Applied Chemistry for Engineering (공업화학)

The Korean Society of Industrial and Engineering Chemistry (한국공업화학회)
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The Characteristics of Diisopropyl Methylphosphonate Adsorption on Zirconium-based Metal Organic Frameworks Manufactured by using Different Acids as Modulators

서로 다른 산을 조절인자로 활용하여 제조한 지르코늄 기반 금속유기골격체의 Diisopropyl Methylphosphonate 흡착 특성

  • Jang, Wonhyeong (Nuclear & WMD Protection Research Center, Korea Military Academy) ;
  • Kim, Honghyun (Nuclear & WMD Protection Research Center, Korea Military Academy) ;
  • Jeong, Sangjo (Nuclear & WMD Protection Research Center, Korea Military Academy)
  • 장원형 (육군사관학교 핵.WMD방호연구센터) ;
  • 김홍현 (육군사관학교 핵.WMD방호연구센터) ;
  • 정상조 (육군사관학교 핵.WMD방호연구센터)
  • Received : 2021.07.16
  • Accepted : 2021.08.18
  • Published : 2021.10.10
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Abstract

Depending on the type and amount of acid used as a modulator in the manufacturing process, the structural properties of UiO-66 can be modified and the adsorbability of chemical warfare agents can be enhanced. In this study, several acids as a modulator were used to synthesize UiO-66. Their properties were analyzed with FT-IR, XRD, titrator, and adsorption isotherms using chemical warfare agent simulant, DIMP. The UiO-66, structurally damaged by hydrochloric acid as a modulator, showed lower crystallinity and DIMP adsorption capacity and also smaller specific surface area and volume of voids compared to those of UiO-66, which was manufactured using acetic acid, and formic acid as a modulator. Additionally, UiO-66 which was synthesized by adding formic acid and hydrochloric acid as a modulator, showed the highest DIMP adsorption capacity and is likely to be used as an adsorbent for chemical warfare agent in the future.

UiO-66은 높은 흡착능력과 구조적 및 열적 안정성 등으로 여러 현장에 적용 가능한 금속유기골격체(MOF)이다. UiO-66은 제조과정에서 조절인자로 사용되는 산의 종류와 양에 따라 구조적 특성이 변형되고, 화학작용제 흡착 능력을 높일 수 있다고 알려져 있다. 이에 본 연구에서는 다양한 산을 조절인자로 첨가하여 UiO-66을 합성하고, 그 특성을 FT-IR, XRD, 적정장치, 그리고 유사화학작용제 diisopropyl methylphosphonate (DIMP)를 활용한 흡착실험을 통해 분석하였다. 연구 결과 UiO-66의 제조과정에서 염산을 첨가할 시 UiO-66의 Zr-OH 결합과 UiO-66의 유기연결체인 테레프 탈산 구조에 일부 손상이 있었다. 특히 이러한 구조 손상은 염산의 농도가 일정 수준 이상으로 높을 때, 그리고 합성 시간이 일정 시간 이상으로 길어질 때 발생하였다. 하지만 아세트산과 포름산을 조절인자로 활용하여 제조한 UiO-66은 구조적 손상이 발견되지 않았으며, 염산을 활용하여 제조한 UiO-66에 비하여 결정도, 비표면적, 공극의 부피, 그리고 DIMP 흡착 능력이 모두 높게 나타나 향후 화학작용제 흡착제로서 활용 가능성이 높을 것으로 판단되었다.

Keywords

Acknowledgement

본 논문은 육군사관학교 핵·WMD 방호연구센터 2021년도(21-센터-5) 연구활동비 지원을 받아 연구되었습니다. 본 논문 작성에 필요한 분석 기회를 제공해준 서울과학기술대학교 공동실험실습관 관계자들과 실험에 필요한 지원을 해준 이연희 님에게도 감사드립니다.

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