한국분말재료학회지 (Journal of Powder Materials)

  • 제29권3호
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  • Pages.226-232
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  • 2022
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  • 2799-8525(pISSN)
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  • 2799-8681(eISSN)
한국분말재료학회 (*구 분말야금학회) (The Korean Powder Metallurgy & Materials Institute)
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고속 화염 용사 공정을 이용한 스위칭 소자용 BCuP-5 filler 금속/Ag 기판 클래드 소재의 제조, 미세조직 및 접합 특성

Fabrication, Microstructure and Adhesion Properties of BCuP-5 Filler Metal/Ag Plate Clad Material by Using High Velocity Oxygen Fuel Thermal Spray Process

  • Joo, Yeun A (Department of Materials Science and Engineering, Inha University) ;
  • Cho, Yong-Hoon (Department of Materials Science and Engineering, Inha University) ;
  • Park, Jae-Sung (LT Metal LTD.) ;
  • Lee, Kee-Ahn (Department of Materials Science and Engineering, Inha University)
  • 투고 : 2022.06.14
  • 심사 : 2022.06.23
  • 발행 : 2022.06.28
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초록

In this study, a new manufacturing process for a multilayer-clad electrical contact material is suggested. A thin and dense BCuP-5 (Cu-15Ag-5P filler metal) coating layer is fabricated on a Ag plate using a high-velocity oxygen-fuel (HVOF) process. Subsequently, the microstructure and bonding properties of the HVOF BCuP-5 coating layer are evaluated. The thickness of the HVOF BCuP-5 coating layer is determined as 34.8 ㎛, and the surface fluctuation is measured as approximately 3.2 ㎛. The microstructure of the coating layer is composed of Cu, Ag, and Cu-Ag-Cu3P ternary eutectic phases, similar to the initial BCuP-5 powder feedstock. The average hardness of the coating layer is 154.6 HV, which is confirmed to be higher than that of the conventional BCuP-5 alloy. The pull-off strength of the Ag/BCup-5 layer is determined as 21.6 MPa. Thus, the possibility of manufacturing a multilayer-clad electrical contact material using the HVOF process is also discussed.

키워드

과제정보

본 연구는 산업통상자원부의 첨단 신소재 기반 3D 프린팅 전문인력양성 사업(P0002007)의 지원으로 수행되었으며 이에 감사드립니다.

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