• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.27 no.1
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• pp.76-79
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• 2016

This paper describes the successful development and the performance of X-band 50 W pulsed power amplifier using a 50 W GaN-on-SiC high electron mobility transistor. The GaN HEMT with a gate length of $0.25{\mu}m$ and a total gate width of 12 mm were fabricated. The X-band pulsed power amplifier exhibited an output power of 50 W with a power gain of 6 dB in a frequency range of 9.2~9.5 GHz. It also shows a maximum output power density of 4.16 W/mm. This 50 W GaN HEMT and X-band 50 W pulsed power amplifier are suitable for the radar systems and related applications in X-band.

• Journal of IKEEE
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• v.23 no.1
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• pp.181-187
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• 2019

In this paper, we demonstrated a power amplifier monolithic microwave integrated circuit (MMIC) for X-band radar applications. It utilizes commercial $0.25{\mu}m$ GaN-based high electron mobility transistor (HEMT) technology and delivers more than 20 W of output power. The developed GaN-based power amplifier MMIC has small signal gain of over 22 dB and saturated output power of over 43.3 dBm (21.38 W) in a pulse operation mode with pulse width of $200{\mu}s$ and duty cycle of 4% over the entire band of 9 to 10 GHz. The chip dimensions are $3.5mm{\times}2.3mm$, generating the output power density of $2.71W/mm^2$. Its power added efficiency (PAE) is 42.6-50.7% in the frequency bandwidth from 9 to 10 GHz. The developed GaN-based power amplifier MMIC is expected to be applied in a variety of X-band radar applications.

• Journal of the Institute of Electronics Engineers of Korea TC
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• v.46 no.12
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• pp.22-29
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• 2009

In this paper, we developed the 200-Watts SSPA(Solid State Power Amplifier) for the X-band pulse compression solid state radar. The developed X-band SSPA is consists of 3-stage CSA(Corporate Structured Amplifier) modules in pre-amplifier stage, driver-amplifier stage and main-power amplifier stage. The main-power amplifier stage of SSPA designed by balanced type using GaN HEMT with enough power and gain to generate power more than 200-Watts in X-band. The developed SSPA has performance with more than total gain 59dB and output power 200-Watts in condition of frequency range 9.2-9.6GHz, pulse period 1msec, pulse width 100usec and duty cycle 10%. The developed SSPA in this paper can apply to high quality solid state radar system with pulse compression technique.

• Korean Journal of Crystallography
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• v.12 no.3
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• pp.141-144
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• 2001

From the reaction of Na[Ga(N₃)₄] with PPh₃, an ionic compound [Ph₃P(OH)]/sup +/[N₃]/sup -/ (1) was isolated. Compound 1 was characterized by spectroscopy (¹H-NMR, /sup 13C{¹H}-NMR, and IR) and X-ray diffraction. Crystallographic data for 1 : orthorhombic space group P2₁2₁2₁, a = 10.491 (4) Å, b=11.603(5)Å, c=13.149(5)Å, Z=4, R(wR₂)=0.0547(0.0978).

• The Journal of the Korea institute of electronic communication sciences
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• v.7 no.1
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• pp.1-7
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• 2012

In this paper, An X-band solid state power amplifier(SSPA) for pulse compressed microwave signal with 60Watt power and power added efficiency(PAE) above 30% is described. Designed 60Watt high power amplifier(HPA) was implemented by cascade coupled amplifiers, and it is consisted on three stage drive amplifiers with internally matched GaAs FET and one stage main power amplifier with an internally matched GaN HEMT. The designed SSPA has performance with more than total power gain 37dB and output power 48dBm(60-W) in condition of frequency range $9.41{\pm}0.03GHz$, pulse period width under 1ms and duty cycle under 10%. The implemented SSPA can apply to high quality digital marine radar applications with pulse compression technique.

• Proceedings of the KIEE Conference
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• 1988.11a
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• pp.372-375
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• 1988

