Journal of Adhesion and Interface (접착 및 계면)

The Society of Adhesion and Interface, Korea (한국접착및계면학회)
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Recent Trends of Light Induced Bonding-Debonding Adhesives

광을 이용한 해체용 접착소재의 최근 동향

  • Jeong, Jongkoo (BGF Ecobio) ;
  • Cho, Seong-keun (Chemical Materials Solutions Center, Korea Research Institute of Chemical Technology) ;
  • Lee, Jae Heung (Chemical Materials Solutions Center, Korea Research Institute of Chemical Technology)
  • 정종구 (BGF 에코바이오) ;
  • 조성근 (한국화학연구원, 화학소재솔루션센터) ;
  • 이재흥 (한국화학연구원, 화학소재솔루션센터)
  • Received : 2021.06.03
  • Accepted : 2021.06.26
  • Published : 2021.06.30
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Abstract

A variety of efforts are attempted to make the world sustainable in fabrication industries worldwide. To achieve the goals, a new design concept for products is one of crucial factors to be able to dismantle them after use in easy and simple ways. New debonding technologies have been developed in recent years for the recycle and/or repair of bonded structures, where the bonds are broken without the damage of the components and make recycling easier. Some representative technologies of controlled delamination materials (CDM) are reviewed with an emphasis on light induced debonding of adhesives. We also describe current applications of light induced CDMs as temporary bondable films in semiconductor and display industries.

세계적으로 지속가능한 세상을 만들기 위한 노력이 제조업에서 많이 이루어지고 있다. 이를 위해서는 사용 후 제품을 쉽고 간단하게 해체할 수 있는 설계 개념 중요하다. 접합된 제품 해체 시부품에 대한 피해가 없도록 접합부위가 분해되어 재활용이나 수리를 가능하게 하는 신기술이 최근 개발되고 있다. 본 총설에서는 조절가능한 접합-해체용 소재 기술, 특히 빛으로 해체하는 접착소재기술 동향을 정리하였다. 또한 반도체, 디스플레이 산업에 현재 활용되고 있는 빛 이용 임시 접합-해체용 필름에 대해 기술하였다.

Keywords

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