반도체디스플레이기술학회지 (Journal of the Semiconductor & Display Technology)

한국반도체디스플레이기술학회 (The Korean Society Of Semiconductor & Display Technology)
권호 표지

OLED의 Thin Film Encapsulation을 위한 MgO 박막의 원자층 증착 장치 및 공정에 관한 연구

Study on the Atomic Layer Deposition System and Process of the MgO Thin Layer for the Thin Film Encapsulation of OLED

  • 조의식 (가천대학교 전자공학과) ;
  • 권상직 (가천대학교 전자공학과)
  • Cho, Eou Sik (Department of Electronics Engineering, Gachon University) ;
  • Kwon, Sang Jik (Department of Electronics Engineering, Gachon University)
  • 투고 : 2021.08.11
  • 심사 : 2021.09.16
  • 발행 : 2021.09.30
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초록

Thin-film encapsulation (TFE) technology is most effective in preventing water vapor and oxygen permeation in the organic light emitting diodes (OLED). Of those, a laminated structure of Al2O3 and MgO were applied to provide efficient barrier performance for increasing the stability of devices in air. Atomic layer deposition (ALD) method is known as the most promising technology for making the laminated Al2O3/MgO and is used to realize a thin film encapsulation technology in organic light-emitting diodes. Atomic layer deposited inorganic films have superior barrier performance and have advantages of excellent uniformity over large scales at relatively low deposition temperatures. In this study, the control system of the MgCP2 precursor for the atomic layer deposition of MgO was established in order to deposit the MgO layer stably by the injection time of second level and the stable heating temperature. The deposition rate was obtained stably to be from 4 to 10 Å/cycle using the injection pulse times ranging from 3 to 12 sec and a substrate temperature ranging from 80 to 150 ℃.

키워드

과제정보

본 논문은 산업통상자원부 '산업혁신인재성장지원사업'의 재원으로 한국산업기술진흥원(KIAT)의 지원을 받아 수행된 연구임(2020년 차세대 디스플레이 공정·장비·소재 전문인력 양성사업, 과제번호: P0012453).

참고문헌

  1. P. Fu , F. Liu, G. J. Ren, F. Su, D. Li, J. Q. Yao, "A broadband metamaterial absorber based on multi-layer graphene in the terahertz region", Optics Communications, Vol. 417 pp. 62-66, 2018 https://doi.org/10.1016/j.optcom.2018.02.034
  2. E. G. Jeong, J. H. Kwon, K. S. Kang, S. Y. Jeong, K. C. Choi, "A review of highly reliable flexible encapsulation technologies towards rollable and foldable OLEDs" J. Information. Disply., Vol. 21, No. 1, pp. 19-32, 2020. https://doi.org/10.1080/15980316.2019.1688694
  3. B.-H. Kwon, H. Lee, M. Kim, C. W. Joo, H. Cho, J. T. Lim, Y. S. Jung, "A Systematic Study of the Interactions in the Top Electrode/Capping Layer/Thin Film Encapsulation of Transparent OLEDs", J. Industrial and Engineering Chemistry, Vol. 93 pp. 237-244, 2021. https://doi.org/10.1016/j.jiec.2020.09.029
  4. S. Sandrez, S. M. Della-Gatta. T. Maindron, "Impact of pixel surface topography onto thin-film encapsulated top-emitting organic light-emitting diodes performances", Thin Solid Films, Vol. 699, pp. 137869. 1-9, 2020. https://doi.org/10.1016/j.tsf.2020.137869
  5. D. Yu, Y. Q. Yang, Z. Chen, Y. Tao,Y. F. Liu, "Recent progress on thin-film encapsulation technologies for organic electronic devices", Optics Communications", Vol. 362, pp. 43-49, 2016. https://doi.org/10.1016/j.optcom.2015.08.021
  6. L. Wang, C. Ruan, M.Li, J. Zou, H. Tao, J. Peng, M. Xu, "Enhanced moisture barrier performance for ALD-encapsulated OLEDs by introducing an organic protective layer", J. Mater. Chem. C, Vol. 5, pp. 4017-4024, 2017. https://doi.org/10.1039/C7TC00903H
  7. S. H. Lee, J. H. Han, S. H. Lee, G. H. Baek, J. S. Park, "Review of Organic/Inorganic Thin Film Encapsulation by Atomic Layer Deposition for a Flexible OLED Display", JOM, Vol. 71, No. 1, , pp. 197-210, 2019. https://doi.org/10.1007/s11837-018-3150-3
  8. S. M. Lee, J. H. Kwon, S.Kwon,and K. C. Choi, "A Review of Flexible OLED s Toward Highly D urable Unusual Displays", IEEE Tran. Elec. Dev., Vol. 64, No. 5, pp. 1922-1931, 2017. https://doi.org/10.1109/TED.2017.2647964
  9. G. Chen, Y. Weng, F. Sun, D. Hong, X. Zhou, T. Guo , Y. Zhang, Q. Yan, C. Wu, L. Sun, " Improved barrier and mechanical properties of Al2O3/acrylic laminates using rugged fluorocarbon layers for flexible encapsulation", Organic Electronics, Vol. 97, pp. 106263:1-9, 2021.
  10. M. Li, M. Xu, J. Zou, H. Tao, L. Wang, Z. Zhou, J. Peng, "Realization of Al2O3/MgO laminated structure at low temperature for thin film encapsulation in organic light-emitting diodes", Nanotechnology, Vol. 27, pp. 494003: 1-8, 2016.
  11. E. Kim, Y. Han, W. Kim, K. C. Choi, H. G. Im, B. S. Bae, "Thin film encapsulation for organic light emitting diodes using a multi-barrier composed of MgO prepared by atomic layer deposition and hybrid materials", Organic Electronics, Vol. 14, pp. 1737-1743, 2013. https://doi.org/10.1016/j.orgel.2013.04.011