DOI QR코드

DOI QR Code

Hole-Cavity 공명기술과 미세공 스테인레스칩 소결 융합 소음기의 소음성능에 관한 연구

A Study on the Noise Performance of Silencer Fused with Hole-Cavity Resonance Technology and Micro-Sphere Stainless Chip Sintering Technology

  • 투고 : 2019.01.07
  • 심사 : 2019.01.26
  • 발행 : 2019.01.31

초록

In this study, the hole-cavity resonance technology and the micro pore stainless chip sintering technology were fused to develop silencers with excellent noise attenuation performance even at fluid pressures exceeding 30 bar for the first time at home and abroad. As a result of this study, the noise attenuation performance was greatly improved as reflection, loss, and resonance were made to occur thousands of times simultaneously when fluids pass through the sintered micro pore stainless steel chip sound absorber. The noise of the gas emitted from the bomb without the silencer was shown to be 125dB. And noise test conducted after installation of the silencer showed the noise of 67dB. Given the study results, the amount of noise was greatly reduced in the sintered silencer.

키워드

참고문헌

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