Nuclear Engineering and Technology

Korean Nuclear Society (한국원자력학회)
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Optimization of shielding to reduce cosmic radiation damage to packaged semiconductors during air transport using Monte Carlo simulation

  • Lee, Ju Hyuk (Department of Nuclear and Quantum Engineering, Korea Advanced Institute of Science and Technology) ;
  • Kim, Hyun Nam (Department of Nuclear and Quantum Engineering, Korea Advanced Institute of Science and Technology) ;
  • Jeong, Heon Yong (Department of Nuclear and Quantum Engineering, Korea Advanced Institute of Science and Technology) ;
  • Cho, Sung Oh (Department of Nuclear and Quantum Engineering, Korea Advanced Institute of Science and Technology)
  • Received : 2019.11.28
  • Accepted : 2020.01.13
  • Published : 2020.08.25
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Abstract

Background: Cosmic ray-induced particles can lead to failure of semiconductors packaged for export during air transport. This work performed MCNP 6.2 simulations to optimize shielding against neutrons and protons induced by cosmic radiation Methods and materials: The energy spectra of protons and neutrons by incident angle at the flight altitude were determined using atmospheric cuboid model. Various candidates for the shielding materials and the geometry of the Unit Load Device Container were evaluated to determine the conditions that allow optimal shielding at all sides of the container. Results: It was found that neutrons and protons, at the flight altitude, generally travel with a downward trajectory especially for the particles with high energy. This indicated that the largest number of particles struck the top of the container. Furthermore, the simulation results showed that, among the materials tested, borated polyethylene and stainless steel were the most optimal shielding materials. The optimal shielding structure was also determined with the weight limit of the container in consideration. Conclusions: Under the determined optimal shielding conditions, a significantly reduced number of neutrons and protons reach the contents inside the container, which ultimately reduces the possibility of semiconductor failure during air transport.

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References

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