Acknowledgement
This study is supported by Fast Wireless Charging Technology, JZX5Y20190221001001.
References
- Yan, Z., Song, B., Zhang, Y., Zhang, K., Mao, Z., Hu, Y.: A rotation-free wireless power transfer system with stable output power and efficiency for autonomous underwater vehicles. IEEE Trans. Power Electron. 34(5), 4005-4008 (2019) https://doi.org/10.1109/tpel.2018.2871316
- Li, S., Tao, C.: Optimization of T-type compensation network for a certain power fluctuation tolerance of the dynamic wireless power transmission. In: 2018 IEEE 4th Southern Power Electronics Conference (SPEC), Singapore, Singapore, 1-5 (2018)
- Anderson, J.A., Kolar, J.W.: Accurate calorimetric switching loss measurement for 900 V 10 m $\Omega$ SiC Mosfets. IEEE Trans. Power Electron. 32(12), 8963-8968 (2017) https://doi.org/10.1109/TPEL.2017.2701558
- Millan, J., Godignon, P., Rebollo, J.: A survey of wide bandgap power semiconductor devices. IEEE Trans. Power Electron. 29(5), 2155-2163 (2014) https://doi.org/10.1109/TPEL.2013.2268900
- Hu, B., et al.: Failure and reliability analysis of a SiC power module based on stress comparison to a Si device. IEEE Trans. Device Mater. Relib. 17(4), 727-737 (2017) https://doi.org/10.1109/TDMR.2017.2766692
- Ciappa, M.: Selected failure mechanisms of modern power modules. Microelectron. Reliab. 42(4), 653-667 (2002) https://doi.org/10.1016/S0026-2714(02)00042-2
- Liebig, S., Lutz, J.: Efficiency and lifetime of an active power filter with SiC-MOSFETs for aerospace application. In: PCIM Europe 2014, International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, Nuremberg, Germany, 1-9 (2014)
- Liebig, S., Engler, A., Lutz, J.: Design and evaluation of state of the art rectifiers dedicated for a 46 kW E-ECS aerospace application with respect to power density and reliability. In: Proceedings of the 2011 14th European Conference on Power Electronics and Applications, Birmingham, 1-10 (2011)
- McCluskey, F.P., Dash, M., Huff, D.: Reliability of high temperature solder alternatives. Microelectron. Reliab. 46(9), 1910-1914 (2006) https://doi.org/10.1016/j.microrel.2006.07.090
- Dicarlo, J.A.: Creep of chemically vapour deposited SiC fibres. J. Mater. Sci. 21(1), 217-224 (1986) https://doi.org/10.1007/BF01144723
- Zhu, S., Mizuno, M., Kaya, H.: Creep and fatigue behavior of SiC fiber reinforced SiC composite at high temperatures. Mater. Sci. Eng., A 225(1-2), 69-77 (1997) https://doi.org/10.1016/S0921-5093(96)10872-8
- Herrmann, T., Feller, M., Licht, T.: Power cycling induced failure mechanisms in solder layers. In: 2007 European Conference on Power Electronics and Applications, Aalborg, Denmark, 1-7 (2007)
- Wang, R., Tan, L., Huang, X.: Analysis, design, and implementation of junction temperature fluctuation tracking suppression strategy for SiC MOSFETs in wireless high-power transfer. IEEE Trans. Power Electron. 36(1), 1193-1204 (2021) https://doi.org/10.1109/tpel.2020.3004922
- Liu, H., et al.: Dynamic wireless charging for inspection robots based on decentralized energy pickup structure. IEEE Trans. Ind. Inf. 14(4), 1786-1797 (2018) https://doi.org/10.1109/tii.2017.2781370
- Ma, K., Blaabjerg, F.: Reactive power influence on the thermal cycling of multi-MW wind power inverter. IEEE Trans. Ind. Appl. 49(2), 922-930 (2013) https://doi.org/10.1109/TIA.2013.2240644
- Wang, H., Yu, X.: Control of parallel connected power converters for low voltage microgrid-part II: dynamic electrothermal modeling. IEEE Trans. Power Electron. 25(12), 2971-2980 (2010) https://doi.org/10.1109/TPEL.2010.2087394
- Zanchetta, P., Bifaretti, S., Tarisciotti, L.: Distributed commutations pulse-width modulation technique for high-power AC/DC multi-level converters. IET Power Electron. 5(6), 909-919 (2012) https://doi.org/10.1049/iet-pel.2011.0281
- Wang, J.-C., Su, Y.-L., Jiang, J.-A.: A novel multipoint direct-estimation method for the maximum power point tracking of photovoltaic modules under partially shaded irradiation conditions. In: 2012 IEEE International Energy Conference and Exhibition (ENERGYCON), Florence, Italy (2012)
- Saleki, A., Bina, M.T.: Lifetime extension by varying switching frequency of inverters based on junction temperature estimation. In: 2018 9th Annual Power Electronics, Drives Systems and Technologies Conference (PEDSTC), Tehran, Iran (2018)
- Polom, T.A., Wang, B.: Control of junction temperature and its rate of change at thermal boundaries via precise. IEEE Trans. Ind. Appl. 53(5), 4796-4806 (2017) https://doi.org/10.1109/TIA.2017.2710038
- Ouhab, M., Khatir, Z., Wang, M.-X.: New analytical model for real-time junction temperature estimation of multichip power module used in a motor drive. IEEE Trans. Power Electron. 33(6), 5292-5301 (2018) https://doi.org/10.1109/tpel.2017.2736534
- Qiu, Z., Wen, X.: Reliability modeling and analysis of SiC MOSFET power modules. In: IECON 2017-43rd Annual Conference of the IEEE Industrial Electronics Society, Beijing (2017)
- Qi, F., Wang, M., Xu, L.: Investigation and review of challenges in a high-temperature 30-kVA three-phase inverter using SiC MOSFETs. IEEE Trans. Ind. Appl. 54(3), 2483-2491 (2018) https://doi.org/10.1109/tia.2018.2796059
- March, P., Turner, M.C.: Anti-windup compensator designs for nonsalient permanent-magnet synchronous motor speed regulators. IEEE Trans. Ind. Appl. 45(5), 1598-1609 (2009) https://doi.org/10.1109/tia.2009.2027157
- Bagnoli, P.E., Dallago, E.: Thermal resistance analysis by induced transient (TRAIT) method for power electronic devices thermal characterization. I. Fundamentals and theory. IEEE Trans. Power Electron. 13(6), 1208-1219 (1998) https://doi.org/10.1109/63.728348