과제정보
The authors acknowledge the support from B. Baker, D. Magginetti, and S. Pritchett for the development of device fabrication. The radial junction processes and the EBIC data acquisition were performed at Penn State University (University Park, PA, USA) and the National Institute of Standards and Technology (Gaithersburg, MD, USA). We thank Y. Yuwen, T. Mayer, P. Haney, and N. Zhitenev for valuable discussions.
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