DOI QR코드

DOI QR Code

Ti-Al-Si-Cu-N 후막의 Cu 조성에 따른 기계적 특성과 미세구조 변화에 관한 연구

Influence of Cu Composition on the Mechanical Properties and Microstructure of Ti-Al-Si-Cu-N thick films

  • 이연학 (울산대학교 첨단소재공학부) ;
  • 허성보 (한국생산기술연구원 동남본부 첨단하이브리드생산기술센터) ;
  • 박인욱 (울산대학교 첨단소재공학부) ;
  • 김대일 (울산대학교 첨단소재공학부)
  • Yeon-Hak Lee (School of Materials Science and Engineering, University of Ulsan) ;
  • Sung-Bo Heo (Advanced Hybrid Production Technology Center, Korea Institute of Industrial Technology) ;
  • In-Wook Park (School of Materials Science and Engineering, University of Ulsan) ;
  • Daeil Kim (School of Materials Science and Engineering, University of Ulsan)
  • 투고 : 2023.10.10
  • 심사 : 2023.10.26
  • 발행 : 2023.10.31

초록

Quinary component of 3㎛ thick Ti-Al-Si-Cu-N films were deposited onto WC-Co and Si wafer substrates by using an arc ion plating(AIP) system. In this study, the influence of copper(Cu) contents on the mechanical properties and microstructure of the films were investigated. The hardness of the films with 3.1 at.% Cu addition exhibited the hardness value of above 42 GPa due to the microstructural change as well as the solid-solution hardening. The instrumental analyses revealed that the deposited film with Cu content of 3.1 at.% was a nano-composites with nano-sized crystallites (5-7 nm in dia.) and a thin layer of amorphous Si3N4 phase.

키워드

과제정보

본 과제(결과물)는 2023년도 교육부의 재원으로 한국연구재단의 지원을 받아 수행된 지자체-대학협력기반 지역혁신 사업의 결과입니다. (2021RIS-003)

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