• Bulletin of the Korean Chemical Society
• /
• v.16 no.2
• /
• pp.138-143
• /
• 1995

Substituted 3-phenyl-1-silabutanes, 3-chlorophenyl-1-silabutane (1), 3-tolyl-1-silabutane (2), and 3-phenoxyphenyl-1-silabutane (3), were prepared in 68-98% yield by reduction of the corresponding substituted 3-phenyl-1,1-dichloro-1-silabutanes with LiAlH4. The dehydrogenative homopolymerization and copolymerization of the silanes were performed with Cp2MCl2/Red-Al (M=Ti, Hf) catalyst system. The molecular weights of the resulting polymers were in the of range 600 to 1100 (vs polystyrene) with degree of polymerization (DP) of 5 to 8 and polydispersity index (PDI) of 1.6 to 3.8. The monomer silanes underwent the dehydrogenative polymerization with Cp2TiCl2/Red-Al catalyst to produce somewhat higher molecular weight polysilanes compared with Cp2HfCl2/Red-Al catalyst.

• Proceedings of the KIEE Conference
• /
• 1995.07c
• /
• pp.1031-1033
• /
• 1995

The microwave dielectric properties of (1-x)$LaAlO_3-xCaTiO_3$ system were investigated. As the amount of $LaAlO_3$ increased, the value of the unloaded Q increased, but the dielectric constant(${\varepsilon}_r$) decreased. The temperature coefficient of resonant frequency(${\tau}_f$) of $5ppm/^{\circ}C$ was obtained from the composition of $0.35LaAlO_3-0.65CaTiO_3$ in which the values of ${\varepsilon}_r$ and $Q{\cdot}f_o$ were 42 and 32,500, respectively.

• Korean Chemical Engineering Research
• /
• v.57 no.1
• /
• pp.111-117
• /
• 2019

This study proposed the fabrication and deposition of high purity crystalline $core-TiO_2/shell-Al_2O_3$ nanoparticles. Morphological properties of $core-TiO_2$ and coated $shell-Al_2O_3$ were confirmed by transmission electron microscope (TEM) and transmission electron microscope - energy dispersive spectroscopy (TEM-EDS). The electrical properties of the prepared $core-TiO_2/shell-Al_2O_3$ nanoparticles were evaluated by applying them to a working electrode of a Dye-Sensitized Solar Cell (DSSC). The particle size, growth rate and the main crystal structure of $core-TiO_2$ were analyzed through dynamic light scattering system (DLS), scanning electron microscope (SEM) and X-ray diffraction (XRD). The $core-TiO_2$, which has a particle size of 17.1 nm, a thin film thickness of $20.1{\mu}m$ and a main crystal structure of anatase, shows higher electrical efficiency than the conventional paste-based dye-sensitized solar cell (DSSC). In addition, the energy conversion efficiency (6.28%) of the dye-sensitized solar cell (DSSC) using the $core-TiO_2/shell-Al_2O_3$ nanoparticles selectively controlled to the working electrode is 26.1% higher than the energy conversion efficiency (4.99%) of the dye-sensitized solar cell (DSSC) using the conventional paste method.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.25 no.8
• /
• pp.616-619
• /
• 2012

Oxides possess several interesting properties, such as ferroelectricity, magnetism, superconductivity, and multiferroic behavior, which can effectively be used oxide electronics based on epitaxially grown heterostructures. The microscopic properties of oxide interfaces may have a strong impact on the electrical transport properties of these heterostructures. It was recently demonstrated that high electrical conductivity and mobility can be achieved in the system of an ultrathin $LaAlO_3$ film deposited on a $TiO_2$-terminated $SrTiO_3$ substrate, which was a remarkable result because the conducting layer was at the interface between two insulators. In this study, we observe that the current-voltage characteristics exhibit $LaAlO_3$ thickness dependence of electrical conductivity in $TiO_2$-terminated $SrTiO_3$. We find that the $LaAlO_3$ layers with a thickness of up 3 unit cells, result in highly insulating interfaces, whereas those with thickness of 4 unit cells and above result in conducting interfaces.

• Transactions of Materials Processing
• /
• v.15 no.8 s.89
• /
• pp.615-620
• /
• 2006

The reduction behavior of $TiO_{2}$ in Al and Al/CaSi containing self-reducing $TiO_{2}$ briquettes(SRTB) was investigated. The maximum yield of Ti was expected with the slag composition of 45-55%CaO in the $CaO-Al_{2}O_{3}$ system. When $CaCO_{3}$ was used as a flux, the oxidation loss of reducing agent by $CO_{2}$ should be compensated, and therefore it leads to excessive requirement of the reducing agent. By using Al and CaSi mixture as a reducing agent of $TiO_{2}$, the reaction products both oxide and metal could be liquefied, and separated effectively with each other. As a result, the yield of Ti increases remarkably. The optimum mixing ratio of CaSi to Al is 78%CaSi-22%Al.