The III-V ternary alloy semiconductor $In_{l-x}Ga_{x}As$ were grown by the temperature Gradient of $0.60{\leq}x{\leq}0.98$. The electrical properties were investigated by the Hall effect measurement with the Van der Pauw method in the temperature range of $90{\sim}300K$. $In_{l-x}Ga_{x}As$ were revealed n-type and the carrier concentration at 300K were in the range of $9.69{\times}10^{16}cm^{-3}{\sim}7.49{\times}10^{17}cm^{-3}$. The resistivity was increased and the carrier mobility was decreased with increasing the composition ratio. The optical energy gap determined by optical transmission were $20{\sim}30meV$ lower than theoretical valves on the basis of absorption in the conduction band tail and it was decreased with increasing the temperature by the Varshni rule. In the photoluminescence of undoped $In_{l-x}Ga_{x}As$ at 20K, the main emission was revealed by the radiative recombination of shallow donor(Si) to acceptor(Zn) and the peak energy was increased with increasing the composition, X. The diffusion depth of Zn increases proportionally with the square root of diffusion time, and the activation energy for the Zn diffusion into $In_{0.10}Ga_{0.90}As$ was 2.174eV and temperatures dependence of diffusion coefficient was D = 87.29 exp(-2.174/$K_{B}T$). The Zn diffusion p-n $In_{x}Ga_{x}As$ diode revealed the good rectfying characteristics and the diode factor $\beta{\approx}2$. The electroluminescence spectrum for the Zn-diffusion p-n $In_{0.10}Ga_{0.90}As$ diode was due to radiative recombation between the selectron trap level(${\sim}140meV$) and Zn acceptor level(${\sim}30meV$). The peak energy and FWHM of electroluminescence spectrum at 77K were 1.262eV and 81.0meV, respectively.

• The Transactions of the Korean Institute of Electrical Engineers
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• v.41 no.1
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• pp.56-62
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• 1992

The GaAs bulk crystals are grown by the Synthesis Solute Diffusion(SSD) method and its properties are investigated. The crystal growth rate at optimum condition is 0.28 cm/day and their temperature dependence is R(T) = 2.92 x 10S04T exp(-1.548eV/kS1BTT) [cmS02T/day.K]. Etch pits density distribution along radial direction is order of 10S04TcmS0-2T and 10S03TcmS0-2T at the edge and middle of the wafers, respectively, and it increased exponentially along vertical direction of ingot. Moreover,it is uniformly distributed as order of 10S03TcmS0-2T in radial direction of In doped GaAs. The carrier concentration and mobilities are measured to 0.34-2.1 x 10S016T cmS0-3T and 2.3-3.3x10S03T cmS02T/V.sec, respectively.

• Solar Energy
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• v.20 no.2
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• pp.43-54
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• 2000

We prepared and characterized $Cu(In_{1-x}Ga_x)Se_2$(CIGS) films using a elemental co-evaporation method for absorbing layer of high efficiency thin film solar cells. The CIGS films deposited on a soda-lime glass exhibited low resistivity because of higher carrier concentration. Na was accumulated at the CIGS surface and the 0 and Se were also accumulated at the surface, suggesting that oxidation is a driving force of Na accumulation. The structure of CIGS film was modified or a secondary phase was formed in the Cu-poor CIGS bulk films probably due to the incorporation of Na into Cu vacancy sites. As the Ga/(In+Ga) ratio increased, the diffraction peaks of $Cu(In_{1-x}Ga_x)Se_2$ films were shifted to larger angle and splitted, and the grain size of $Cu_{0.91}(In_{1-x}Ga_x)Se_2$ films became smaller. All $Cu_{0.91}(In_{1-x}Ga_x)Se_2$ films showed the p-type conductivity regardless of the Ga/(In+Ga) ratio. Ag/n-ZnO/i-ZnO/CdS/$Cu_{0.91}(In_{0.7}Ga_{0.3})Se_2$/Mo solar cells were fabricated. The currently best efficiency in this study was 14.48% for $0.18cm^2$ area ($V_{oc}=581.5mV,\;J_{sc}=34.88mA$, F.F=0.714).

• Proceedings of the Korean Vacuum Society Conference
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• 2013.02a
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• pp.425-426
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• 2013

