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Electronics and Telecommunications Research Institute (한국전자통신연구원)
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Conductive adhesive with transient liquid-phase sintering technology for high-power device applications

  • Eom, Yong-Sung (ICT Materials & Components Research Laboratory, Electronics and Telecommunications Research Institute) ;
  • Jang, Keon-Soo (ICT Materials & Components Research Laboratory, Electronics and Telecommunications Research Institute) ;
  • Son, Ji-Hye (ICT Materials & Components Research Laboratory, Electronics and Telecommunications Research Institute) ;
  • Bae, Hyun-Cheol (ICT Materials & Components Research Laboratory, Electronics and Telecommunications Research Institute) ;
  • Choi, Kwang-Seong (ICT Materials & Components Research Laboratory, Electronics and Telecommunications Research Institute)
  • Received : 2018.06.01
  • Accepted : 2019.03.12
  • Published : 2019.12.06
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Abstract

A highly reliable conductive adhesive obtained by transient liquid-phase sintering (TLPS) technologies is studied for use in high-power device packaging. TLPS involves the low-temperature reaction of a low-melting metal or alloy with a high-melting metal or alloy to form a reacted metal matrix. For a TLPS material (consisting of Ag-coated Cu, a Sn96.5-Ag3.0-Cu0.5 solder, and a volatile fluxing resin) used herein, the melting temperature of the metal matrix exceeds the bonding temperature. After bonding of the TLPS material, a unique melting peak of TLPS is observed at 356 ℃, consistent with the transient behavior of Ag3Sn + Cu6Sn5 → liquid + Cu3Sn reported by the National Institute of Standards and Technology. The TLPS material shows superior thermal conductivity as compared with other commercially available Ag pastes under the same specimen preparation conditions. In conclusion, the TLPS material can be a promising candidate for a highly reliable conductive adhesive in power device packaging because remelting of the SAC305 solder, which is widely used in conventional power modules, is not observed.

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References

  1. Y. Yamada et al., Pb-free High temperature solder joints for power semiconductor devices, Trans. Jpn. Inst. Electron. Packag. 2 (2009), 79-84. https://doi.org/10.5104/jiepeng.2.79
  2. K. Xiao et al., Large-area chip attachment by sintering nanosilver paste: Process improvement by nondestructive characterization, Trans. Jpn. Inst. Electron. Packag. 4 (2011), 101-109. https://doi.org/10.5104/jiepeng.4.101
  3. K. Guth et al., New Assembly and interconnects beyond sintering methods, in Int, Conf. Power Conversion Intell. Motion Eur., Nuremberg, Germany, 2010, pp. 219-224.
  4. Y.-S. Eom et al., Characterization of a hybrid Cu paste as an isotropic conductive adhesive, ETRI J. 33 (2011), 864-870. https://doi.org/10.4218/etrij.11.0110.0520
  5. Y.-S. Eom et al., Electrical interconnection with a smart ACA composed of fluxing polymer and solder powder, ETRI J. 32 (2010), 414-420. https://doi.org/10.4218/etrij.10.0109.0400
  6. Y.-S. Eom et al., Characterization of polymer matrix and low melting point solder for anisotropic conductive film, Microelectron. Eng. 85 (2008), 327-331. https://doi.org/10.1016/j.mee.2007.07.005
  7. Y. S. Eom et al., Electrical and mechanical characterization of an anisotropic conductive adhesive with a low melting point solder, Microelectron. Eng. 85 (2008), 2202-2206. https://doi.org/10.1016/j.mee.2008.05.038
  8. Y.-S. Eom et al., Characterization of fluxing and hybrid underfills with micro-encapsulated catalyst for long pot life, ETRI J. 36 (2014), 343-351. https://doi.org/10.4218/etrij.14.0113.0570
  9. Y.-S. Eom et al., Optimization of material and process for fine pitch LVSoP technology, ETRI J. 35 (2013), 625-631. https://doi.org/10.4218/etrij.13.1912.0007
  10. J.-W. Baek et al., Chemo-rheological characteristic of a self-assembling anisotropic conductive adhesive system containing a low-melting point solder, Microelectron. Eng. 87 (2010), 1968-1972. https://doi.org/10.1016/j.mee.2009.12.020
  11. K.-S. Jang et al., Catalytic behavior of Sn/Bi metal powder in anhydride-based epoxy curing, J. Nanosci. Nanotechnol. 9 (2009), 7461-7466.
  12. NIST, Phase Diagrams & Computational Thermodynamics: Ag-Cu-Sn System, Metallurgy Division of Material Science and Engineering Laboratory, 2003, June 15, 2007, available at http://www.metallurgy.nist.gov/phase/solder/agcusn.html.
  13. Catalogue, adhesion strength, model: Loctite Ablestick SSP2020, Henkel, 2014.