반도체디스플레이기술학회지 (Journal of the Semiconductor & Display Technology)

한국반도체디스플레이기술학회 (The Korean Society Of Semiconductor & Display Technology)
권호 표지

반응소결 알루미나 공정 (RBAO)을 이용한 반도체 후공정용 뮬라이트(3Al2O3·2SiO2) 세라믹스 접합

Joining of Mullite (3Al2O3·2SiO2) Ceramics for Semiconductor Back-End Process by Reaction-Bonded Aluminum Oxide (RBAO) Process

  • 김태경 (국립금오공과대학교 신소재공학부) ;
  • 이현권 (국립금오공과대학교 신소재공학부)
  • Tae-Gyeong Kim (School of Advanced Materials Science and Engineering, Kumoh National Institute of Technology) ;
  • Hyun-Kwuon Lee (School of Advanced Materials Science and Engineering, Kumoh National Institute of Technology)
  • 투고 : 2024.08.15
  • 심사 : 2024.09.12
  • 발행 : 2024.09.30
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초록

In this study, we report on the joining of mullite ceramics using the reaction-bonded aluminum oxide method without applying any external pressure, in consideration of a possible multilayer ceramic substrate in semiconductor back-end process. For this purpose, Al/Al2O3/SiO2/Mullite powder mixture paste was applied to the joining surfaces between two parent mullite bodies of the same composition, and then sintered at 1,650 ℃ for 2 h in air, resulting in a dense and rigid mullite ceramic joints. Phase and microstructural analysis of the joined mullites showed that the reaction bonding by Al oxidation and thereafter mullite formation were completed during the heat treatment process. However, due to the difference in sintering behavior between the parent body and the joining layer, few pore of which size proportional to the joining layer thickness, were observed at some parts of the joining interface. The formation of the pore and its causes was discussed.

키워드

과제정보

본 연구는 국립금오공과대학교 교수연구년제에 의하여 연구된 실적물입니다.

참고문헌

  1. R. Roy, D. Das, P. K. Rout, "A Review of Advanced Mullite Ceramics", Eng. Sci., Vol. 18, pp.20-30, 2022.
  2. U. Chowdhry, A. W. Sleight, "Ceramic Substrates for Microelectronic Packaging", Annu. Rev. Mater. Sci., Vol. 17, pp. 323-340, 1987.
  3. M. Horiuchi, K. Mizushima, Y. Takeuchi, S. I. Wakabayashi, "New Mullite Ceramic Packages and Substrates", IEEE Trans. Compo. Hybrid. And Manuf. Tech., Vol 11, pp. 439-446, 1988.
  4. B. Biswal, D. K. Mishra, S. N. Das, S. Bhuyan, "Structural, Micro-structural, Optical and Dielectric Behavior of Mullite Ceramics", Ceram. Int., Vol 47, pp. 32252-32263, 2021.
  5. D.-E. Hyun, J.-B. Jeon, Y.-S. Lee, Y.-N. Kim, M. Kim, S. Ko, S.-M. Koo, W. H. Shin, C. Park, D.-W. Lee, J.-M. Oh, "Fabrication of Large-area Mullite-Cordierite Composite Substrates for Semiconductor Probe Cards and Enhancement of Their Reliability", Mater., Vol. 15, pp. 4283-4296, 2022.
  6. N. Claussen, R. Janssen, D. Holz, "Reaction Bonding of Aluminum Oxide (RBAO)", J, Ceram. Soc. Jpn., Vol. 103, pp. 749-758, 1995.
  7. R. J. Helling, H. Ferkel, "Using Alumina Nanopowder as Cement in Bonding of Alumina Ceramics", Phys. Stat. Sol, Vol. 175, pp.549-554, 1999.
  8. R. Chaim, B. G. Ravi, "Joining of Alumina Ceramics Using Nanocrystalline Tape Cast Interlayer", J. Mater. Res, Vol. 15, pp.1724-1728, 2000.
  9. L. Wang, F. Aldinger, "Joining of Advanced Ceramics in Green state", Mater, Lett, Vol. 54, pp.93-97, 2002.
  10. T. Besshi, T. Sato, T. Tanaka, J. Tamatani, "Joining of Ceramic Green Bodies and Sintering Characteristics", J. Mater. Process. Technol, Vol. 132, pp.269-273, 2003.
  11. K.C. Goretta, F. Gutierrez-Mora, J.J. Picciolo, J.L. Routbor, "Joining Alumina/Zirconia Ceramics", Mater. Sci. Eng. A, Vol. 341, pp.158-162, 2003.
  12. J.H Han, "Joining Partially-Sintered Alumina Ceramics Using a Mixture Slurry of Alumina Sol and Suspension", Ceram. Int, Vol. 40, pp.3123-3129, 2014.
  13. M. Hotta, N. Kondo, H. Kita, T. Ohji, Y. Izutsu, T. Arima, Y. Matsumura, "Joining of Alumina with an Alumina-Zirconia Insert under Low Mechanical Pressure",J. Asian. Ceram. Soc, Vol. 3, pp.59-63, 2015.
  14. J. Xia, K. Ren, Y. Wang, "One-second Flash Joining of Zirconia Ceramic by an Electric Field at Low Temperatures", Scr. Mater, Vol. 165, pp.34-38, 2019.
  15. T.G. Kim, K. Raju, H. K. Lee, "Pressure-less Joining of Alumina Ceramics by the Reaction-Bonded Aluminum Oxide (RBAO) Method", J. Eur. Ceram. Soc, Vol. 41, pp. 7976-7980, 2021.
  16. J.U. Mun, K. Raju, H.K. Lee, "Seamless Joining of ZTA Ceramics without the Application of Pressure", Ceram. Int, Vol. 49, pp. 1529-1534, 2023.
  17. M. Schmuker, W. Albers, H. Schneider, "Mullite Formation by Reaction Sintering of Quartz and α-Al2O3-A TEM Study", J. Eur. Ceram. Soc, Vol. 14, pp.511-515, 1994.
  18. P. Fielitz, G. Borchardt, M. Schmucker, H. Schneider, "Aluminum Grain Boundary Diffusion in Polycrystalline Mullite Ceramics", Phys. Chem. Minerals, Vol. 34, pp.431-436, 2007.
  19. F. Kara, J. A. Little, "Sintering Behaviour of Precursor Mullite Powders and Resultant Microstructures", J. Eur. Ceram. Soc, Vol. 16, pp.627-635, 1996.
  20. E. Tkalcec, H. Ivankovic, R. Nass, H. Schmdit, "Crystallization Kinetics of Mullite Formation in Diphasic Gels Containing Different Alumina Components" J. Eur. Ceram. Soc, Vol. 23, pp.1465-1475, 2003.
  21. O. Eso, Z. Fang, A. Grffo, "Liquid Phase Sintering of Functionally Graded WC-CO Composites", Int. J. Refract. Met. Hard Mat, Vol. 23, pp.233-241, 2005.
  22. O. J. Kwon, D. N. Yoon, "The Liquid Phase Sintering of W-Ni", edited by G. C. kuczynski, Proc. 5th, Int. Conf. on Sintering and Related Phenomena, Plenum Press, N.Y, pp.208-218, 1980.
  23. O. J. Kwon, D. N. Yoon, "Closure of Isolated Pores in Liquid Phase Sintering of W-Ni", Int. J. Powder Metall, Vol. 17, pp.127-133, 1981.