IIIN계 물질 기반의 광 반도체는 직접 천이형 넓은 밴드갭 구조를 갖고 있기 때문에 적외선부터 가시광선 및 자외선까지를 포함한 폭 넓은 발광파장 조절이 가능하여 조명 및 디스플레이 관련 차세대 광원으로 많은 관심을 받고 있다. 일반적인 청색 및 녹색 발광영역의 활성층으로는 InGaN/GaN 다중양자우물구조를 사용하고 있으나, 장파장의 녹색 발광을 얻기 위해서는 인듐의 함유량이 증가하여야 한다. 하지만, 인듐의 함유량이 증가함에 따라서 InGaN/GaN 다중양자우물 구조내에서 인듐의 편석현상의 발생이 용이하게 되어 계면 특성을 저하할 뿐 아니라, 비발광 센터를 증가하여 발광 효율을 급격히 감소시키는 원인이 되고 있다. 또한, InGaN과 GaN의 큰 성장온도의 차이에 따라 800도 부근의 저온 영역에서 성장된 InGaN층이 1,000도 이상의 고온 영역에서 GaN층이 성장시 InGaN층의 열화 현상이 급격히 발생되고 있다. 이를 억제하기 위해서 금속유기화학증착법의 성장 변수 최적화, 응력제어, 도핑 등의 편석 억제기술 및 보호층이 사용되고 있다. 본 연구에서는 인듐함유량이 증가된 녹색 InGaN/GaN 다중양자우물구조에서 InGaN 우물층 상하부에 도입된 GaN 보호층에 따라 발생되는 양자우물구조의 광학 및 결정학적 특성 분석을 통해 GaN 보호층의 역할을 분석하고자 한다. 본 연구에서는 금속유기화학증착장치를 이용하여 사파이어 기판위에 GaN 템플릿을 성장하고, n-형 GaN, InGaN/GaN 다중양자우물구조 및 p-형 층을 성장하였다. 앞선 언급하였듯이, InGaN/GaN 다중양자우물구조내에 GaN 보호층의 역할을 규명하기 위하여 샘플 A의 경우는 보호층이 전혀 없는 구조이고, 샘플 B의 경우는 InGaN 우물층의 상단부에만, 샘플 C의 경우에는 우물층 상부 및 하단부 모두에 약 2.0 nm 두께의 GaN 보호층을 형성하였다. 이 보호층의 유무에 따른 다중양자우물구조의 계면 특성을 확인하기 위한 X-선 회절을 이용하였고, 광학적 특성을 확인하고 상온 포토루미네선스법을 이용하여 녹색 발광 파장의 변화 및 발광세기를 관찰하였다. 우선적으로, 상온 포토루미네선스법을 이용하여 각 샘플의 발광특성을 확인한 바 상하부 모두에 GaN 보호층이 존재하는 샘플 C의 경우 약 510 nm 부근에서 발광이 관찰되었지만, 상단부에 GaN 보호층이 존재하는 샘플 B는 약 495 nm영역에 발광이 확인되었다. 특히, 전혀 보호층이 존재하지 않는 샘플 A의 경우 약 440 nm에서 발광하는 현상을 관찰하였다. 이는 우물층 상단부 및 하단부에 존재하는 GaN 보호층이 In의 확산을 억제하는 것으로 판단된다. 또한, 발광파장 및 세기를 확인한 바, 보호층의 존재하지 않을수록 단파장화가 발생함에도 불구하고 발광세기는 급격히 약해지는 것으로 보아 계면특성이 저하되어 비발광센터가 증가되는 것으로 판단된다. 이를 구조적으로 확인하기 위하여 X-선 회절법을 통한 ${\omega}$/$2{\Theta}$ 스캔의 결과는 In의 0차 피크가 GaN 보호층이 없을 경우 GaN의 피크 방향으로 이동하는 것으로 보아 GaN 보호층은 우물층 성장 후 GaN 장벽층을 성장하기 위해 온도를 증가시키는 과정에서 In의 확산되는 것으로 판단된다. 또한, 하부 GaN 보호층의 경우 GaN 장벽층 성장 후 온도를 감소시키는 과정에서 성장되므로, 우물층으로부터 In의 탈착현상이 아닌 장벽층과의 상호 확산으로 판단된다. 또한, 계면특성을 확인하기 위해 InGaN의 X-선 위성 피크를 확인한 바 샘플 A의 경우 매우 넓고 약한 피크가 관찰된 반면, 보호층이 존재하는 샘플 B와 C의 경우 강하고 얇은 피크가 확인되었다. 이는 GaN 보호층의 도입으로 인해 계면특성이 향상되는 것으로 판단된다. 따라서, 우리는 InGaN/GaN 다중양자우물구조에서 GaN 보호층은 상부의 열화 억제 뿐아니라, 하부의 장벽층 및 우물층 사이의 상호확산을 억제하는 GaN 보호층의 도입을 통하여 우수한 계면 특성 및 비발광센터의 억제를 얻을 수 있을 것으로 생각되며, 이는 향후 GaN계 발광다이오드의 전계 발광특성을 증가하여 우수한 발광소자를 개발할 수 있을 것으로 기대된다.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.22 no.11
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• pp.1034-1046
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• 2011

In this paper, a design and fabrication of 40 W power amplifier for the X-band using load-pull measurement of GaN HEMT chip are presented. The adopted active device for power amplifier is GaN HEMT chip of TriQuint company, which is recently released. Pre-matched fixtures are designed in test jig, because the impedance range of load-pull tuner is limited at measuring frequency. Essentially required 2-port S-parameters of the fixtures for extraction optimal input and output impedances is obtained by the presented newly method. The method is verified in comparison of the extracted optimal impedances with data sheet. The impedance matching circuit for power amplifier is designed based on EM co-simulation using the optimal impedances. The fabricated power amplifier with 15${\times}$17.8 $mm^2$ shows the efficiency above 35 %, the power gain of 8.7~8.3 dB and the output power of 46.7~46.3 dBm at 9~9.5 GHz with pulsed-driving width of 10 usec and duty of 10 %.