과제정보
이 논문은 산업통산자원부(MOTIE)에서 지원하는 2023년도 전자부품산업 기술개발(1415185203), 산업혁신인재양성사업(P0008458), 차세대지능형반도체기술개발(20023103) 그리고 한국공학대학교 연구년 지원을 받아 연구되었음.
참고문헌
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