Acknowledgement
This work was supported by the National Research Foundation of Korea (NRF) grants funded by the Korean Government (No. 2022R1I1A2073224 and No. 2022M3 C1A3090850 (Ministry of Science and ICT (MSIT)). We thank Dr. Kinam Kim, Chairman of Samsung Electronics and the process development team of the Semiconductor R&D Center for their help in manufacturing of the master mold wafer.
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