과제정보
This work was supported by Korea Institute of Energy Technology Evaluation and Planning(KETEP) grant funded by the Korea government(MOTIE)(20202020800360, Innovative Energy Remodeling Total Technologies(M&V, Design, Package Solutions, and Testing & Verifications Technologies) for the Aging Public Buildings). This research was also supported by a National Research Foundation of Korea (NRF) grant funded by the Korean Government (MEST) (2021M2E6A1084690).
참고문헌
- Y. Wang, X. Dai, G. Liu, Y. Wu, Y. Li, and S. Jones, "Status and Trend of Power Semiconductor Module Packaging for Electric Vehicles", Modeling and Simulation for Electric Vehicle Applications, M. A. Fakhfakh, InTech, 2016, https://www.intechopen.com/chapters/51578
- J. U. Knickerbocker, P. S. Andry, E. Colgan, B. Dang, T. Dickson, X. Gu, C. Haymes, C. Jahnes, Y. Liu, J. Maria, R. J. Polastre, C. K. Tsang, L. Turlapati, B. C. Webb, L. Wiggins, and S. L. Wright, "2.5 D and 3D technology challenges and test vehicle demonstrations", 2012 IEEE 62nd Electronic Components and Technology Conference, IEEE, 12906710 (2012).
- J. Lau, P. Tzeng, C. Lee, C. Zhan, M. Li, J. Cline, K. Saito, Y. Hsin, P. Chang, Y. Chang, J. Chen, S. Chen, C. Wu, H. Chang, C. Chien, C. Lin, T. Ku, R. Lo, and M. Kao, "Redistribution layers (RDLs) for 2.5 D/3D IC integration", International Symposium on Microelectronics, 2013(1), 000434- 000441 (2013).
- C. O'Mahony, O. Olszewski, R. Hill, R. Houlihan, C. Ryan, K. Rodgers, C. Kelleher, R. Duane, and M. Hill, "Reliability assessment of MEMS switches for space applications: laboratory and launch testing", Journal of Micromechanics and Microengineering, 24(12), 125009 (2014). https://doi.org/10.1088/0960-1317/24/12/125009
- P. B. Hassell, "Advanced warpage characterization: location and type of displacement can be equally as important as magnitude", The Proceedings of Pan Pacific Microelectronics Symposium Conference (2001).
- B. J. Aleck, "Thermal stresses in a rectangular plate clamped along an edge", 16(2), 118-122 (1949).
- M. Lee and I. Jasiuk, "Asymptotic expansions for the thermal stresses in bonded semi-infinite bimaterial strips", Journal of Electronic Packaging, 113(2), 173-177 (1991). https://doi.org/10.1115/1.2905383
- Y. Q. Wang, K. H. Low, F. X. Che, H. L. J. Pang, and S. P. Yeo, "Modeling and simulation of printed circuit board drop test", Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003), IEEE, 7914998 (2003).
- J. Wu, R. R. Zhang, S. Radons, X. Long, and K. K. Stevens, "Vibration analysis of medical devices with a calibrated FEA model", Computers & Structures, 80(12), 1081-1086 (2002). https://doi.org/10.1016/S0045-7949(02)00067-6
- D. -H. Kim, S. -J. Joo, D. -O. Kwak, and H. -S. Kim, "Anisotropic viscoelastic shell modeling technique of copper patterns/photoimageable solder resist composite for warpage simulation of multi-layer printed circuit boards", Journal of Micromechanics and Microengineering, 5(10), 105016 (2015).
- C. T. Sun and R. S. Vaidya, "Prediction of composite properties from a representative volume element", Composites Science and Technology, 56(2), 171-179 (1996). https://doi.org/10.1016/0266-3538(95)00141-7
- S. -J. Joo, B. Park, D. -H. Kim, D. -O. Kwak, I. -S. Song, J. Park, and H. -S. Kim, "Investigation of multilayer printed circuit board (PCB) film warpage using viscoelastic properties measured by a vibration test", Journal of Micromechanics and Microengineering, 25(3), 035021 (2015). https://doi.org/10.1088/0960-1317/25/3/035021
- E. Catsiff and A. V. Tobolsky, "Stress-relaxation of polyisobutylene in the transition region (1, 2)", Journal of Colloid Science, 10(4), 375-392 (1955). https://doi.org/10.1016/0095-8522(55)90052-0
- K. Kwok and S. Pellegrino, "Micromechanical modeling of deployment and shape recovery of thin-walled viscoelastic composite space structures", 53rd AIAA/ASME/ASCE/AHS/ ASC Structures, Structural Dynamics and Materials Conference (2012).
- P. B. Lin, C. -T. Ko, W. -T. Ho, C. -H. Kuo, K. -W. Chen, Y. -H. Chen, and T. -J. Tseng, "A comprehensive study on stress and warpage by design, simulation and fabrication of RDL-first panel level fan-out technology for advanced package", 2017 IEEE 67th Electronic Components and Technology Conference (ECTC), IEEE, 17083079 (2017).
- H. Ding, R. E. Powell, C. R. Hanna, and I. C. Ume, "Warpage measurement comparison using shadow moire and projection moire methods", IEEE Transactions on Components and Packaging Technologies, 25(4), 714-721 (2002). https://doi.org/10.1109/TCAPT.2002.808010