Journal of the Semiconductor & Display Technology (반도체디스플레이기술학회지)

The Korean Society Of Semiconductor & Display Technology (한국반도체디스플레이기술학회)
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Characteristics Evaluation of Al2O3 ALD Thin Film Exposed to Constant Temperature and Humidity Environment

항온항습 환경에 노출된 Al2O3 ALD 박막의 특성 평가

  • Kim, Hyeun Woo (Dept. of Display and Semiconductor Engineering, Sunmoon University) ;
  • Song, Tae Min (Dept. of Display and Semiconductor Engineering, Sunmoon University) ;
  • Lee, Hyeong Jun (Dept. of Display and Semiconductor Engineering, Sunmoon University) ;
  • Jeon, Yongmin (Dept. of Biomedical Engineering, Gachon University) ;
  • Kwon, Jeong Hyun (Dept. of Display and Semiconductor Engineering, Sunmoon University)
  • 김현우 (선문대학교 디스플레이반도체공학과) ;
  • 송태민 (선문대학교 디스플레이반도체공학과) ;
  • 이형준 (선문대학교 디스플레이반도체공학과) ;
  • 전용민 (가천대학교 의공학과) ;
  • 권정현 (선문대학교 디스플레이반도체공학과)
  • Received : 2022.04.04
  • Accepted : 2022.04.29
  • Published : 2022.06.30
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Abstract

In this work, we evaluated the Al2O3 film, which was deposited by atomic layer deposition, degraded by exposure to harsh environments. The Al2O3 films deposited by atomic layer deposition have long been used as a gas diffusion barrier that satisfies barrier requirements for device reliability. To investigate the barrier and mechanical performance of the Al2O3 film with increasing temperature and relative humidity, the properties of the degraded Al2O3 film exposed to the harsh environment were evaluated using electrical calcium test and tensile test. As a result, the water vapor transmission rate of Al2O3 films stored in harsh environments has fallen to a level that is difficult to utilize as a barrier film. Through water vapor transmission rate measurements, it can be seen that the water vapor transmission rate changes can be significant, and the environment-induced degradation is fatal to the Al2O3 thin films. In addition, the surface roughness and porosity of the degraded Al2O3 are significantly increased as the environment becomes severer. the degradation of elongation is caused by the stress concentration at valleys of rough surface and pores generated by the harsh environment. Becaused the harsh envronment-induced degradation convert amorphous Al2O3 to crystalline structure, these encapsulation properties of the Al2O3 film was easily degraded.

Keywords

Acknowledgement

본 논문은 2021년도 교육부의 재원으로 한국연구재단의 지원을 받아 수행된 지자체-대학 협력기반 지역혁신사업 및 2022년도 정부(과학기술정보통신부)의 재원으로 한국연구재단의 지원(NRF-2022R1F1A1075914)으로 수행된 결과입니다(2021RIS-004). 또한, 이 연구는 2022년도 산업통상자원부 및 산업기술평가관리원(KEIT) 연구비 지원에 의한 연구임(’20018379).

