Journal of the Semiconductor & Display Technology (반도체디스플레이기술학회지)

The Korean Society Of Semiconductor & Display Technology (한국반도체디스플레이기술학회)
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A Study on the EMC Characteristics of Bare PCB for Reliability of High-Multilayer PCB

고다층 보드 신뢰성 확보를 위한 베어보드 EMC 특성 연구

  • Jin Sung Park (Department of Electrical Engineering, Tech University of Korea) ;
  • Kihyun Kim (Department of Mechatronics Engineering, Tech University of Korea) ;
  • Kyoung Min Kim (Department of Advanced Materials Engineering, Tech University of Korea) ;
  • Sung Yong Kim (Department of Electrical Engineering, Tech University of Korea)
  • 박진성 (한국공학대학교 전자공학부) ;
  • 김기현 (한국공학대학교 메카트로닉스공학부) ;
  • 김경민 (한국공학대학교 신소재공학과) ;
  • 김성용 (한국공학대학교 전자공학부)
  • Received : 2023.03.06
  • Accepted : 2023.03.22
  • Published : 2023.03.31
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Abstract

In the case of high-speed data transmission on high multilayer boards, signal coherence is a problem, especially due to the via hole, and a solution to improve return loss or insertion loss by applying a back drill to the via hole is being proposed. In this paper, Near-Field Electromagnetic measurements were made on a high multilayer board to determine how the presence or absence of back drill affects signal consistency. For this purpose, we used a signal generator, spectrum analyzer, and EMC scanner on a test board to determine if it is possible to distinguish between areas with and without back drill in the via holes of the stubs on the board. Also, we analyzed the measured value of S11, S21 and EMC etc. for how much it improves the signal attenuation of the stub with back drill. Through this, we knew that less electromagnetic waves are generated the stub via with back drill. At future research, we will analyze how much it improves the signal loss and electromagnetic waves due to the depth of back drill.

Keywords

Acknowledgement

이 논문은 2022년도 정부(산업통상자원부)의 재원으로 산업단지공단의 지원을 받아 수행된 연구(PKK21013, 2022년 산업집적지경쟁력강화사업)과 한국산업기술진흥원의 지원을 받아 수행된 연구(P0008458, 2022년 산업혁신인재성장지원사업) 결과입니다.

References

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