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Analysis of Causes PCB Failure for Collective Protection Equipment and Improvement of Quality

집단보호장비 내의 회로카드조립체 고장 원인 분석 및 품질 향상

  • Received : 2019.02.19
  • Accepted : 2019.05.03
  • Published : 2019.05.31

Abstract

This study is the analysis of causes of printed circuit board (PCB) in collective protection equipment failure and quality improvement. The equipment is a component of the weapon system currently in operation and serves to defend against enemy chemical and biological attack as well as heating and cooling functions. However, during operation in the military, fans of condensate assembly failed to operate. The cause of the failure is the burning of PCB. It was found that the parts were heated according to the continuous cooling operation under the high temperature environmental conditions. Accordingly, the electronic components exposed to high temperature were deteriorated and destroyed. To solve this problem, PCB apply to heatsink. The performance test of improved PCB has been completed. Futhermore system compatibility, positive pressure maintenance and noise test were performed. This improvement confirmed that no faults have occurred in PCB so far. Therefore, the quality of the equipment has improved.

본 논문은 집단보호장비에 들어가는 회로카드조립체의 고장 원인 분석 및 품질 개선에 관한 연구이다. 해당 장비는 현재 운용중인 무기체계의 구성품으로 냉난방 기능뿐만 아니라, 화생 방어 역할을 한다. 그런데 군에서 운용중에 응축부조립체의 팬이 동작하지 않는 현상이 다수 발생되었다. 이에 따라 고장 원인을 분석하였고 특정 회로카드조립체가 소손됨을 확인하였다. 고온의 환경조건에서 지속적인 냉방가동에 따라 부품이 가열되고 이에 따라 고온에 노출된 전자부품이 열화되어 소손됨을 알 수 있었다. 따라서 본 논문은 이를 해결하기 위해 방열판을 적용하여 과온 동작에 의한 고장빈도를 낮추고 회로카드조립체의 수명을 연장한 품질 개선에 관한 연구이다. 개선된 회로카드조립체는 실험을 통해 방열성능을 확인하였다. 뿐만 아니라 체계 호환성 검사, 양압유지, 소음 시험, 작동시험 등을 통해 성능검사를 마쳤으며 현재 개선된 제품을 적용중이다. 이번 개선을 통해 현재까지 해당 회로카드조립체에서 발생한 고장은 없으며 해당 장비의 품질이 향상됨을 확인하였다.

Keywords

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Fig. 1. Operating Principles of Heating and Cooling Equipment

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Fig. 2. Printed Circuit Board

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Fig. 3. IGBT Combustion(a) Inside of IGBT Driver(b) Scale Up Combustion Area

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Fig. 4. IGBT Driver Manufacturer Cause Analysis

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Fig. 5. The datasheet of IGBT SKHI 71 R

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Fig. 6. Heatsink Shape A(a), Heatsink Shape B(b), Heatsink Shape C(c),

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Fig. 7. Temperature Measurement Point (a) Gate 1 (b) Gate 2 (c) Gate (d) CPU Circuit Card

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Fig. 9. Installation Eviroment of Gate 1,2

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Fig. 10. Installation Environment of Gate

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Fig. 8. (a) Data Logger GL820 (b) Temperature Measurement Environment

Table 1. The Result of Experiment

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Table 2. Temperature Condition

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Table 3. The Result of Experiment before Applying Heatsink

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Table 4. The Result of Experiment After Applying Heatsink

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References

  1. Seung-Won Wang, Yonggahp Chung, Seong-Lyong Kim, Yeoung-Min Han, "Design of Thermo-starting System for Propulsion System Test Complex", The Korean Society of Propulsion Engineers, pp.632-635, Dec 2013.
  2. Jae-Hyeong Seo, You-Ma Bang, Moo-Yeon Lee, "Investigation on the Performance of Special Purpose Automotive Air-Conditioning System Using Dual Refrigeration Cycle", Transactions of the Korean Society of Mechanical Engineers, Vol.40, No.4, pp.213-220, Apr. 2016 DOI: http://dx.doi.org/10.3795/KSME-B.2016.40.4.213
  3. Datasheet "Sevenpack IGBT and MOSFET Driver, SKHI 71 R", SEMIKRON
  4. Jung-Kyun Kim, Wataru Nakayama, Sun-Kyu Lee, "Characterization of a Thermal Interface Material with Heat Spreader", Journal of the Korean Society for Precision Engineering, Vol.27, No.1, pp.91-98, Jan. 2010. DOI: http://www.dbpia.co.kr/Article/NODE01182956
  5. Sung, Sun-Kyung, "Heat Emission Characteristics on Natural Convection Radiator with Various Aspect Ratios in Heating Space", Korea Academy Industrial Cooperation Society, Vol.11, No.1, pp.37-42, Jan. 2010. DOI: http://dx.doi.org/10.5762/KAIS.2010.11.1.037