• Title/Summary/Keyword: $Al_2O_3$ particles

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AN EXPERIMENTAL STUDY ON THE SHEAR BOND STRENGTHS OF COMPOSITE RESIN TO AIR-ABRADED ENAMEL AND DENTIN (표면처리방법에 따른 복합레진의 결합강도에 관한 실험적 연구)

  • Shin, Jae-Ho;Jang, Ki-Taeg;Hahn, Se-Hyun
    • Journal of the korean academy of Pediatric Dentistry
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    • v.24 no.1
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    • pp.112-124
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    • 1997
  • According to extensive use of composite resin which have superior esthetic property, every effort on improving bonding strength between a tooth and composite resin has been continued. Acid etching technique is a method that micro-etches the tooth surface which provides bonding with composite resin possible. Recently, there were several reports that mechanical treatment obtained from air-abrasion can provide similar bonding strength with acid etching technique. So, this experimental study was designed to compare the shear bonding strength between using air-abrasion technique and using acid etching technique. Initially, bovine teeth were divided into enamel and dentin experimental groups. Respectively each group was categorized into three subgroups. One subgroup was acid etched with 35% phosphoric acid, then bonded with composite resin. The other subgroup was air-abraded with $50{\mu}m$ $Al_2O_3$ particles sprayed with 160psi air pressure using air abrasion unit(KCP-1000, A.D.T., U.SA), and composite resin was bonded. In another subgroup, composite resin was bonded after acid etching following air-abrasion. So, enamel experimental groups were made of E1 (acid etched only), E2(air-abraded only), E3(acid etched following air-abraded), and dentin experimental groups were made of D1(acid etched only), D2(air-abraded only), D3(acid etched following air-abraded). Each subgroup had 10 specimens. Dentin bonding system(Scotchbond Multi-purpose, 3M Co., U.S.A.) and composite resin(Z-100, 3M Co., U.S.A.) were applied on treated surface using 5mm diameter gelatin capsule as manufacturer's direction. After 1200 times thermocycling between $5^{\circ}C$ and $55^{\circ}C$, shear bond strength was measured in 5mm/min crosshead speed with Instron(Instron Co., U.S.A.), and also treated enamel and dentin were observed with SEM(JEOL Co., Japan). The following results were obtained: 1. In the enamel experimental groups, acid etched following air-abraded group had highest shear bond strength, but there was no significant difference compared to acid etched group. Air-abraded only group had lowest shear bond strength, and there was significant difference compared to the rest of groups. 2. In the dentin experimental groups, acid etched following air-abraded group had highest shear bond strength, but there was no significant difference compared to acid etched group. Air-abraded only group had lowest shear bond strength, and there was significant difference compared to the rest of groups. 3. In the SEM study, air-abraded enamel and dentin had irregular and rough surfaces.

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Effect of Coagulants on the Behavior of Ultra Fine Dust in a Coal Firing Boiler (석탄 화력 보일러에서의 응집제 이용에 따른 초미세먼지 거동)

  • Ryu, Hwanwoo;Song, Byungho
    • Applied Chemistry for Engineering
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    • v.31 no.1
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    • pp.84-89
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    • 2020
  • Particulate matters of PM2.5, particularly focusing on 0.1~1 ㎛ decrease the efficiency of dust-collector due to the brownian-motion. This study is to verify the effect of coagulant on the particle size distributions of potassium and PM2.5. The activated coagulant was spayed to the coal fired fluidized bed combustion boiler by the weight ratio of 1,200 : 1 = coal : coagulant, and the size distributions of captured particles at both the cyclone (FP) and electrostatic precipitator (EP) were measured. As the result of XRP analysis, the potassium content of FP increased to 13.33% (averagely from 1.65% to 1.87%) and, in EP at 17.68% (averagely from 1.65% to 2.03%). And it was confirmed by the particle size distribution analyzer and SEM image analysis that the distribution rates of PM2.5 decreased at 89.53% on average in FP, and at 88.57% in EP. The total dust concentration (mg/㎥) confirmed by tele-monitering system (TMS) decreased during the primary test from 2.6 to 1.7~1.9 and also the secondary test from 2.9 to 1.7~1.9.

Identification of Microplastics in Sea Salts by Raman Microscopy and FT-IR Microscopy (라만 및 FT-IR 현미경을 이용한 천일염 중 미세플라스틱 분석)

  • Cho, Soo-Ah;Cho, Won-Bo;Kim, Su-Bin;Chung, Jae-Hak;Kim, Hyo-Jin
    • Analytical Science and Technology
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    • v.32 no.6
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    • pp.243-251
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    • 2019
  • Microplastics (MP) are found in large quantities in the oceans, posing a major threat to the ecosystem. In Korea, MPs have been reported to be detected in sea salts. In order to analyze MPs, information on their composition, size, and shape is required. FT-IR microscopy is used frequently to measure sizes larger than 20 ㎛. Recently, however, Raman microscopy, which can analyze ultrafine plastics below 20 ㎛, has been applied extensively. In this study, 10.0 g samples of commercially available salts were dissolved and filtered through a 45 ㎛ mesh filter with a size of 25.4 mm × 25.4 mm. These filtered samples were then analyzed by both FT-IR microscopy and Raman microscopy. A total of four MPs, including three polyethylene (PE) of size 70-100 ㎛ and a polypropylene (PP) of size 170 ㎛, were detected by FT-IR microscopy, while 10 MPs, including nine PE of size 10-120 ㎛ and one polystyrene (PS) of size 40 ㎛, were detected by Raman microscopy. Approximately, 1,000 MPs/kg was estimated, which was almost two times higher than the previous reported levels (~550-681 particles/kg in sea salts); this is because Raman microscopy can detect much smaller MPs than FT-IR microscopy. A total of 113 particles were found using Raman microscopy: Carbon (35, 31.5 %), minerals (28, 25 %), and glass (16, 14.4 %) were dominant, forming around 70% of the total, but MPs (10, 8.8 %) and cellulose (5, 4.5 %) were also found. Raman microscopy has great potential as an accurate method for measuring MPs, as it can measure smaller size MPs than FT-IR microscopy. It also has a reduced sample preparation time.

Ni/Au Electroless Plating for Solder Bump Formation in Flip Chip (Flip Chip의 Solder Bump 형성을 위한 Ni/Au 무전해 도금 공정 연구)

  • Jo, Min-Gyo;O, Mu-Hyeong;Lee, Won-Hae;Park, Jong-Wan
    • Korean Journal of Materials Research
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    • v.6 no.7
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    • pp.700-708
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    • 1996
  • Electroless plating technique was utilized to flip chip bonding to improve surface mount characteristics. Each step of plating procedure was studied in terms pf pH, plating temperature and plating time. Al patterned 4 inch Si wafers were used as substrstes and zincate was used as an activation solution. Heat treatment was carried out for all the specimens in the temperature range from room temperature to $400^{\circ}C$ for $30^{\circ}C$ minutes in a vacuum furnace. Homogeneous distribution of Zn particles of size was obtained by the zincate treatment with pH 13 ~ 13.5, solution concentration of 15 ~ 25% at room temperature. The plating rates for both Ni-P and Au electroless plating steps increased with increasing the plating temperature and pH. The main crystallization planes of the plated Au were found to be (111) a pH 7 and (200) and (111) at pH 9 independent of the annealing temperature.

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