과제정보
본 연구는 산업통상자원부 및 산업기술평가관리원(KEIT) 연구비 지원을 통해 수행되었습니다. (Nos. 20023103 and KM230314).
참고문헌
- Bourjot, E., & Fournel, F. (2022, September-October). Direct bonding: a key enabler for 3D technologies. Chip Scale Review, 6-7.
- Lee, S. H., Chen, K. N., & Lu, J. J. Q. (2011). Wafer-to-wafer alignment for three-dimensional integration: A review. Journal of Microelectromechanical Systems, 20(4), 885-898. https://doi.org/10.1109/JMEMS.2011.2148161
- Hynix Semiconductor Co., Ltd. (2008). "Method for Defect Inspection on a Wafer" (Patent No: 10-2008-0061938). Korean Intellectual Property Office.
- Okamoto, K., Sugiyama, M., & Mabu, S. (2020). Importance of Advanced Metrology in Semiconductor Industry and Value-added Creation Using AI/ML. e-Journal of Surface Science and Nanotechnology, 18, 214-222. https://doi.org/10.1380/ejssnt.2020.214
- Samsung Electronics Co., Ltd. (2004). "Method for Recognizing Alignment Mark Patterns" (Patent No: 10-2004-0017132). Korean Intellectual Property Office.
- Lee, T. H., & Park, C. S. (2023). Real-Time Fire Detection Method Using YOLOv8. Journal of the Semiconductor & Display Technology, 22(2), 77.
- Joseph Redmon, Santosh Divvala, Ross Girshick, Ali Farhadi, "You Only Look Once: Unified, Real-time Object Detection", IEEE Conference on Computer Vision and Pattern Recognition, pp.779-788, 2015.
- G. Ang, et al. "A novel application for real-time arrhythmia detection using YOLOv8." arXiv preprint arXiv:2305.16727, 2023.
- RangeKing (Range King).GitHub
- Lee, Y.-H., & Kim, Y. (2020). Comparison of CNN and YOLO for Object Detection. Journal of the Semiconductor & Display Technology, 19(1), 85.