과제정보
This work was partially supported by the Korea Institute for Advancement of Technology (KIAT) grant (P0008458, HRD Program for Industrial Innovation) funded from the Ministry of Trade, Industry & Energy (MOTIE, Korea), and the Technology Innovation Program (Public-private joint investment semiconductor R&D program (K-CHIPS) to foster high-quality human resources) (RS-2023-00236091, Hybrid bonding technologies for 3D package interconnects).
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