전기전자학회논문지 (Journal of IKEEE)

  • 제25권3호
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  • Pages.578-583
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  • 2021
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  • 1226-7244(pISSN)
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  • 2288-243X(eISSN)
한국전기전자학회 (Institute of Korean Electrical and Electronics Engineers)
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자동차 반도체의 신뢰성 테스트 표준: AEC-Q100

Test Standard for Reliability of Automotive Semiconductors: AEC-Q100

  • 투고 : 2021.09.23
  • 심사 : 2021.09.27
  • 발행 : 2021.09.30
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⟨ 이전 논문 다음 논문 ⟩

초록

본 논문에서는 반도체의 신뢰성을 테스트하기 위한 가속 시험에 대해 설명하고 자동차 반도체의 신뢰성 테스트 국제 표준인 AEC-Q100에 대해 다룬다. 반도체는 수십년 동안 사용할 수 있기 때문에 수명 전주기에서 발생하는 잠재적인 문제점을 테스트하기 위해서는 집중적으로 스트레스를 가하여 테스트 시간을 최소화하는 가속 시험이 필수적이다. 자동차 반도체에서 사용하는 대표적인 가속 시험인 AEC-Q100은 반도체에서 발생하는 각종 불량과 그 원인을 분석할 수 있도록 설계되었기 때문에 반도체의 수명과 신뢰성을 예측할 수 있을 뿐만 아니라 설계상, 제조상의 문제도 쉽게 찾아낼 수 있다. AEC-Q100은 가속 스트레스 시험, 가속 수명 시험, 패키지 적합성 시험, 공정 신뢰성 시험, 전기적 특성 시험, 결함 검출 시험, 기계적 특성 시험의 7개 테스트 그룹으로 구성되며 동작 온도에 따라 Grade 0에서 Grade 3까지 4개의 등급이 존재한다. 반도체 소자, 광전자 반도체, 센서 반도체, 멀티 칩 모듈, 수동 소자 분야에서는 각각 AEC-Q101, Q102, Q103, Q104, Q200이 사용된다.

This paper describes acceleration tests for reliability of semiconductors. It also describes AEC-Q100, international test standard for reliability of automotive semiconductors. Semiconductors can be used for dozens of years. So acceleration tests are essential to test potential problems over whole period of product where test time is minimized by applying intensive stresses. AEC-Q100 is a typical acceleration test in automotive semiconductors, and it is designed to find various failures in semiconductors and to analyze their causes of occurance. So it finds many problems in design and fabrication as well as it predicts lifetime and reliability of semiconductors. AEC-Q100 consists of 7 test groups such as accelerated environmental stress tests, accelerated lifetime simulation tests, package assembly integrity tests, die fabrication reliability tests, electrical verification tests, defect screening tests, and cavity package integrity tests. It has 4 grades from grade 0 to grade 3 based on operational temperature. AEC-Q101, Q102, Q103, Q104, and Q200 are applied to discrete semiconductors, optoelectronic semiconductors, sensors, multichip modules, and passive components, respectively.

키워드

과제정보

This work was supported by Korea Institute for Advancement of Technology (KIAT) grant funded by the Korea Government (MOTIE). (P0017011, HRD Program for Industrial Innovation) This work was also supported by Industrial Technology Challenge Track (20012624) of the Ministry of Trade, Industry and Energy (MOTIE) / Korea Evaluation Instutite of Industrial Technology (KEIT).

참고문헌

  1. Y. Shin and S. Lee, "Compliance Technologies of Electromagnetic Compatibility in Automotive Electronic Systems," j.inst.Korean.electr.electron.eng., vol.22, no.2, pp.506-509, 2018. DOI: 10.7471/ikeee.2018.22.2.506
  2. S. Lee and C. Kim, "Reliability Test for Automotive Semiconductors," the Magazine of the IEIE, vol.46, no.1, pp.39-45, 2019.
  3. AEC-Q100 Rev-H, "Failure Mechanism Based Stress Test Qualification For Integrated Circuits," http://www.aecouncil.com/Documents/AEC_Q100_ Rev_H_Base_Document.pdf
  4. https://www.rmqsi.org/using-accelerated-life -testing-to-assess-warranty-risk/
  5. S. Arrhenius, "Uber die Dissociationswarme und den Einfluss der Temperatur auf den Dissociationsgrad der Elektrolyte," Zeitschrift fur Physikalische Chemie, vol.4, pp.96-116, 1889. https://doi.org/10.1515/zpch-1889-0408
  6. K. Laidler, Chemical Kinetics, 3rd edition, Harper & Row, 1987.
  7. http://passionateaboutoss.com/bathtub-curve/
  8. AEC-Q101 Rev-E, "Failure Mechanism Based Stress Test Qualification For Discrete Semiconductors," http://www.aecouncil.com/Documents/AEC_Q101_ Rev_E_Base_Document.pdf
  9. AEC-Q102 Rev-A, "Failure Mechanism Based Stress Test Qualification for Discrete Optoelectronic Semiconductors in Automotive Applications," http://www.aecouncil.com/Documents/AEC-Q102_ Rev_A.pdf
  10. AEC-Q103-002, "Failure Mechanism Based Stress Test Qualification for Micro Electro-Mechanical System (MEMS) Pressure Sensor Devices," http://www. aecouncil.com/Documents/AEC_Q103-002_Rev-.pdf
  11. AEC-Q104, "Stress Test Qualification For Passive Components", http://www.aecouncil.com/Documents/AEC-Q104_Rev-.pdf
  12. AEC-Q200 Rev-D, "Failure Mechanism Based Stress Test Qualification For Multichip Modules (MCM) In Automotive Applications," http://www.aecouncil.com/Documents/AEC_Q200_Rev_D_Base_ Document.pdf
  13. JEDEC Standards & Documents Search, https://www.jedec.org/standards-documents