Journal of Adhesion and Interface (접착 및 계면)

The Society of Adhesion and Interface, Korea (한국접착및계면학회)
권호 표지
DOI QR코드

DOI QR Code

Fabrication of Gold Nanowire Transparent Electrodes Utilizing Block Copolymer Double Patterning

블록공중합체 이중 패터닝을 이용한 금 나노선 투명전극 제작

  • Seong-Woon Yoon (Department of Materials Science and Engineering, Chungnam National University) ;
  • Jisoo Lim (Department of Materials Science and Engineering, Chungnam National University) ;
  • Jinman Kim (Department of Materials Science and Engineering, Chungnam National University) ;
  • Hyeong Min Jin (Department of Materials Science and Engineering, Chungnam National University)
  • 윤성운 (충남대학교 신소재공학과) ;
  • 임지수 (충남대학교 신소재공학과) ;
  • 김진만 (충남대학교 신소재공학과) ;
  • 진형민 (충남대학교 신소재공학과)
  • Received : 2024.10.28
  • Accepted : 2024.11.03
  • Published : 2025.03.31
Download PDF
⟨ Previous Next ⟩

Abstract

This paper discusses the fabrication and characterization of gold nanowire transparent electrodes using block copolymer nanolithography. A lamellar structure was formed in the block copolymer thin films to produce metal nanowires, and the connectivity of the metal nanowires was optimized by adjusting the volume ratio of the PS and PMMA blocks. In particular, by enhancing the connectivity of the PMMA blocks, the conductivity and transmittance of the gold nanowires were improved. Through double patterning, two layers of gold nanowires were formed, resulting in enhanced electrical properties. The double-layer gold nanowire electrode demonstrated higher conductivity and sufficient transmittance compared to the single-layer, meeting the requirements for both transparency and conductivity. This research presents the potential of gold nanowire transparent electrodes as an alternative to conventional ITO transparent electrodes and contributes to the development of transparent electrode technology for flexible electronic devices.

본 논문은 블록공중합체 나노리소그래피 기술을 이용한 금 나노선 투명 전극의 제작 및 특성 분석에 대해 다룬다. 블록공중합체 수직배향 라멜라 구조를 나노템플릿으로 활용하여 리프트오프 공정을 통해 금 나노선을 제작하였으며, 각 고분자 블록의 부피비를 조절하여 최종 금속 나노선의 연결성을 최적화하였다. 특히, 금 나노선으로 전사되는 폴리메틸메타크릴레이트 블록의 연결성을 높임으로써 금 나노선의 전기전도도 향상을 꾀하였으며, 이중 패터닝을 통해 두 층의 금 나노선을 형성하여 금 박막과 비교 가능한 향상된 전기전도성을 구현하였다. 이중층 금 나노선 전극은 단일층보다 높은 전기전도도와 적절한 투과도를 나타내며, 투명성과 전도성을 동시에 만족하는 투명전극으로 활용 가능할 것으로 기대된다.

Keywords

Acknowledgement

본 연구는 과학기술정보통신부의 재원으로 한국연구재단의 지원을 받아 수행되었음(RS-2024-00345469).

