The Proceeding of the Korean Institute of Electromagnetic Engineering and Science (한국전자파학회지:전자파기술)

The Korean Institute of Electromagnetic Engineering and Science (한국전자파학회)
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5G 기반 IoT 기기의 EMC 기술 동향

  • Published : 2019.01.31
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Abstract

Keywords

References

  1. R. Bruening, "Getting IoT device design right for EMC and the Interference of Things", Sep. 27, 2018. (https://blog. zuken.com/emc-iot-device-design/).
  2. B. Gorini, "EMC aspects associated to 5G networks", ETSI TC-EE/ITU-T SG5 Workshop on "Towards Setting Environmental Requirements for 5G", Nokia, 23-11-2017.
  3. Y. Qi, J. Wu, G. Gong, J. Fan, A. Orlandi, W. Yu, J. Ma, and J. L. Drewniak, "Review of the EMC aspects of internet of things", IEEE Trans. Electromagn. Compat., vol. 60, no. 5, pp. 1152-1160, Oct. 2018. https://doi.org/10.1109/TEMC.2017.2775651
  4. 송태승, "5G 이동통신 구축을 위한 EMC 요구 사항 고찰", 한국전자파학회지(전자파기술), 29(1), pp. 50-58, Jan. 2018.
  5. R. Pink, "The IoT is Changing IC Design", 23 Aug. 2018. https://electronics360.globalspec.com/article/12609/the-iotis-changing-ic-design.
  6. 삼성전자, 96단 3D 낸드 양산... 추격자 따돌린다, 한국경제신문, 2018.07.10.
  7. T. Song, Noise coupling in 3D IC, Dec. 4, 2014. http://taigonsong.org/noise-coupling-3d-ic/.
  8. K. J. Han, M. Swaminathan, and T. Bandyopadhyay, "Electromagnetic modeling of through-silicon via (TSV) interconnections using cylindrical modal basis functions", IEEE Trans. Adv. Packag., vol. 33, no. 4, pp. 804-817, Nov. 2010. https://doi.org/10.1109/TADVP.2010.2050769
  9. J. Kim, J. Cho, J. Kim, J.-M. Yook, J. C. Kim, J. Lee, K. Park, and J. S. Pak, "High-frequency scalable modeling and analysis of a differential signal through-silicon via", IEEE Trans. Compon. Packag. Manuf. Technol., vol. 4, no. 4, pp. 697-707, Apr. 2014. https://doi.org/10.1109/TCPMT.2013.2239362
  10. E. Sicard, W, Jianfei, R. J. Shen, E.-P. Li, E.-X. Liu, J. Kim, J. Cho, and M. Swaminathan, "Recent advances in electromagnetic compatibility of 3D-ICs-Part I", IEEE EMC Magazine, vol. 4, no. 4, pp. 79-89, 4th Quarter 2015.
  11. E. Sicard, W. Jianfei, R. J. Shen, E.-P. Li, E.-X. Liu, J. Kim, J. Cho, and M. Swaminathan, "Recent advances in electromagnetic compatibility of 3D-ICs-Part II", IEEE EMC Magazine, vol. 5, no. 1, pp. 65-74, 1st Quarter 2016.
  12. Component Level EMI Shielding for Semiconductor Packages, Henkel Electronic Materials, Nov. 7, 2017.
  13. K. Yamada, M. Ishida, and T. Iguchi, "Grounding design for low-cost ball grid array package with high shielding effectiveness", 2015 IEEE Int. Symp. Electromagnetic Compatibility, Dresden, Germany, pp. 16-22, Aug. 2015.
  14. K. Wiklundh, P. Stenumgaard, "EMC challenges of the Internet of things", Electronic Environment, no. 1, pp. 13-15, 2017.
  15. K. Wiklundh, P. Stenumgaard, "Massive IoT and EMC", Electronic Environment, no. 4, pp. 14-19, Dec. 2018.
  16. J. F. Mologni, J. C. Ribas, and M. A. R. Alves, "Investigation on the deployment of FSS as electromagnetic shielding for 5G devices", 2017 SBMO/IEEE MTT-S Int. Microwave and Optoelectronics Conference, Aguas de Lindoia, Brazil, pp. 27-30 Aug. 2017.
  17. D. Li, T.-W. Li, E.-P. Li, Fellow, and Y.-J. Zhang, "A 2.5-D angularly stable frequency selective surface using via-based structure for 5G EMI shielding", IEEE Trans. Electromagn. Compat., vol. 60, no. 3, pp. 768-775, Jun. 2018. https://doi.org/10.1109/TEMC.2017.2748566
  18. J. Vikstedt, "The 5G new radio - implications for EMC and antenna testing", 2018 IEEE Symposium on EMC, SI and PI, Long Beach, CA USA. Jul. 30, Aug. 3, 2018.
  19. M. Gustafsson, T. Jamsa, and M. Hogberg, "OTA methods for 5G BTS testing - Survey of potential approaches", 32nd URSI GASS, Montreal, pp. 19-26, Aug. 2017.
  20. P. Chang, mmWave OTA Fundamentals, Keysight World 2018.
  21. Laird BL652 module employing Nordic Semiconductor's nRF52832 SoC.
  22. GT-tronics's pre-certified Wi-Fi + Bluetooth 5.0 LE(WiBlue) module.