Composite Materials and Engineering

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Micro-CT image-based reconstruction algorithm for multiscale modeling of Sheet Molding Compound (SMC) composites with experimental validation

  • Lim, Hyoung Jun (Department of Aerospace Engineering, Seoul National University) ;
  • Choi, Hoil (Department of Aerospace Engineering, Seoul National University) ;
  • Yoon, Sang-Jae (Research & Development Division, Hyundai Motor Company) ;
  • Lim, Sang Won (Research & Development Division, Hyundai Motor Company) ;
  • Choi, Chi-Hoon (Research & Development Division, Hyundai Motor Company) ;
  • Yun, Gun Jin (Department of Aerospace Engineering, Seoul National University)
  • Received : 2021.07.29
  • Accepted : 2021.12.17
  • Published : 2021.08.25
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Abstract

This paper presents a multiscale modeling method for sheet molding compound (SMC) composites through a novel bundle packing reconstruction algorithm based on a micro-CT (Computed Tomography) image processing. Due to the complex flow pattern during the compression molding process, the SMC composites show a spatially varying orientation and overlapping of fiber bundles. Therefore, significant inhomogeneity and anisotropy are commonly observed and pose a tremendous challenge to predicting SMC composites' properties. For high-fidelity modeling of the SMC composites, the statistical distributions for the fiber orientation and local volume fraction are characterized from micro-CT images of real SMC composites. After that, a novel bundle packing reconstruction algorithm for a high-fidelity SMC model is proposed by considering the statistical distributions. A method for evaluating specimen level's strength and stiffness is also proposed from a set of high-fidelity SMC models. Finally, the proposed multiscale modeling methodology is experimentally validated through a tensile test.

Keywords

Acknowledgement

The research was supported by Hyundai Motors Co. Ltd (No. 0498-20200036) and the Institute of Engineering at Seoul National University. The authors are grateful for their support.

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