DOI QR코드

DOI QR Code

A Study on the Selection of Highly Flexible Blanket for Reverse Offset Printing

Reverse Offset Printing용 고신축성 Blanket 재료 선정에 관한 연구

  • Shin, Seunghang (Department of Smart Manufacturing Engineering, Changwon National University) ;
  • Kim, Seok (Department of Smart Manufacturing Engineering, Changwon National University) ;
  • Cho, Young Tae (Department of Smart Manufacturing Engineering, Changwon National University)
  • 신승항 (창원대학교 스마트제조융합협동과정) ;
  • 김석 (창원대학교 스마트제조융합협동과정) ;
  • 조영태 (창원대학교 스마트제조융합협동과정)
  • Received : 2021.01.25
  • Accepted : 2021.04.15
  • Published : 2021.05.31

Abstract

Reverse offset printing is considering as an emerging technology for printed electronics owing to its environmentally friendliness and cost-effectiveness. In reverse offset printing, selecting the materials for cliché and blanket is critical because of its minimum resolution, registration errors, aspect ratio of reliefs, pattern area, and reusability. Various materials such as silicon, quartz, glass, electroplated nickel plates, and imprinted polymers on rigid substrates can be used for the reverse offset printing of cliché. However, when new structures are designed for specific applications, new clichés need to re-fabricated each time employing multiple time-consuming and costly processes. Therefore, by modifying the blanket materials containing the printing ink, several new structures can be easily created using the same cliché. In this study, we investigated various elastomeric materials and evaluated their applicability for designing a highly stretchable blanket with controlled elastic deformation to implement tunable reverse offset printing.

Keywords

Acknowledgement

이 연구는 2021년도 산업통상자원부 및 산업기술평가관리원(KEIT) 연구비 지원(No. 20007064) 및 산업통상자원부와 한국산업기술진흥원이 지원하는 경제협력권산업 육성사업(N0002310) 및 2020년도 교육부의 재원으로 한국연구재단의 지원을 받아 수행된 지자체-대학 협력기반 지역혁신 사업으로 수행된 연구결과입니다.

