Acknowledgement
본 연구는 '산업통상자원부'의 '신재생에너지 핵심기술개발사업'으로 (주) 산코코리아와 공동으로 수행된 연구 결과이다. 저자들은 SEM-EDS와 XRD 실험에 도움을 준 한국기초과학지원연구원(대구센터) 황기주 선생과 이상걸 박사께 감사드린다.
References
- J. M. Pearce, Futures, 34, 663 (2002). [DOI: https://doi.org/10.1016/S0016-3287(02)00008-3]
- A. Rose, Phys. Status Solidi A, 56, 11 (1979). [DOI: https://doi.org/10.1002/pssa.2210560102]
- T. S. Cho, M. S. Chae, and C. S. Cho, Trans. Electr. Electron. Mater., 15, 217 (2014). [DOI: https://doi.org/10.4313/TEEM.2014.15.4.217]
- T. S. Cho and C. S. Cho, Trans. Electr. Electron. Mater., 16, 20 (2015). [DOI: https://doi.org/10.4313/TEEM.2015.16.1.20]
- J. S. Jeong, N. Park, and C. Han, Microelectron. Reliab., 52, 2326 (2012). [DOI: https://doi.org/10.1016/j.microrel.2012.06.027]
- J. Wendt, M. Trager, R. Klengel, M. Petzold, D. Schade, and R. Sykes, Proc. 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (IEEE, Las Vegas, USA, 2010) p. 1. [DOI: https://doi.org/10.1109/ITHERM.2010.5501299]
- Y. S. Son and T. S. Cho, J. Korean Inst. Electr. Electron. Mater. Eng., 28, 332 (2015). [DOI: https://doi.org/10.4313/JKEM.2015.28.5.332]
- J. H. Jeong and T. S. Cho, J. Korean Inst. Electr. Electron. Mater. Eng., 30, 119 (2017). [DOI: https://doi.org/10.4313/JKEM.2017.30.2.119]
- F. Guo, S. Choi, J. P. Lucas, and K. N. Subramanian, Soldering Surf. Mount Technol., 13, 7 (2001). [DOI: https://doi.org/10.1108/09540910110361668]
- W. B. Hampshire, Soldering Surf. Mount Technol., 5, 49 (1993). [DOI: https://doi.org/10.1108/eb037826]
- C. Y. Liu, C. Chen, and K. N. Tu, J. Appl. Phys., 88, 5703 (2000). [DOI: https://doi.org/10.1063/1.1319327]
- J. H. Lee, Y. H. Lee, and Y. S. Kim, Scripta Mater., 42, 789 (2000). [DOI: https://doi.org/10.1016/S1359-6462(99)00431-5]
- I.K.A. Qader and Y. B. Zainuddin, Int. J. Bus. Manage., 6, 240 (2011). [DOI: https://doi.org/10.5539/ijbm.v6n3p240]
- J. S. Jeong, C. M. Oh, G. Y. Goo, Y. H. Yoon, U. H. Hwang, and W. S. Hong, J. Weld. Joining, 29, 11 (2011). [DOI: https://doi.org/10.5781/KWJS.2011.29.4.373]
- Y. Liu and K. N. Tu, Mater. Today Adv., 8, 100115 (2020). [DOI: https://doi.org/10.1016/j.mtadv.2020.100115]
- Y. Shu, K. Rajathurai, F. Gao, Q. Cui, and Z. Gu, J. Alloys Compd., 626, 391 (2015). [DOI: https://doi.org/10.1016/j.jallcom.2014.11.173]
- H. Deng, K. Wang, Y. Duan, W. Zhang, and J. Hu, Coatings, 12, 429 (2022). [DOI: https://doi.org/10.3390/coatings12040429]
- J. F. Li, S. H. Mannan, M. P. Clode, D. C. Whalley, and D. A. Hutt, Acta Mater., 54, 2907 (2006). [DOI: https://doi.org/10.1016/j.actamat.2006.02.030]
- J. W. Yoon, C. B. Lee, and S. B. Jung, Mater. Trans., 43, 1821 (2002). [DOI: https://doi.org/10.2320/matertrans.43.1821]
- J. Gong, C. Liu, P. P. Conway, and V. V. Silberschmidt, Mater. Sci. Eng. A, 427, 60 (2006). [DOI: https://doi.org/10.1016/j.msea.2006.04.034]
- L. R. Garcia, W. R. Osόrio, and A. Garcia, Mater. Des., 32, 3008 (2011). [DOI: https://doi.org/10.1016/j.matdes.2010.12.046]
- R. A. Islam, Y. C. Chan, W. Jillek, and S. Islam, Microelectro. J., 37, 705 (2006). [DOI: http://doi.org/10.1016/j.mejo.2005.12.010]
- L. R. Garcia, W. R. Osόrio, L. C. Peixoto, and A. Garcia, Mater. Charact., 61, 212 (2010). [DOI: https://doi.org/10.1016/j.matchar.2009.11.012]
- H. Yousuf, M. Q. Khokhar, S. Chowdhury, D. P. Pham, Y. Kim, M. Ju, Y. Cho, E. C. Cho, and J. Yi, Curr. Photovoltaic Res., 9, 75 (2021). [DOI: https://doi.org/10.21218/CPR.2021.9.3.075]
- J. Glazer, J. Electron. Mater., 23, 693 (1994). [DOI: https://doi.org/10.1007/BF02651361]
- R. Kubiak, M. Wolcyrz, and W. Zacharko, J. Less-Common Met., 65, 263 (1979). [DOI: https://doi.org/10.1016/0022-5088(79)90116-4]
- Z. Mei and J. W. Morris, J. Electron. Mater., 21, 401 (1992). [DOI: https://doi.org/10.1007/BF02660403]
- D. F. Susan, J. A. Rejent, P. F. Hlava, and P. T. Vianco, J. Mater. Sci., 44, 545 (2009). [DOI: https://doi.org/10.1007/s10853-008-3083-2]