참고문헌
- J. F. Scott and C. A. Paz de Araujo, Science, 246, 1400 (1989). [DOI: https://doi.org/10.1126/science.246.4936.1400]
- T. Kim and S. Jeon, IEEE Trans. Electron Devices, 65, 1771 (2018). [DOI: https://doi.org/10.1109/TED.2018.2816968]
- M. H. Park, H. J. Kim, Y. J. Kim, T. Moon, K. D. Kim, and C. S. Hwang, Adv. Energy Mater., 4, 140061 (2014). [DOI: https://doi.org/10.1002/aenm.201400610]
- J. Muller, T. S. Boscke, U. Schroder, S. Mueller, D. Brauhaus, U. Bottger, L. Frey, and T. Mikolajick, Nano Lett., 12, 4318 (2012). [DOI: https://doi.org/10.1021/nl302049k]
- P. Polakowski, S. Riedel, W. Weinreich, M. Rudolf, J. Sundqvist, K. Seidel, and J. Muller, Proc. 2014 IEEE 6th International Memory Workshop (IMW) (IEEE, Taipei, Taiwan, 2014) p. 1. [DOI: https://doi.org/10.1109/IMW.2014.6849367]
- A. Chanthbouala, A. Crassous, V. Garcia, K. Bouzehouane, S. Fusil, X. Moya, J. Allibe, B. Dlubak, J. Grollier, S. Xavier, C. Deranlot, A. Moshar, R. Proksch, N. D. Mathur, M. Bibes, and A. Barthelemy, Nat. Nanotechnol., 7, 101 (2012). [DOI: https://doi.org/10.1038/nnano.2011.213]
- M. Y. Zhuravlev, R. F. Sabirianov, S. S. Jaswal, and E. Y. Tsymbal, Phys. Rev. Lett., 94, 246802 (2005). [DOI: https://doi.org/10.1103/PhysRevLett.94.246802]
- H. Kohlstedt, N. A. Pertsev, J. R. Contreras, and R. Waser, Phys. Rev. B, 72, 125341 (2005). [DOI: https://doi.org/10.1103/PhysRevB.72.125341]
- L. Esaki, R. B. Lailbowitz, and P. J. Stiles, IBM Tech. Discl. Bull., 13, 2161 (1971).
- D. Pantel and M. Alexe, Phys. Rev. B, 82, 134105 (2010). [DOI: https://doi.org/10.1103/PhysRevB.82.134105]
- M. Kobayashi, Y. Tagawa, F. Mo, T. Saraya, and T. Hiramoto, IEEE J. Electron Devices Soc., 7, 134 (2019). [DOI: https://doi.org/10.1109/JEDS.2018.2885932]
- S. Dahle, R. Gustus, W. Viol, and W. Maus-Friedrichs, Plasma Chem. Plasma Process., 32, 1109 (2012). [DOI: https://doi.org/10.1007/s11090-012-9392-x]