References

  1. K. Ellmer, Nat. Photonics, 6, 809 (2012). https://doi.org/10.1038/nphoton.2012.282
  2. D. T. Papanastasiou, A. Schultheiss, D. Muñoz- Rojas, C. Celle, A. Carella, J. P. Simonato and D. Bellet, Adv. Funct. Mater., 30, 1910225 (2020). https://doi.org/10.1002/adfm.201910225
  3. D. S. Hecht, L. Hu and G. Irvin, Adv. Mater., 23, 1482 (2011). https://doi.org/10.1002/adma.201003188
  4. T. Sannicolo, M. Lagrange, A. Cabos, C. Celle, J. P. Simonato and D. Bellet, Small, 12, 6052 (2016). https://doi.org/10.1002/smll.201602581
  5. T. C. Hauger, A. Zeberoff, B. J. Worfolk, A. L. Elias and K. D. Harris, Sol. Energy Mater. Sol. Cells, 124, 247 (2014). https://doi.org/10.1016/j.solmat.2014.02.007
  6. X. Lu, Y. Zhang and Z. Zheng, Adv. Electron. Mater., 7, 2001121 (2021). https://doi.org/10.1002/aelm.202001121
  7. L. He and S. C. Tjong, Mater. Sci. Eng. R Rep., 109, 1 (2016). https://doi.org/10.1016/j.mser.2016.08.002
  8. V. H. Nguyen, D. T. Papanastasiou, J. Resende, L. Bardet, T. Sannicolo, C. Jimenez, D. Munoz-Rojas, N. D. Nguyen and D. Bellet, Small, 18, 2106006 (2022). https://doi.org/10.1002/smll.202106006
  9. A. Polywka, T. Jakob, L. Stegers, T. Riedl and P. Gorrn, Adv. Mater., 27, 3755 (2015). https://doi.org/10.1002/adma.201501461
  10. S. Liang, Y. Li, T. Zhou, J. Yang, X. Zhou, T. Zhu, J. Huang, J. Zhu, D. Zhu, Y. Liu, C. He, J. Zhang and X. Zhou, Adv. Sci., 4, 1600313 (2017). https://doi.org/10.1002/advs.201600313
  11. J. Liang, H. Sheng, Q. Wang, J. Yuan, X. Zhang, Q. Su, E. Xie, W. Lan and C. J. Zhang, Nanoscale Adv., 3, 3502 (2021).
  12. C. Forrey, K. G. Yager and S. P. Broadaway, ACS Nano, 5, 2895 (2011).
  13. E. Hutter and J. H. Fendler, Adv. Mater., 16, 1685 (2004). https://doi.org/10.1002/adma.200400271
  14. J. Henzie, J. E. Barton, C. L. Stender and T. W. Odom, Acc. Chem. Res., 39, 249 (2006). https://doi.org/10.1021/ar050013n
  15. D. H. Kim, A. Suh, G. Park, D. K. Yoon and S. Y. Kim, ACS Appl. Mater. Interfaces, 13, 5772 (2021). https://doi.org/10.1021/acsami.0c19665
  16. I. P. Campbell, G. J. Lau, J. L. Feaver and M. P. Stoykovich, Macromolecules, 45, 1587 (2012). https://doi.org/10.1021/ma2025336
  17. M. J. Kim, W. I. Park, Y. J. Choi, Y. K. Jung and K. H. Kim, RSC Adv., 6, 21105 (2016). https://doi.org/10.1039/C6RA00350H
  18. B. K. Kuila and M. Stamm, J. Mater. Chem., 21, 14127 (2011). https://doi.org/10.1039/c1jm10990a
  19. E. K. Nava, A. Singh, L. O. Williams, J. C. Arango, K. A. Nagubandi, C. J. Pintro and S. A. Claridge, ACS Appl. Mater. Interfaces, 16, 44152 (2024). https://doi.org/10.1021/acsami.4c05086
  20. M. Kang, J. Lee and Y. Lee, Surf. Interface Anal., 46, 105 (2014). https://doi.org/10.1002/sia.5519
  21. J. Y. Kim, B. H. Kim, J. O. Hwang, S. J. Jeong, D. O. Shin, J. H. Mun, Y. J. Choi, H. M. Jin and S. O. Kim, Adv. Mater., 25, 1331 (2013). https://doi.org/10.1002/adma.201204131
  22. H. Jung, D. Hwang, E. Kim, B.-J. Kim, W. B. Lee, J. E. Poelma, J. Kim, C. J. Hawker, J. Huh, D. Y. Ryu and J. Bang, ACS Nano, 5, 6164 (2011). https://doi.org/10.1021/nn2006943
  23. J. Bang, J. Bae, P. Löwenhielm, C. Spiessberger, S. A. Given‐Beck, T. P. Russell and C. J. Hawker, Adv. Mater., 19, 4552 (2007). https://doi.org/10.1002/adma.200701866
  24. S.-J. Jeong, J. E. Kim, H.-S. Moon, B. H. Kim, S. M. Kim, J. B. Kim and S. O. Kim, Nano Lett., 9, 2300 (2009). https://doi.org/10.1021/nl9004833
  25. C. Choi, J. Park, K. L. Vincent Joseph, J. Lee, S. Ahn, J. Kwak, K. S. Lee and J. K. Kim, Nat. Commun., 8, 1765 (2017).
  26. C. Choi, J. Jang, S. Y. Park, J. Lee and J. K. Kim, ACS Appl. Polym. Mater., 2, 4090 (2020). https://doi.org/10.1021/acsapm.0c00710
  27. T. Zhu, Y. Yang, X. Yao, Z. Huang, L. Liu, W. Hu and X. Gong, ACS Appl. Mater. Interfaces, 12, 15456 (2020). https://doi.org/10.1021/acsami.9b22891
  28. F. Oytun, V. Kara, O. Alpturk and F. Basarir, Thin Solid Films, 636, 40 (2017). https://doi.org/10.1016/j.tsf.2017.05.029