• Journal of the Microelectronics and Packaging Society
• /
• v.22 no.3
• /
• pp.19-23
• /
• 2015

In this study, two types of Au/TiW bump samples were fabricated by the electroplating process onto Al/Si and SiN/Si wafers for the COG (Chip On Glass) packaging. TiW was used as the UBM (Under Bump Metallurgy) material of the Au bump and it was deposited by a sputtering method under the sputtering powers ranges from 500 to 5000 Watt. We investigated the delamination phenomenas for the prepared samples as a function of the input sputtering powers. The stable interfacial adhesion condition was found to be 1500 Watt in sputtering power. In addition, the SAICAS (Surface And Interfacial Cutting Analysis System) measurement was used to find the adhesion strength of Au bumps for the prepared samples. TiW UBM films were deposited at the 1500 Watt sputtering power. As a results, there was a similar adhesion strengths between TiW/Au interfacial films on Al/Si and SiN/Si wafers. However, the adhesion strength of TiW UBM sputtering films on Al and SiN under films were 2.2 times differences, indicating 0.475 kN/m for Al/Si wafer and 0.093 kN/m for SiN/Si wafer, respectively.

• Journal of the Korean Ceramic Society
• /
• v.30 no.1
• /
• pp.1-6
• /
• 1993

Dielectric and piezoelectric porperties of pseudoternary xPb(Al2/3W1/3)O3-(1-x)Pb(Zr0.52Ti0.48)O3 (x=1~10mol%) ceramic system have been investigated as a function of the amount of PAW[Pb(Al2/3W1/3)O3] and sintered from 110$0^{\circ}C$ to 120$0^{\circ}C$ for 1hr. As the amount of PAW increases, the c/a of tetragonal structure decreases. The grain size was reduced with increasing the amount of PAW addition. However, the density, dielectric constant and electromechanical coupling factor(kp) exhibited a maximum value at the amount of 5mol% PAW addition.

• Journal of the Korean Ceramic Society
• /
• v.50 no.1
• /
• pp.50-56
• /
• 2013

Phosphorescent materials coated with titanium dioxide were fabricated and photocatalytic reactions between these materials and VOCs gases were examined. A thin film (approx. 100 nm) of nanosized $TiO_2$ was deposited on the $Sr_4Al_{14}O_{25}$ : $Eu^{2+}$, $Dy^{3+}$, $Ag^+$ phosphor using low-pressure chemical vapor deposition (LPCVD). The characteristics of the photocatalytic reaction were examined in terms of the decomposition of benzene gas using a gas chromatography (GC) system under ultraviolet (${\lambda}$ = 365 nm) and visible light (${\lambda}$ > 420 nm) irradiation. $TiO_2$-coated $Sr_4Al_{14}O_{25}$ : $Eu^{2+}$, $Dy^{3+}$, $Ag^+$ phosphor showed different photocatalytic behavior compared with pure $TiO_2$. $TiO_2$-coated phosphorescent materials showed a much faster photocatalytic decomposition of benzene gas under visible irradiation compared to the pure $TiO_2$ for which the result was practically negligible. This suggests that the extension of the absorption wavelength to visible light occurred through energy band bending by a heterojunction at the interface of the $Sr_4Al_{14}O_{25}-TiO_2$ composite. Also, the $Sr_4Al_{14}O_{25}-TiO_2$ composite showed the photocatalytic decomposition of benzene in darkness due to the photon light emitted from the $Sr_4Al_{14}O_{25}$ phosphors.

• Proceedings of the Korean Institute of Surface Engineering Conference
• /
• 2001.06a
• /
• pp.3-3
• /
• 2001

Recently TiN, TiAlN, CrN hardcoatings have adapted many industrial application such as die, mold and cutting tools because of good wear resistant and thermal stability. However, in terms of high speed process, general hard coatings have been limited by oxidation and thermal hardness drop. Especially in the case of PCB drill, high speed cutting and without lubricant process condition have not adapted these coatings until now. Therefore more recently, superhard nanocomposite coating which have superhard and good thermal stability have developed. In previous works, WC-TiAlN new nanocomposite film was investigated by cathodic arc ion plating system. Control of AI concentration, WC-TiAlN multi layer composite coating with controlled microstructure was carried out and provides additional enhancement of mechanical properties as well as oxidation resistance at elevated temperature. It is noted that microhardness ofWC-TiA1N multi layer composite coating increased up to 50 Gpa and got thermal stability about $900^{\circ}C$. In this study WC-TiAlN nanocomposite coating was deposited on PCB drill for enhancement of life time. The parameter was A1 concentration and plasma cleaning time for edge sharpness maintaining. The characteristic of WC-TiAlN film formation and wear behaviors are discussed with data from AlES, XRD, EDS and SEM analysis. Through field test, enhancement of life time for PCB drill was measured.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2008.06a
• /
• pp.208-209
• /
• 2008

Ni/Ti/Al multilayer system was tested for low-resistance ohmic contact formation to Al-implanted p-type 4H-SiC. Compared with conventional process using Ni, Ni/Ti/Al contact shows perfect ohmic behavior, and possesses much lower contact resistance of about $2.5\times10^{-4}\Omega{\cdot}cm^2$ after $930^{\circ}C$ RTA, which is about 2 orders of magnitude smaller than that of Ni contact. Contact resistance gradually increased as the RTA temperature was lowered in the range of 840 ~ $930^{\circ}C$, and about $3.4\times10^{-4}\Omega{\cdot}cm^2$ was obtained at the lowest RTA temperature of $840^{\circ}C$. Therefore, it was shown that RTA temperature for ohmic contact formation can be lowered to at least $840^{\circ}C$ without significant compromise of contact resistance.