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Numerical Analysis on the Performance Improvement of Plate Heat Exchanger by Applying to CuO Nanofluid

CuO 나노유체를 적용한 판형열교환기 성능에 대한 수치해석적 연구

  • Ham, Jeonggyun (Department of Mechanical Engineering, Graduate School of Chosun University) ;
  • Cho, Honghyun (Department of Mechanical Engineering, Chosun University)
  • Received : 2020.02.10
  • Accepted : 2020.02.25
  • Published : 2020.03.01

Abstract

In this study, a numerical study was conducted to evaluate the performance improvement when CuO nanofluid was used in the plate heat exchanger. As a result, the heat transfer amount is increased by 5.45% when 2 vol% CuO nanofluid is used. The influence on the CuO nanofluid on the performance of heat exchanger is decreased by increasing the flow rate of working fluid. In addition, the overall heat transfer coefficient using 2 vol% CuO nanofluid decreased compared to the base fluid. However, the pressure drop and the consumption of the pump power is increased as the concentration of CuO nanofluid increased because the increase of the viscosity. These are increased up to 15.4% compared to those of the base fluid. Moreover, the performance index of CuO nanofluid is decreased by 12.6% compared to that of the base fluid.

Keywords

References

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