Journal of the Microelectronics and Packaging Society (마이크로전자및패키징학회지)

The Korean Microelectronics and Packaging Society (한국마이크로전자및패키징학회)
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Sensitivity Improvement of Shadow Moiré Technique Using LED Light and Deformation Measurement of Electronic Substrate

LED 광을 이용한 그림자 무아레 방법의 감도 향상 및 모바일 전자 기판의 변형 측정

  • Yang, Heeju (School of Mechanical Engineering, Chungbuk National University) ;
  • Joo, Jinwon (School of Mechanical Engineering, Chungbuk National University)
  • Received : 2019.12.18
  • Accepted : 2019.12.26
  • Published : 2019.12.30
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Abstract

Electronic substrates used in a mobile device is composed of various materials, and when the temperature is changed during manufacturing or operating, thermal deformation and stress concentration occur due to the difference in thermal expansion coefficient of each material. The shadow moiré technique is a non-contact optical method that measures shape or out-of-plane displacement over the entire area, but it is necessary to overcome the Talbot effect for high sensitivity applications. In this paper, LED light sources of various wavelengths was used to overcome the Talbot effect caused in the shadow moiré technique. By using the phase shift method, an experimental method to retain the measurement sensitivity within 10 ㎛/fringe was proposed and evaluated, and this method is applied to the thermal deformation measurement of the mobile electronic substrate. In the case of using white light, there were several areas that could not be measured due to the Talbot effect, but in the case of using blue LED light, it was shown that a precise moiré pattern with a sensitivity of 6.25 ㎛/fringe could be obtained in most areas.

모바일 기기로 사용되는 전자기판은 여러 가지 다양한 재료로 구성되어 있으며, 제조시나 사용 환경에서 온도가 변하면 각 재료의 열팽창 계수의 차이로 인하여 변형과 응력집중이 발생하게 된다. 그림자 무아레 방법은 비접촉으로 전체 영역에 걸친 면외변위를 측정하는 광학적 방법이지만 고감도 적용을 위해서는 탈봇 현상의 극복이 필요하다. 본 논문에서는 그림자 무아레 기법에서 발생하는 탈봇 현상을 극복하기 위하여 다양한 파장의 LED 광원을 이용하고, 파장의 변화가 탈봇 거리에 미치는 영향에 대해 연구하였다. 위상 이동법을 이용함으로써 10 ㎛/fringe 이내의 측정 감도를 확보할 수 있는 실험방법을 제안하고 이를 평가하였으며, 이 방법을 모바일 회로 기판의 열변형 측정에 적용하였다. 백색광을 사용한 경우에서는 탈봇 현상으로 인하여 측정이 불가능한 영역이 여러 군데 존재하였으나, 파란색 LED 광을 사용한 경우에는 대부분의 영역에서 감도 6.25 ㎛/fringe의 정밀한 무아레 무늬를 얻어낼 수 있음을 확인하였다.

Keywords

References

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