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선택적 산화 방식을 이용한 핀 채널 MOSFET의 소스/드레인 저항 감소 기법

Reduction of Source/Drain Series Resistance in Fin Channel MOSFETs Using Selective Oxidation Technique

  • 조영균 (공주대학교 전기전자제어공학부)
  • Cho, Young-Kyun (Division of Electrical, Electronic and Control Engineering, Kongju National University)
  • 투고 : 2021.05.24
  • 심사 : 2021.07.20
  • 발행 : 2021.07.28

초록

본 핀 채널 전계 효과 트랜지스터에서 낮은 소스/드레인 직렬 저항을 위한 새로운 선택적 산화 방식을 제안하였다. 이 방법을 이용하면, gate-all-around 구조와 점진적으로 증가되는 형태의 소스/드레인 확장영역을 갖는 핀 채널 MOSFET를 얻을 수 있다. 제안된 트랜지스터는 비교 소자에 비해 70% 이상의 소스/드레인 직렬 저항의 감소를 얻을 수 있다. 또한, 제안된 소자는 단채널 효과를 억제하면서도 높은 구동 전류와 전달컨덕턴스 특징을 보인다. 제작된 소자의 포화전류, 최대 선형 전달컨덕턴스, 최대 포화 전달컨덕턴스, subthreshold swing, 및 DIBL은 각각 305 ㎂/㎛, 0.33 V, 13.5 𝜇S, 76.4 𝜇S, 78 mV/dec, 62 mV/V의 값을 갖는다.

A novel selective oxidation process has been developed for low source/drain (S/D) series resistance of the fin channel metal oxide semiconductor field effect transistor (MOSFET). Using this technique, the selective oxidation fin-channel MOSFET (SoxFET) has the gate-all-around structure and gradually enhanced S/D extension regions. The SoxFET demonstrated over 70% reduction in S/D series resistance compared to the control device. Moreover, it was found that the SoxFET behaved better in performance, not only a higher drive current but also higher transconductances with suppressing subthreshold swing and drain induced barrier lowering (DIBL) characteristics, than the control device. The saturation current, threshold voltage, peak linear transconductance, peak saturation transconductance, subthreshold swing, and DIBL for the fabricated SoxFET are 305 ㎂/㎛, 0.33 V, 13.5 𝜇S, 76.4 𝜇S, 78 mV/dec, and 62 mV/V, respectively.

키워드

참고문헌

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