Design & Manufacturing

Korean Society of Die & Mold Engineering (한국금형공학회)
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A study on structural stability of Backgrinding equipment using finite element analysis

유한요소해석을 이용한 백그라인딩 장비의 구조안정성 연구

  • Wi, Eun-Chan (Department of Mechanical Convergence Engineering, Induk University) ;
  • Ko, Min-Sung (Department of Mechanical Convergence Engineering, Induk University) ;
  • Kim, Hyun-Jeong (Department of Mechanical Convergence Engineering, Induk University) ;
  • Kim, Sung-Chul (AM Technology Co.,Ltd) ;
  • Lee, Joo-Hyung (Department of Mechanical Design and Robot Engineering, Seoul National University of Science&Technology) ;
  • Baek, Seung-Yub (Department of Mechanical Convergence Engineering, Induk University)
  • 위은찬 (인덕대학교 융합기계공학과) ;
  • 고민성 (인덕대학교 융합기계공학과) ;
  • 김현정 (인덕대학교 융합기계공학과) ;
  • 김성철 (에이엠테크놀로지(주)) ;
  • 이주형 (서울과학기술대학교 기계설계로봇공학과) ;
  • 백승엽 (인덕대학교 융합기계공학과)
  • Received : 2020.12.21
  • Accepted : 2020.12.31
  • Published : 2020.12.31
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Abstract

Lately, the development of the semiconductor industry has led to the miniaturization of electronic devices. Therefore, semiconductor wafers of very thin thickness that can be used in Multi-Chip Packages are required. There is active research on the backgrinding process to reduce the thickness of the wafer. The backgrinding process polishes the backside of the wafer, reducing the thickness of the wafer to tens of ㎛. The equipment that performs the backgrinding process requires ultra-precision. Currently, there is no full auto backgrinding equipment in Korea. Therefore, in this study, ultra-precision backgrinding equipment was designed. In addition, finite element analysis was conducted to verify the equipment design validity. The deflection and structural stability of the backgrinding equipment were analyzed using finite element analysis.

Keywords

Acknowledgement

본 논문은 산업통상자원부 기계산업핵심기술개발사업 "반도체 웨이퍼 후면 Full Auto Backgrinding 장비 실증" 과제번호(20009804) 연구비 지원으로 진행되었습니다. 이에 감사를 드립니다.

References

  1. Gao, S., Dong, Z., Kang, R., Zhang, B., and Guo, D., "Warping of silicon wafers subjected to back-grinding process", Precision Engineering, 40, pp. 87-93, 2015. https://doi.org/10.1016/j.precisioneng.2014.10.009
  2. Pei, Z. J., "A study on surface grinding of 300 mm silicon wafers", International Journal of Machine Tools and Manufacture, 42(3), pp. 385-393, 2002. https://doi.org/10.1016/S0890-6955(01)00122-5
  3. Chen, R., Li, S., Wang, Z., and Lu, X., "Mechanical model of single abrasive during chemical mechanical polishing: molecular dynamics simulation", Tribology International, 133, pp. 40-46, 2019. https://doi.org/10.1016/j.triboint.2018.12.018
  4. Seong, H. S., "An equipment Trends and Process Technology for Chemical Mechanical Polishing", The Magazine of the IEIE, 40(12), pp. 46-58, 2013.
  5. Lee, B. Y., "Evaluation of Vertical Displacement of Door of Built-in Bottom-Freezer Type Refrigerator by Structural Analysis", Journal of the Korean Society of Manufacturing Process Engineers 19(2), pp. 89-96, 2020.2