References

  1. S. Choi et al., "Highly Flexible and Efficient Fabric-Based Organic Light-Emitting Devices for Clothing-Shaped Wearable Displays", Scientific Reports, vol. 7, no. 1, pp. 1-8, 2017. https://doi.org/10.1038/s41598-016-0028-x
  2. S. M. Lee, J. H. Kwon, S. Kwon, and K. C. Choi, "A Review of Flexible OLEDs Toward Highly Durable Unusual Displays", IEEE Transactions on Electron Devices, vol. 64, no. 5, pp. 1922-1931, 2017. https://doi.org/10.1109/TED.2017.2647964
  3. J. H. Kwon, Y. Jeon, S. Choi, J. W. Park, H. Kim, and K. C. Choi, "Functional Design of Highly Robust and Flexible Thin-Film Encapsulation Composed of Quasi-Perfect Sublayers for Transparent, Flexible Displays", ACS Applied Materials and Interfaces, vol. 9, no. 50, pp. 43983-43992, 2017. https://doi.org/10.1021/acsami.7b14040
  4. A. Behrendt et al., "Highly Robust Transparent and Conductive Gas Diffusion Barriers Based on Tin Oxide", Advanced Materials, vol. 27, pp. 5961-5967, 2015. https://doi.org/10.1002/adma.201502973
  5. S. Lee, Y. Seog Song, H. Kim, and S. Ouk Ryu, "Reliability Evaluation of Atomic layer Deposited Polymer / Al2O3 Multilayer Film for Encapsulation and Barrier of OLEDs in High Humidity and Temperature Environments", Journal of the Semiconductor & Display Technology, Vol. 16, No. 4, pp.1-4, 2017.
  6. S. Lee, Y. Seog Song, H. Kim, and S. Ouk Ryu, "Characterization of ALD Processed Al2O3/TiO2/Al2O3 Multilayer Films for Encapsulation and Barrier of OLEDs", Journal of the Semiconductor & Display Technology, Vol. 16, No. 1, pp.1-5, 2017.
  7. J.-S. Park, H. Chae, H. K. Chung, and S. I. Lee, "Thin film encapsulation for flexible AM-OLED: a review", Semiconductor Science and Technology, vol. 26, no. 3, p. 034001, Mar. 2011. https://doi.org/10.1088/0268-1242/26/3/034001
  8. J. H. Kwon, Y. Jeon, S. Choi, H. Kim, and K. C. Choi, "Synergistic gas diffusion multilayer architecture based on the nanolaminate and inorganic-organic hybrid organic layer", Journal of Information Display, vol. 19, no. 3, pp. 1-8, 2018. https://doi.org/10.1080/15980316.2017.1394375
  9. J. H. Kwon, S. Choi, Y. Jeon, H. Kim, K. S. Chang, and K. C. Choi, "Functional Design of Dielectric-Metal-Dielectric-Based Thin-Film Encapsulation with Heat Transfer and Flexibility for Flexible Displays", ACS Applied Materials and Interfaces, vol. 9, no. 32, pp. 27062-27072, 2017. https://doi.org/10.1021/acsami.7b06076
  10. J. H. Kwon, Y. Jeon, and K. C. Choi, "Robust Transparent and Conductive Gas Diffusion Multibarrier Based on Mg- and Al-Doped ZnO as Indium Tin Oxide-Free Electrodes for Organic Electronics", ACS Applied Materials & Interfaces, vol. 10, pp. 32387-32396, 2018. https://doi.org/10.1021/acsami.8b08951
  11. J. H. Kwon, E. G. Jeong, Y. Jeon, D. Kim, S. Lee, and K. C. Choi, "Design of Highly Water Resistant, Impermeable, and Flexible Thin- Film Encapsulation Based on Inorganic / Organic Hybrid Layers", ACS Applied Materials & Interfaces, vol. 11, pp. 3251-3261, 2019. https://doi.org/10.1021/acsami.8b11930
  12. S. M. George, "Atomic layer deposition: an overview", Chem Rev, vol. 110, no. 1, pp. 111-31, Jan. 2010. https://doi.org/10.1021/cr900056b
  13. K. Rak Kim, E. Sik Cho, and S. Jik Kwon, "Effects on the Al2O3 Thin Film by the Ar Pulse Time in the Atomic Layer Deposition", Journal of the Semiconductor & Display Technology, Vol. 20, No. 4, pp.1-5, 2021.
  14. P. F. Carcia, R. S. McLean, M. H. Reilly, M. D. Groner, and S. M. George, "Ca test of Al2O3 gas diffusion barriers grown by atomic layer deposition on polymers", Applied Physics Letters, vol. 89, no. 3, pp. 15-17, 2006.
  15. J.-H. Kim et al., "Tensile testing of ultra-thin films on water surface", Nature Communications, vol. 4, pp. 1-6, 2013.