ mutilayered thick films. The $BaTiO_3/SrTiO_3$ multilayered thick film thickness, obtained by one printings, was $50{\mu}m$. The dielectric constant and dielectric loss of the $BaTiO_3/SrTiO_3$ multilayered thick film, obtained by five printings, were about 266, 0.8% at 1Mhz, respectively.

• 분석과학
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• 제6권2호
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• pp.239-246
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• 1993

ITO coated glass, bare glass, 그리고 (100)Si 기판 위에 증착된 $(BaSr)TiO_3$ 박막의 구조는 기판의 종류에 관계없이 변하지 않았으나 결정성은 다결정 ITO층과 (100)Si 기판에 있어서 증대되었다. ITO coated glass 기판 위에 증착된 $(BaSr)TiO_3$ 박막의 조성은 거의 화학양론적으로 일치하였으며 ((Ba+Sr)/Ti=1.08~1.09) 증착 중 상당히 치밀하고 균질하였다. 그러나 증착온도가 증가함에 따라 성장한 박막과 ITO층 사이에, 그리고 ITO층과 base glass 사이에 확산이 보다 심화되었다. ITO coated glass 기판 위에 증착된 $(BaSr)TiO_3$ 박막은 상당히 투명하였으며(투과율 약 80%) 굴절률($n_f$)은 기판온도의 증가에 따라 2.138~2.286이었다.

• 한국세라믹학회지
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• 제31권7호
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• pp.795-803
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• 1994

Ferroelectric BaTiO3 thin film was produced using BaTi-ethoxide sol. This sol was prepared from BaTi-ethoxide by a partial hydrolysis with ammonia as a basic catalyst and ethylene glycol as a chelating agent. BaTiO3 thin film was prepared from three continuous spin-coating layers of the sol on bare Si(100) wafer at 2500 rpm followed by pyrolysis at $700^{\circ}C$ for 30 min. After the heat treatment, the film was 0.200$\pm$0.010 ${\mu}{\textrm}{m}$ thick and its grain size was 0.059 ${\mu}{\textrm}{m}$. On the other hand, electrical properties were measured for BaTiO3 thin film separately prepared on Au-deposited silicon wafer. The dielectric constant and loss of the BaTiO3 thin film at room temperature was 150~160 and 0.04 respectively, which was measured at 10 kHz and oscillation level of 0.1 V. In the measurements of the dielectric properties at high temperatures, it was observed that the capacitance of the thin film increases steeply, while the dielectric loss reaches maximum around 1$25^{\circ}C$, which corresponds a phase transition from tetragonal to cubic BaTiO3.

• 대한전기학회논문지:전기물성ㆍ응용부문C
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• 제55권6호
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• pp.291-296
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• 2006

In this study, the sputtered BTO film was polished by CMP process with the self-developed $BaTiO_3$- and $TiO_2$-mixed abrasives slurries (MAS), respectively. The removal rate of BTO ($BaTiO_3$) thin film using the $BaTiO_3$-mixed abrasive slurry (BTO-MAS) was higher than that using the $TiO_2$-mixed abrasives slurry ($TiO_2$-MAS) in the same concentrations. The maximum removal rate of BTO thin film was 848 nm/min with an addition of $BaTiO_3$ abrasive at the concentration of 3 wt%. The sufficient within-wafer non-uniformity (WIWNU%) below 5% was obtained in each abrsive at all concentrations. The surface morphology of polished BTO thin film was investigated by atomic force microscopy (AFM).

• 한국재료학회지
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• 제7권2호
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• pp.114-120
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• 1997

$Ba(NO_{3})_{2}$와 $TiCl_{4}$의 혼합 수용액으로부터 전기화학법 중 음극혼원법(cathodic reduction method)을 이용하여 stainless steel기판 위에 $BaTiO_{3}$박막을 제조하였다. $BaTiO_{3}$전구체 박막은 혼합 수용액으로부터 반응초기에 $TiO_{2}{\cdot}nH_{2}O$M/형태로 우선적으로 형성되었으며, 일정 시간이 경과한 후에는 일정한 Ba/Ti몰비를 갖는 박막이 제조되었다. $BaTiO_{3}$박막 내 Ba/Ti조성비는 혼합 수용액 내에 존재하는 이온 조성비 $Ba^{2+}/Ti_{4+}$에 변화하였는데, 0.3M $Ba(NO_{3})_{2}$와 0.1M $TiCI_{4}$의 혼합 수용액과 $10mA/cm^2$의 전류를 흘려주는 조건에서 Ba/Ti의 조성비가 1에 가까운 박막을 얻을 수 있었다. 이러한 전구체 박막을 $500^{\circ}C$이상에서 열처리한 결고 페로브스카이트 상의 $BaTiO_{3}$박막이 제조되었다.