A numerical study on the residual stress in LED encapsulment silicone considering cure process (경화공정을 고려한 LED 패키징 실리콘의 잔류음력에 대한 수치해석적 고찰)
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- Proceedings of the Korean Society for Technology of Plasticity Conference
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- 2009.10a
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- pp.323-327
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- 2009