Journal of the Korean Institute of Electrical and Electronic Material Engineers (한국전기전자재료학회논문지)

The Korean Institute of Electrical and Electronic Material Engineers (한국전기전자재료학회)
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Evaluation of the Bonding Properties of Sn58Bi Lead-Free Solder Joints According to the Content of Graphene Nanosheets for Medical Electronic Devices

의료전자기기 적용을 위한 그래핀 나노시트 함량에 따른 Sn58Bi 무연 솔더 접합부의 접합 특성 평가

  • Jeon, Yu-Jae (Department of Medical Rehabilitation Science, Yeoju Institute of Technology) ;
  • Kang, Min-Soo (Division of Smart Automotive Engineering, Sunmoon University)
  • 전유재 (여주대학교 의료재활과학과) ;
  • 강민수 (선문대학교 스마트자동차공학부)
  • Received : 2021.02.03
  • Accepted : 2021.02.20
  • Published : 2021.05.01
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Abstract

In this study, solder joints mixed with graphene-nanosheets (GNSs) were investigated for the manufacture of highly reliable electronic devices. In order to analyze the effect of adding GNSs, experiments were performed by adding various amounts of GNSs (0.01, 0.05, 0.1, 0.3, 0.5 wt%). To compare and analyze the properties of the solder joints to which GNSs were added, shear forces were measured, and cross-sectional observation was performed. The bonding strength of the solder joints containing 0.05% GNSs was the highest, and the bonding strength of the solder joints with higher GNSs contents did not increase. This is because, as the content of GNSs increases, the viscosity of the solder paste also increases; therefore, the solder paste detachability from the metal mask was lowered and a sufficient amount was not applied. In addition, due to the high content of GNSs, the fluidity of solder powder and paste decreased, resulting in defects in the shape of the solder joint. Therefore, the optimal GNSs content in this study was 0.05%, and studies for optimal viscosity should be continued.

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References

  1. T. Y. Park, J. C. Park, and H. U. Oh, Int. J. Fatigue, 114, 206, (2018). [DOI: https://doi.org/10.1016/j.ijfatigue.2018.05.012]
  2. V. Venkatadri, L. Yin, Y. Xing, E. Cotts, K. Srihari, and P. Borgesen, Proc. 2009 59th Electronic Components and Technology Conference (IEEE, San Diego, USA, 2009). [DOI: https://doi.org/10.1109/ECTC.2009.5074045]
  3. P. Wu, Proc. SENSORS, 2010 IEEE (IEEE, Waikoloa, USA, 2010) p. 1187. [DOI: https://doi.org/10.1109/ICSENS.2010.5690645]
  4. J. H. Bang, D. Y. Yu, Y. H. Ko, J. W. Yoon, and C. W. Lee, J. Weld. Joining, 34, 26 (2016). [DOI: https://doi.org/10.5781/JWJ.2016.34.1.26]
  5. A. Y. Kim, C. M. Oh, and W. S. Hong, J. Weld. Joining, 33, 25 (2015). [DOI: https://doi.org/10.5781/JWJ.2015.33.3.25]
  6. Y. J. Jeon, D. S. Kim, and Y. E. Shin, Trans. Korean Soc. Auto. Eng., 19, 90 (2011).
  7. S. W. Jung, M. S. Kang, Y. J. Jeon, D. S. Kim, and Y. E. Shin, J. Korean Inst. Electr. Electron. Mater. Eng., 29, 152 (2016). [DOI: https://doi.org/10.4313/JKEM.2016.29.3.152]
  8. M. N. Ervina Efzan and I. Siti Norfarhani, Trans. Electr. Electron. Mater., 16, 112 (2015). [DOI: https://doi.org/10.4313/TEEM.2015.16.3.112]
  9. M. S. Kang, D. S. Kim, and Y. E. Shin, J. Korean Inst. Electr. Electron. Mater. Eng., 32, 6 (2019). [DOI: https://doi.org/10.4313/JKEM.2019.32.1.6]
  10. B. S. Yim, J. I. Lee, and J. M. Kim, J. Weld. Joining, 35, 15 (2017). [DOI: https://doi.org/10.5781/JWJ.2017.35.3.3]
  11. J. Bernholc, D. Brenner, M. Buongiorno Nardelli, V. Meunier, and C. Roland, Annu. Rev. Mater. Res., 32, 347, (2002). [DOI: https://doi.org/10.1146/annurev.matsci.32.112601.134925]
  12. S. Xu, Y. C. Chan, K. Zhang, and K. C. Yung, J. Alloys Compd., 595, 92 (2014). [DOI: https://doi.org/10.1016/j.jallcom.2014.01.083]
  13. S.M.L. Nai, J. Wei, and M. Gupta, J. Electron. Mater., 35, 1518 (2006). [DOI: https://doi.org/10.1007/s11664-006-0142-9]
  14. L. Xu, X. Chen, H. Jing, L. Wang, J. Wei, and Y. Han, Mater. Sci. Eng., A, 667, 87 (2016). [DOI: https://doi.org/10.1016/j.msea.2016.04.084]
  15. K. N.Tu and K. Zeng, Mater. Sci. Eng., R, 34, 1 (2001). [DOI: https://doi.org/10.1016/S0927-796X(01)00029-8]
  16. J. Shen, Y. Pu, H. Yin, D. Luo, and J. Chen, J. Alloys Compd., 614, 63 (2014). [DOI: https://doi.org/10.1016/j.jallcom.2014.06.015]
  17. S. Y. Fu, X. Q. Feng, B. Lauke, and Y. W. Mai, Composites Part B, 39, 933 (2008). [DOI: https://doi.org/10.1016/j.compositesb.2008.01.002]
  18. M. A. Rafiee, J. Rafiee, Z. Wang, H. Song, Z. Z. Yu, and N. Koratkar, ACS Nano, 3, 3884 (2009). [DOI: https://doi.org/10.1021/nn9010472]
  19. X. Hu, Y. C. Chan, K. Zhang, and K. C. Yung, J. Alloys Compd., 580, 162 (2013). [DOI: https://doi.org/10.1016/j.jallcom.2013.05.124]
  20. A. A. El-Daly and A. E. Hammad, Mater. Des., 40, 292 (2012). [DOI: https://doi.org/10.1016/j.matdes.2012.04.007]
  21. X. D. Liu, Y. D. Han, H. Y. Jing, J. Wei, and L. Y. Xu, Mater. Sci. Eng., A, 562, 25 (2013). [DOI: https://doi.org/10.1016/j.msea.2012.10.079]
  22. D. Ma and P. Wu, J. Alloys Compd., 671, 127 (2016). [DOI: https://doi.org/10.1016/j.jallcom.2016.02.093]