Acknowledgement
This research was supported by Basic Science Research Program through the National Research Foundation of Korea (NRF) funded by the Ministry of Education (2020R1 A6A1A03038697) and this work was supported by the National Research Foundation of Korea (NRF) grant funded by the Korea government (MSIT) (2021R1I1A3052426).
References
- X. Moya, S. Kar-Narayan, and N. D. Mathur, Nat. Mater., 13, 439 (2014). doi: https://doi.org/10.1038/nmat3951
- J. Li, D. Zhang, S. Qin, T. Li, M. Wu, D. Wang, Y. Bai, and X. Lou, Acta Mater., 115, 58 (2016). doi: https://doi.org/10.1016/j.actamat.2016.05.044
- A. K. Sagotra, D. Errandonea, and C. Cazorla, Nat. Commun., 8, 963 (2017). doi: https://doi.org/10.1038/s41467-017-01081-7
- S. G. Lu and Q. Zhang, Adv. Mater., 21, 1983 (2009). doi: https://doi.org/10.1002/adma.200802902
- A. S. Mischenko, Q. Zhang, J. F. Scott, R. W. Whatmore, and N. D. Mathur, Science, 311, 1270 (2006). doi: https://doi.org/10.1126/science.1123811
- X. Moya, E. Stern-Taulats, S. Crossley, D. Gonzalez-Alonso, S. Kar-Narayan, A. Planes, L. Manosa, and N. D. Mathur, Adv. Mater., 25, 1360 (2013). doi: https://doi.org/10.1002/adma.201203823
- D. H. Suh, D. H. Lee, and N. K. Kim, J. Eur. Ceram. Soc., 22, 219 (2002). doi: https://doi.org/10.1016/S0955-2219(01)00278-3
- S. K. Upadhyay, V. R. Reddy, P. Bag, R. Rawat, S. M. Gupta, and A. Gupta, Appl. Phys. Lett., 105, 112907 (2014). doi: https://doi.org/10.1063/1.4896044
- J. E. Lim, M. G. Lee, B. J. Park, S. H. Lee, J. S. Park, Y. G. Kim, and S. G. Lee, J. Ceram. Process. Res., 23, 583 (2022). doi: https://doi.org/10.36410/jcpr.2022.23.5.583
- M. S. Kwon, S. G. Lee, and K. M. Kim, J. Nanosci. Nanotechnol., 18, 5936 (2018). doi: https://doi.org/10.1166/jnn.2018.15592
- M. S. Lee, B. J. Park, J. E. Lim, S. H. Lee, M. G. Lee, J. S. Park, and S. G. Lee, J. Korean Inst. Electr. Electron. Mater. Eng., 34, 442 (2021). doi: https://doi.org/10.4313/JKEM.2021.34.6.7
- C. J. Lu and A. X. Kuang, J. Mater. Sci., 32, 4421 (1997). doi: https://doi.org/10.1023/A:1018692427602
- S. G. Lee, K. T. Kim, and Y. H. Lee, Thin Solid Films, 372, 45 (2000). doi: https://doi.org/10.1016/S0040-6090(00)01030-0
- S. G. Lee and Y. H. Lee, Thin Solid Films, 353, 244 (1999). doi: https://doi.org/10.1016/S0040-6090(99)00408-3
- J. Lin, Y. Li, X. Liu, Y. Li, W. Zheng, and W. Yang, RSC Adv., 10, 26256 (2020). doi: https://doi.org/10.1039/D0RA03859H
- A. J. Moulson and J. M. Herbert, Electroceramics: Materials, Properties, Applications (Chapman and Hall, London, 1990), p. 68.
- S. G. Lee, I. G. Park, S. G. Bae, and Y. H. Lee, Jpn. J. Appl. Phys., 36, 6880 (1997). doi: https://doi.org/10.1143/JJAP.36.6880
- J. W. Kim, J. S. Park, and S. G. Lee, J. Ceram. Process. Res., 22, 48 (2021). doi: https://doi.org/10.36410/jcpr.2021.22.1.48
- D. Viehland, D. Forst, Z. Xu, and J. F. Li, J. Am. Ceram. Soc., 78, 2101 (1995). doi: https://doi.org/10.1111/j.1151-2916.1995.tb08622.x
- X. Chen, S. Li, X. Jian, Y. Hambal, S. G. Lu, V. V. Shvartsman, D. C. Lupascu, and Q. M. Zhang, Appl. Phys. Lett., 118, 122904 (2021). doi: https://doi.org/10.1063/5.0042333
- X. P. Wang, J. Y. Wang, H. J. Zhang, Y. G. Yu, J. Wu, W. L. Gao, and R. I. Boughton, J. Appl. Phys., 103, 033513 (2008). doi: https://doi.org/10.1063/1.2838221
- X. Wang, F. Tian, C. Zhao, J. Wu, Y. Liu, B. Dkhil, M. Zhang, Z. Gao, and X. Lou, Appl. Phys. Lett., 107, 252905 (2015). doi: https://doi.org/10.1063/1.4938134
- H. Maiwa, Jpn. J. Appl. Phys., 54, 10NB08 (2015). doi: https://doi.org/10.7567/JJAP.54.10NB08
- S. Kar-Narayan and N. D. Mathur, J. Phys. D: Appl. Phys., 43, 032002 (2010). doi: https://doi.org/10.1088/0022-3727/43/3/032002