Fig. 1. SEM images of master pattern with line widths of (a) 1 μm, (b) 2 μm (c) 5 μm wafer etched by photolithography
Fig. 2. Schematic of transfer printing process, (a) master patterns, (b) PMMA spin coating, (c) pattern transfer, (d) Pt sputtering on protruded PMMA, (e) pattern printing, and (f) after washing process.
Fig. 3. SEM images of transfer-printed Pt lines with line widths of (a) 1 μm, (b) 2 μm and (c) 5 μm.
Fig. 4. XPS analysis of (a) untreated and (b) Ar plasma treated PTFE substrate.
Fig. 5. Schematic of stacking transfer printing process (a) & (b) and SEM images of crossed-wire structures composed of two layers of Pt lines with line widths of (c) 1 μm, (d) 2 μm and (e) 5 μm.
Fig. 6. SEM images of three-dimensional structures of 1 μm wide Pt lines with multilayers of (a) 10, (b) 20 and (c) 40 layers.
Fig. 7. Cross-sectional image of three-dimensional structure with 1 μm wide Pt wires stacked 40 layers
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