Elastomers and Composites

The Rubber Society of Korea (한국고무학회)
권호 표지
DOI QR코드

DOI QR Code

3-Dimensional Thermoforming Computer Simulation Considering Orthotropic Property of Film

  • Son, Hyun-Myung (Dept. of Mechanical Information Engineering, Graduate School of Seoul National University of Science & Technology) ;
  • Yoon, Seok-Ho (I-Components Co., Ltd.) ;
  • Lee, Ki-Ho (I-Components Co., Ltd.) ;
  • Lyu, Min-Young (Dept. of Mechanical Information Engineering, Graduate School of Seoul National University of Science & Technology)
  • Received : 2022.09.13
  • Accepted : 2022.09.23
  • Published : 2022.09.30
Download PDF
⟨ Previous Next ⟩

Abstract

The tensile properties of the extruded PC film were measured in the extrusion direction and perpendicular to the extrusion direction. The measured properties were the elastic modulus and Poisson's ratio at the glass transition temperature of PC. The measured orthotropic properties of the film were used for the computer simulation of vacuum forming. In this simulation, three mold shapes were tested: dome, trapezoid, and cubic, and the vacuum was applied between the mold surface and the heated film. The stress, strain, thickness, and stretch ratio distributions of the film in different mold shapes were observed and compared. The thermoforming simulation method used in this study and the obtained results, considering the determined orthotropic properties, can be applied to the thermoforming of various three-dimensional shapes.

Keywords

Acknowledgement

이 연구는 2022년도 산업통상자원부 및 산업기술평가관리원(KEIT) 연구비 지원에 의한 연구임(20014372).

References

  1. Shin, Yoo Bin, et al. "Modified inverted layer processing of ultrathin touch sensor impregnating Ag nanowires with both enlarged surface coverage of conductive pathways and ultralow roughness", Electron. Mater. Lett., 16, 247 (2020). https://doi.org/10.1007/s13391-020-00213-4
  2. Hwang, Bu-Yeon, et al. "Highly stretchable and transparent electrode film based on SWCNT/Silver nanowire hybrid nanocomposite", Composites, Part B., 151, 1 (2018). https://doi.org/10.1016/j.compositesb.2018.06.004
  3. Chen, Hui-Li, Rean-Der Chien, and Shia-Chung Chen, "Using thermally insulated polymer film for mold temperature control to improve surface quality of microcellular injection molded parts", Int. Commun. Heat Mass Transfer., 35, 991 (2008). https://doi.org/10.1016/j.icheatmasstransfer.2008.04.017
  4. Truckenmuller, Roman, et al. "Thermoforming of film-based biomedical microdevices", Adv. Mater., 23, 1311 (2011). https://doi.org/10.1002/adma.201003538
  5. Srinivasan, K. P. and T. Muthuramalingam, "In-depth scrutinization of In-Mold Electronics for Automotive applications", J. Phys.: Conf. Ser., (2021).
  6. Gong, Yao, Kyoung Je Cha, and Jang Min Park, "Deformation characteristics and resistance distribution in thermoforming of printed electrical circuits for in-mold electronics application", J. Adv. Manuf. Technol., 108, 749 (2020). https://doi.org/10.1007/s00170-020-05377-9
  7. Kim, Gugyong, Kwango Lee, and Sungsu Kang, "Prediction of the film thickness distribution and pattern change during film insert thermoforming", Polym. Eng. Sci., 49, 2195 (2009). https://doi.org/10.1002/pen.21467
  8. Lee, H. S. and Y. G. Yoo, "Numerical and experimental analysis of laminated-film thickness variation in vacuum-assisted thermoforming", Trans. Mater. Process, 22, 171 (2013). https://doi.org/10.5228/KSTP.2013.22.3.171
  9. Atmani, Oualid, et al. "Experimental investigation and constitutive modelling of the deformation behaviour of high impact polystyrene for plug-assisted thermoforming", Mech. Ind., 21, 607 (2020). https://doi.org/10.1051/meca/2020084
  10. Chang, Yao-Wen and Jung-Ho Cheng, "Numerical and experimental investigation of polycarbonate vacuum-forming process", J. Chin. Inst. Eng., 36, 831 (2013). https://doi.org/10.1080/02533839.2012.747059
  11. Nied, H. F., C. A. Taylor, and H. G. Delorenzi, "Three-dimensional finite element simulation of thermoforming", Polym. Eng. Sci., 30, 1314 (1990). https://doi.org/10.1002/pen.760302009
  12. Erchiqui, Fouad, Augustin Gakwaya, and Mohamed Rachik, "Dynamic finite element analysis of nonlinear isotropic hyperelastic and viscoelastic materials for thermoforming applications", Polym. Eng. Sci., 45, 125 (2005). https://doi.org/10.1002/pen.20238
  13. Nam, Gi Joon, Jae Wook Lee, and Kyung Hyun Ahn, "Three-dimensional simulation of thermoforming process and its comparison with experiments", Polym. Eng. Sci., 40, 2232 (2000). https://doi.org/10.1002/pen.11355
  14. Kang, Dong Jun, et al. "Silica nanoparticle-embedded urethane acrylate nanohybrid thermosets for photo-patternable transparent hard coating", Int. Polym. Sci. Technol., 105, 19 (2016).
  15. Li, Junpeng, et al. "Healable capacitive touch screen sensors based on transparent composite electrodes comprising silver nanowires and a furan/maleimide diels-alder cycloaddition polymer", ACS Nano., 8, 12874 (2014). https://doi.org/10.1021/nn506610p
  16. Seo, Jiae, et al. "Foldable and extremely scratch-resistant hard coating materials from molecular necklace-like crosslinkers", ACS Appl. Mater. Interfaces, 11, 27306 (2019). https://doi.org/10.1021/acsami.9b05738
  17. Rudolph Szilard, Theories and Applications of Plate Analysis: Classical, Numerical and Engineering Methods, Wiley, USA, 2004.
  18. M.-Y. Lyu, Principles and Applications of Injection Molding, Gyomoon, Seoul, South of Korea, 2022.