한국기계가공학회지 (Journal of the Korean Society of Manufacturing Process Engineers)

  • 제19권1호
  • /
  • Pages.81-88
  • /
  • 2020
  • /
  • 1598-6721(pISSN)
  • /
  • 2288-0771(eISSN)
한국기계가공학회 (The Korean Society of Manufacturing Process Engineers)
권호 표지
DOI QR코드

DOI QR Code

이종 폴리머재료 어닐링을 이용한 유연저항센서 FDM 3D프린팅 제작실험

Manufacturing Experiments using FDM 3D-printed Flexible Resistance Sensors with Heterogeneous Polymer Material Annealing

  • Lee, Sun Kon (Department of Mechanical Engineering, Inha University) ;
  • Oh, Young Chan (Department of Mechanical Engineering, Inha University) ;
  • Kim, Joo Hyung (Department of Mechanical Engineering, Inha University)
  • 투고 : 2019.09.04
  • 심사 : 2019.12.04
  • 발행 : 2020.01.31
PDF 다운로드
⟨ 이전 논문 다음 논문 ⟩

초록

In this paper, the performances of the electrical characteristics of the Fused Deposition Modeling (FDM) 3D-printed flexible resistance sensor was evaluated. The FDM 3D printing flexible resistive sensor is composed of flexible-material thermoplastic polyurethane and a conductive PLA (carbon black conductive polylactic acid) polymer. While 3D printing, polymer filaments heat up quickly before being extruded and cooled down quickly. Polymers have poor thermal conductivity so the heating and cooling causes unevenness, which then results in internal stress on the printed parts due to the rapidity of the heating and cooling. Electrical resistance measurements show that the 3D-printed flexible sensor is unstable due to internal stress, so the 3D-printed flexible sensor resistance curve does not match the increases and decreases in the displacement curve. Therefore, annealing was performed to eliminate the mismatch between electrical resistance and displacement. Annealing eliminates residual stress on the sensor, so the electrical resistance of the sensor increases and decreases in proportion to displacement. Additionally, the resistance is lowered in comparison to before annealing. The results of this study will be very useful for the fabrication of various devices that employ 3D-printed flexible sensor that have multiple degrees of freedom and are not limited by size and shape.

키워드

참고문헌

  1. Kim, C., Lee, T. K., Kim, T. S., "Measurement Technologies of Mechanical Properties of Polymers used for Flexible and Stretchable Electronic Packaging," Journal of the Microelectronics and Packaging Society, Vol. 23, No. 2, pp 19-28, 2016. https://doi.org/10.6117/kmeps.2016.23.2.019
  2. Brand, J. van, den., Kok, M, de., Koetse, M., Cauwe, M., Verplancke, R., Bossuyt, F., Jablonski, M., Vanfleteren, J., "Flexible and Stretchable Electronics for Wearable Health Devices," ELSEVIER, Vol. 113, pp. 116-120, 2015. https://doi.org/10.1016/j.sse.2015.05.024
  3. Choi, J. W., Kim, H. C., "3D Printing Technologies-A Review," Journal of the Korean Society of Manufacturing Process Engineers, Vol. 14, No. 3, pp. 1-8, 2015. https://doi.org/10.14775/ksmpe.2015.14.3.001
  4. Jang, J., Cho, D. W., "A Review of the Fabrication of Soft Structures with Three-dimensional Printing Technology," Journal of the Korean Society of Manufacturing Process Engineers, Vol. 14, No. 6, pp. 142-148, 2015. https://doi.org/10.14775/ksmpe.2015.14.6.142
  5. Kim, D. B., Lee, G. T., Lee, I. H., Cho, H. Y., "Finite Element Analysis for Fracture Criterion of PolyJet Materials," Journal of the Korean Society of Manufacturing Process Engineers, Vol. 14, No. 4, pp. 134-139, 2015. https://doi.org/10.14775/ksmpe.2015.14.4.134
  6. Lee, S. K., Kim, Y. R., Kim, S. H., Kim, J. H., "Investigation of the Internal Stress Relaxation in FDM 3D Printing : Annealing Conditions," Journal of the Korean Society of Manufacturing Process Engineers, Vol. 17, No. 4, pp. 130-136, 2018.
  7. Jackson Jr, W. J., & Caldwell, J. R., "Antiplasticization. II. Characteristics of antiplasticizers," Journal of Applied Polymer, Vol 11, No. 2, pp 211-226, 1967. https://doi.org/10.1002/app.1967.070110205
  8. Lee, S. K., Kim, Y. R., Park, J. H., Kim, J. H., "Study on Electrical Characteristics of FDM Conductive 3D Printing According to Annealing Conditions," Journal of the Korean Society of Manufacturing Process Engineers, Vol. 17, No. 6, pp. 55-60, 2018. https://doi.org/10.14775/ksmpe.2018.17.4.055
  9. Hashima, K., Nishitsuji, S., Inoue, T., "Structure - properties of super-tough PLA alloy with excellent heat resistance," Polymer, Vol. 51, No. 17, pp. 3934-3939, 2010. https://doi.org/10.1016/j.polymer.2010.06.045
  10. Postiglione, G., Natale, G., Griffini, G., Levi, M., Turri, S., "Conductive 3D Microstructures by Direct 3D Printing of polymer/carbon Nanotube Nanocomposites via Liquid Deposition Modeling," ELSEVIER, Vol. 76, pp. 110-114, 2015. https://doi.org/10.1016/j.compositesa.2015.05.014
  11. Seol, K. S., Shin, B. C., Zhang, S. U., "Fatigue Test of 3D-printed ABS Parts Fabricated by Fused Deposition Modeling," Journal of the Korean Society of Manufacturing Process Engineers, Vol. 17, No. 3, pp. 93-101, 2018. https://doi.org/10.14775/ksmpe.2018.17.3.093