Journal of Power Electronics

The Korean Institute of Power Electronics (전력전자학회)
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Practical power module implemented with bare dies on aluminum metal PCB substrate for AC-to-DC bridgeless dual-boost power factor corrected rectifier

  • Jang, Jinhaeng (Power Modular Team, Home Entertainment Company, LG Electronics)
  • Received : 2021.12.12
  • Accepted : 2022.01.25
  • Published : 2022.04.20
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Abstract

This paper presents the design methods and practical implementations of a power module embedded into a power supply board. The proposed power module was developed for a 500 W of-line AC-to-DC bridgeless dual-boost power factor corrected rectifier. Switching devices such as silicon-based transistor and silicon carbide-based diode were applied. An aluminum metal PCB substrate was utilized to integrate them. Bare dies and copper traces were interconnected with bonding wires. The proposed power module was constructed with flexible components, leading to effective PCB layout design and thermal design. The PCB layout design focused on three major current loops, passing through the switching devices. The parasitic inductances distributed at floating node and common source were particularly minimized. It resulted in reliable and fast switching characteristics. Meanwhile, the effective thermal design for the power module lowered the total thermal resistance, such that the required volume for heat spreading was reduced. The power supply board using the proposed power module showed remarkably increased power density. The superior performance was verified and compared with the performance of a conventional power supply board through computer simulations and experimental measurements.

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References

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