한국전기전자재료학회논문지 (Journal of the Korean Institute of Electrical and Electronic Material Engineers)

  • 제36권2호
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  • Pages.186-190
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  • 2023
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  • 1226-7945(pISSN)
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  • 2288-3258(eISSN)
한국전기전자재료학회 (The Korean Institute of Electrical and Electronic Material Engineers)
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태양광 리본용 저융점 Sn-In (wt%) 무연 솔더 연구

A Study on Low-Melting Temperature Sn-In (wt%) Pb-Free Solders for Photovoltaic Ribbons

  • 신동현 (경북대학교 나노소재공학부) ;
  • 이승한 (경북대학교 나노소재공학부) ;
  • 조태식 (경북대학교 나노소재공학부) ;
  • 김일섭 ((주)산코코리아 개발팀)
  • Dong-Hyeon Shin (Department of Nano Materials Engineering, Kyungpook National University) ;
  • Seung-Han Lee (Department of Nano Materials Engineering, Kyungpook National University) ;
  • Tae-Sik Cho (Department of Nano Materials Engineering, Kyungpook National University) ;
  • Il-Sub Kim (Development Team, Sanko Korea Co.)
  • 투고 : 2023.01.07
  • 심사 : 2023.01.17
  • 발행 : 2023.03.01
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초록

We studied the various characteristics of Sn-In (wt%) Pb-free solders for photovoltaic ribbon application. The solders near the eutectic composition of Sn48In52 (wt%) existed in InSn4 and In3Sn alloy phases, and in In crystal phase, but not in Sn crystal phase. In addition, the InSn4 phase (γ-alloy) existed separately from the In3Sn (β-alloy) and the In phase confirmed by an SEM-EDS-mapping. The melting temperature of the eutectic solder of Sn48In52 (wt%) was 119.2℃, and when the Sn content decreased in reference to the eutectic composition, it slightly increased to 121.4℃, but when the Sn content increased, it remained almost constant at 119.1℃. The peel strength of the ribbon plated with the Sn42In58 (wt%) solder was 38.7 N/mm2, and it tended to increase when the Sn content increased. The peel strength of the eutectic Sn48In52 (wt%) solder was 53.6 N/mm2, and that of the Sn51In49 (wt%) solder was 61.6 N/mm2 that was the highest.

키워드

과제정보

본 연구는 '산업통상자원부'의 '신재생에너지 핵심기술개발사업'으로 (주) 산코코리아와 공동으로 수행된 연구 결과이다. 저자들은 SEM-EDS와 XRD 실험에 도움을 준 한국기초과학지원연구원(대구센터) 황기주 선생과 이상걸 박사께 감사드린다.

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