References

  1. Choi, N., Wee, H., Nam, S., Lavelle, J., and Hatalis, M., "A modified offset roll printing for thin film transistor applications," Microelectronic engineering, Vol. 91, pp. 93-97, 2012. https://doi.org/10.1016/j.mee.2011.11.010
  2. Can, T. T. T., Nguyen, T. C., and Choi, W. S., "High-Viscosity Copper Paste Patterning and Application to Thin-Film Transistors Using Electrohydrodynamic Jet Printing," Advanced Engineering Materials, Vol. 22, No. 3, pp. 1901384, 2020. https://doi.org/10.1002/adem.201901384
  3. Zhang, Y., Wang, S., Li, X., Fan, J. A., Xu, S., Song, Y. M., Choi, K., Yeo, W., Lee, W., Nazaar,, S. N., Lu, r. B., Yin, L., Hwang, K., Roger, J. A. and Huang, Y., "Experimental and theoretical studies of serpentine microstructures bonded to prestrained elastomers for stretchable electronics," Advanced Functional Materials, Vol. 24, No. 14, pp. 2028-2037, 2014. https://doi.org/10.1002/adfm.201302957
  4. Ramakrishnan, R., Saran, N., and Petcavich, R. J. "Selective inkjet printing of conductors for displays and flexible printed electronics," Journal of Display Technology, Vol. 7, No. 6, pp. 344-347, 2011. https://doi.org/10.1109/JDT.2010.2096650
  5. Pandey, M., Wang, Z., Kapil, G., Baranwal, A. K., Hirotani, D., Hamada, K., and Hayase, S., "Dependence of ITO Coated Flexible Substrates in the Performance and Bending Durability of Perovskite Solar Cells," Advanced Engineering Materials, Vol. 21, No. 8, pp. 1900288, 2019. https://doi.org/10.1002/adem.201900288
  6. Subramanian, V., Chang, P. C., Lee, J. B., Molesa, S. E., and Volkman, S. K., "Printed organic transistors for ultra-low-cost RFID applications," IEEE transactions on components and packaging technologies, Vol. 28, No. 4, pp. 742-747, 2005. https://doi.org/10.1109/TCAPT.2005.859672
  7. Lee, H., Seong, B., Moon, H., and Byun, D., "Directly printed stretchable strain sensor based on ring and diamond shaped silver nanowire electrodes," Rsc Advances, Vol. 5, No. 36, pp. 28379-28384, 2015. https://doi.org/10.1039/c5ra01519g
  8. Lee, S. K., Young, C. O. and Kim, J. H., "Fused Deposition Modeling 3D Printing-based Flexible Bending Sensor," Journal of the Korean Society of Manufacturing Process Engineers, Vol 19, No. 1, pp. 63-71, 2020. https://doi.org/10.14775/ksmpe.2020.19.01.063
  9. Im, Y. G, Cho, B. H., Chung S. I. and Jeong, H. D., "Development of Build-up Printed Circuit Board Manufacturing Process Using Functional Prototype Fabrication Technology," Journal of the Korean Society of Manufacturing Process Engineers, Vol. 2, No. 2, pp. 14-21, 2003.
  10. Abbel, R., Galagan, Y., and Groen, P., "Roll-to-Roll Fabrication of Solution Processed Electronics," Advanced Engineering Materials, Vol. 20, No. 8, pp. 1701190, 2018. https://doi.org/10.1002/adem.201701190
  11. Hubler, A. C., Schmidt, G. C., Kempa, H., Reuter, K., Hambsch, M., and Bellmann, M., "Three-dimensional integrated circuit using printed electronics," Organic Electronics, Vol. 12, No. 3, pp. 419-423, 2011. https://doi.org/10.1016/j.orgel.2010.12.010
  12. Nguyen, P. Q., Yeo, L. P., Lok, B. K., and Lam, Y. C., "Patterned surface with controllable wettability for inkjet printing of flexible printed electronics," ACS Applied Materials & Interfaces, Vol. 6. No. 6, pp. 4011-4016, 2014. https://doi.org/10.1021/am4054546
  13. Sowade, E., Polomoshnov, M., Willert, A., & Baumann, R. R., "Toward 3D-Printed Electronics: Inkjet-Printed Vertical Metal Wire Interconnects and Screen-Printed Batteries," Advanced Engineering Materials, Vol. 21, No. 10, pp. 1900568, 2019. https://doi.org/10.1002/adem.201900568
  14. Bevione, M., and Chiolerio, A., "Benchmarking of inkjet printing methods for combined throughput and performance," Advanced Engineering Materials, Vol. 22, No. 12, pp. 2000679, 2020. https://doi.org/10.1002/adem.202000679
  15. Kusaka, Y., Fukuda, N., and Ushijima, H., "Recent advances in reverse offset printing: an emerging process for high-resolution printed electronics," Japanese Journal of Applied Physics, Vol. 59, pp. SG0802, 2020. https://doi.org/10.7567/1347-4065/ab6462
  16. Zhong, Z., Ko, P., Seok, J. Y., Kim, H., Kwon, S., Youn, H., and Woo, K., "Roll-to-Roll Reverse -Offset Printing Combined with Photonic Sintering Process for Highly Conductive Ultrafine Patterns," Advanced Engineering Materials, Vol. 22, No. 10, pp. 2000463, 2020. https://doi.org/10.1002/adem.202000463
  17. Park, J. and Lee, C., "A Statistical Analysis for Slot-die Coating Process in Roll-to-roll Printed Electronics," Journal of the Korean Society of Manufacturing Process Engineers, Vol. 12, No. 5, pp. 23-29, 2013. https://doi.org/10.14775/ksmpe.2013.12.6.023
  18. Lee, J. and Lee, C., "Analysis of Thermal Effect on Tension of a Moving Web in Roll-to-Roll Printed Electronics," Journal of the Korean Society of Manufacturing Process Engineers, Vol. 12, No. 5, pp. 9-15, 2013.
  19. Yun, Y. H, Jang, S. A. and Oh, Y. J., "Formation of Stretchable Metal Bi-Layer Interconnects using a Deformed Elastomeric Polymer Substrate," Korean Journal of Metals and Materials, Vol. 51, No. 2, pp. 151-158, 2013. https://doi.org/10.3365/kjmm.2013.51.2.151
  20. Stach, M., Chang, E. C., Yang, C. Y., and Lo, C. Y., "Post-lithography pattern modification and its application to a tunable wire grid polarizer," Nanotechnology, Vol. 24, No. 11, pp. 115306, 2013. https://doi.org/10.1088/0957-4484/24/11/115306
  21. Choi, Y. M., Lee, E. S., Lee, T. M., and Kim, K. Y., "Optimization of a reverse-offset printing process and its application to a metal mesh touch screen sensor," Microelectronic Engineering, Vol. 134, pp. 1-6, 2015. https://doi.org/10.1016/j.mee.2014.12.007
  22. Kravchuk, O., Lesyuk, R., Bobitski, Y., & Reichenberger, M., "Sintering Methods of Inkjet-Printed Silver Nanoparticle Layers," International Conference on Nanotechnology and Nanomaterials, pp. 317-339, 2017.