전자통신동향분석 (Electronics and Telecommunications Trends)

한국전자통신연구원 (Electronics and Telecommunications Research Institute)
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CPU 기술과 미래 반도체 산업 (II)

CPU Technology and Future Semiconductor Industry (II)

  • 발행 : 2020.04.01
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초록

Knowledge of the technology, characteristics, and market trends of the latest CPUs used in smartphones, computers, and supercomputers and the research trends of leading US university experts gives an edge to policy-makers, business executives, large investors, etc. To this end, we describe three topics in detail at a level that can help educate the non-majors to the extent possible. Topic 1 comprises the design and manufacture of a CPU and the technology and trends of the smartphone SoC. Topic 2 comprises the technology and trends of the x86 CPU and supercomputer, and Topic 3 involves an optical network chip that has the potential to emerge as a major semiconductor chip. We also describe three techniques and experiments that can be used to implement the optical network chip.

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참고문헌

  1. Jim Turley, "Introduction to Intel Architecture," White Paper, Intel Corporation, 2014.
  2. Intel, "An Introduction to the Intel QuickPath Interconnect," White Paper, Intel Corporation, 2009.
  3. Akhilesh Kumar, "New Intel Mesh Architecture: The 'Superhighway' of the Data Center," White Paper, Intel Corporation.
  4. Michael Berktold, "CPU Monitoring with DTS/PECI," White Paper, Intel Corporation, September 2010.
  5. Intel, "Thermal/Mechanical Specification and Design Guide (TMSDG); Intel Core i7 Processor Family for the LGA2011-3 Socket," White Paper, Intel Corporation, August 2014.
  6. Shawn Strande et al., "Building a Data - Intensive Supercomputer Architecture for the National Research Community," White Paper, Cray Inc, WP-CCS-Gordon01-0413, 2013.
  7. Weiwu Hu et al., "An introduction to CPU and DSP design in China," SCIENCE CHINA Information Sciences, vol.59, January 2016, pp. 012101:1-012101:8.
  8. Jack Dongarra, "Report on the Sunway TaihuLight System," Tech Report UT-EECS-16-742, University of Tennessee, Department of Electrical Engineering and Computer Science, June 2016.